Abstract: An inductor includes a first magnetic block and a second magnetic block, the first magnetic block and the second magnetic block being disposed to face each other while being separated from each other in a first direction, a coil conductor having a first conductor portion extending in a second direction, in which the first conductor portion is disposed between the first magnetic block and the second magnetic block, the first conductor portion has a first facing surface facing the first magnetic block and a second facing surface facing the second magnetic block, a first insulator is disposed between the first facing surface and the first magnetic block and between the second facing surface and the second magnetic block, and a magnetic material disposed between the first magnetic block and the second magnetic block in a region where the coil conductor and the insulator are not disposed is provided.

Abstract: The second magnetic body covers a first region surrounded by the first and second conductor portions, the first coupling portion, and a virtual line connecting the ends of the first and second conductor portions on the other side in the first direction when viewed from the third direction, the third magnetic body covers a second region surrounded by the third and fourth conductor portions, the second coupling portion, and a virtual line connecting the ends of the third and fourth conductor portions on the other side in the first direction when viewed from the third direction, a surface of the first magnetic body on the one side in the first direction is located on the other side in the first direction with respect to the first and second coupling portions, and the resin material is disposed in the first and second regions.

Abstract: A multilayer board insulating sheet contains a reducing agent.

Abstract: A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

Abstract: A printed wiring board and the like in which local deviations of characteristics of a bamse member using a liquid crystal polymer are reduced. A printed wiring board uses a liquid crystal polymer having wiring formed on at least one surface as a bamse member, in which the bamse member has a degree of crystal orientation of the liquid crystal polymer of 0.3 or less in a plane direction.

Abstract: A multilayer board insulating sheet contains a reducing agent.

Abstract: A manufacturing method of electronic module components according to the present invention includes: forming a plurality of module components on a principal surface of a substrate; forming a groove by dicing between the module components; spraying a conductive paste toward the principal surface of the substrate; and separating the module components. The spraying is performed so that an angle formed between a spray direction and the principal surface is an angle ?. The angle ? is set so as to satisfy the following expression (1), assuming that a depth of the groove is D and a width of the groove is w.

Abstract: A manufacturing method of electronic module components according to the present invention includes: forming a plurality of module components on a principal surface of a substrate; forming a groove by dicing between the module components; spraying a conductive paste toward the principal surface of the substrate; and separating the module components. The spraying is performed so that an angle formed between a spray direction and the principal surface is an angle ?. The angle ? is set so as to satisfy the following expression (1), assuming that a depth of the groove is D and a width of the groove is w.

Abstract: An electromagnetic component module includes: a molding resin provided so as to cover electronic components mounted on a substrate and a surface of the substrate; and a conductive shield formed so as to further cover the molding resin. The conductive shield includes a first filler and a second filler which are different from each other and the conductive shield is connected to ground wires exposed on lateral surfaces of the substrate. The average particle diameter of the first filler is ½ or less of the thickness of the ground wires and the second filler forms a metallic bond in the temperature range of 250 degrees Celsius or lower.