Abstract: A multilayer board insulating sheet contains a reducing agent.

Abstract: A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

Abstract: A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

Abstract: A multilayer board insulating sheet contains a reducing agent.

Abstract: A manufacturing method of electronic module components according to the present invention includes: forming a plurality of module components on a principal surface of a substrate; forming a groove by dicing between the module components; spraying a conductive paste toward the principal surface of the substrate; and separating the module components. The spraying is performed so that an angle formed between a spray direction and the principal surface is an angle ?. The angle ? is set so as to satisfy the following expression (1), assuming that a depth of the groove is D and a width of the groove is w.

Abstract: A manufacturing method of electronic module components according to the present invention includes: forming a plurality of module components on a principal surface of a substrate; forming a groove by dicing between the module components; spraying a conductive paste toward the principal surface of the substrate; and separating the module components. The spraying is performed so that an angle formed between a spray direction and the principal surface is an angle ?. The angle ? is set so as to satisfy the following expression (1), assuming that a depth of the groove is D and a width of the groove is w.

Abstract: An electromagnetic component module includes: a molding resin provided so as to cover electronic components mounted on a substrate and a surface of the substrate; and a conductive shield formed so as to further cover the molding resin. The conductive shield includes a first filler and a second filler which are different from each other and the conductive shield is connected to ground wires exposed on lateral surfaces of the substrate. The average particle diameter of the first filler is ½ or less of the thickness of the ground wires and the second filler forms a metallic bond in the temperature range of 250 degrees Celsius or lower.