Patents by Inventor Seimi Ishii

Seimi Ishii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board having through-hole stopped with photo-curable solder resist
    Patent number: 5402314
    Abstract: A printed circuit board having a through-hole in a land is disclosed. A solder resist of a photo-curable solder resist is formed on the substrate surface of the printed circuit board and the through-hole is stopped with the same photo-curable solder resist as the solder resist layer. If a land on which a chip component is mounted co-exists with a land on which a discrete component is mounted, only the through-hole in the land on which the chip component is mounted is selectively stopped with the photo-curable solder resist. The solder resist layer and the photo-curable solder resist stopping the through-hole are formed by selective light exposure from both the front and reverse surfaces of the substrate.
    Type: Grant
    Filed: February 3, 1993
    Date of Patent: March 28, 1995
    Assignee: Sony Corporation
    Inventors: Hirohisa Amago, Seimi Ishii, Nobuo Komatsu, Nobuyuki Yasuda