Patents by Inventor Seiko Murata

Seiko Murata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacturing device embedded substrate, and device embedded substrate
    Patent number: 9793218
    Abstract: In a method for manufacturing a device embedded substrate, a conductive via that penetrates a first insulating layer and a second insulating layer from an outer metal layer to reach a second terminal of an IC device is formed after forming the outer metal layer.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: October 17, 2017
    Assignee: MEIKO ELECTRONICS CO., LTD.
    Inventors: Mitsuaki Toda, Tohru Matsumoto, Seiko Murata
  • METHOD FOR MANUFACTURING DEVICE EMBEDDED SUBSTRATE, AND DEVICE EMBEDDED SUBSTRATE
    Publication number: 20160099215
    Abstract: In a method for manufacturing a device embedded substrate, a conductive via that penetrates a first insulating layer and a second insulating layer from an outer metal layer to reach a second terminal of an IC device is formed after forming the outer metal layer.
    Type: Application
    Filed: May 14, 2013
    Publication date: April 7, 2016
    Applicant: MEIKO ELECTRONICS CO., LTD.
    Inventors: Mitsuaki Toda, Tohru Matsumoto, Seiko Murata