Patents by Inventor Seiryo Kamata

Seiryo Kamata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Photosensitive resin composition, cured product thereof, and printed wiring board
    Patent number: 9282644
    Abstract: Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent, a coloring agent that is in a complementary color relation with the perylene coloring agent, a carboxyl group-containing resin, a compound that contains two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator.
    Type: Grant
    Filed: August 27, 2014
    Date of Patent: March 8, 2016
    Assignee: TAIYO HOLDINGS CO., LTD.
    Inventors: Chiho Ueta, Seiryo Kamata
  • PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD
    Publication number: 20140360758
    Abstract: Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent, a coloring agent that is in a complementary color relation with the perylene coloring agent, a carboxyl group-containing resin, a compound that contains two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator.
    Type: Application
    Filed: August 27, 2014
    Publication date: December 11, 2014
    Applicant: TAIYO HOLDINGS CO., LTD.
    Inventors: Chiho UETA, Seiryo KAMATA
  • PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD
    Publication number: 20130048357
    Abstract: Disclosed is a photosensitive resin composition which has excellent concealing properties for appearance defects of a circuit and the like, while having excellent coloring power and resolution that enable the formation of a high-resolution solder resist layer. Specifically disclosed is a photosensitive resin composition which contains a perylene coloring agent, a coloring agent that is in a complementary color relation with the perylene coloring agent, a carboxyl group-containing resin, a compound that contains two or more ethylenically unsaturated groups in each molecule, and a photopolymerization initiator.
    Type: Application
    Filed: September 24, 2010
    Publication date: February 28, 2013
    Applicant: TAIYO HOLDINGS CO., LTD.
    Inventors: Chiho Ueta, Seiryo Kamata