Patents by Inventor Seiryo Tsuno

Seiryo Tsuno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing apparatus and polishing method
    Patent number: 8398811
    Abstract: A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310) configured to input a desired thickness of a film formed on a substrate to be polished and a storage device (308a) configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit (308b) operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate.
    Type: Grant
    Filed: August 24, 2011
    Date of Patent: March 19, 2013
    Assignee: Ebara Corporation
    Inventors: Tatsuya Sasaki, Naoshi Yamada, Yoshifumi Katsumata, Noburu Shimizu, Seiryo Tsuno, Takashi Mitsuya
  • POLISHING APPARATUS AND POLISHING METHOD
    Publication number: 20110306274
    Abstract: A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310) configured to input a desired thickness of a film formed on a substrate to be polished and a storage device (308a) configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit (308b) operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate.
    Type: Application
    Filed: August 24, 2011
    Publication date: December 15, 2011
    Inventors: Tatsuya SASAKI, Naoshi Yamada, Yoshifumi Katsumata, Noburu Shimizu, Seiryo Tsuno, Takashi Mitsuya
  • Polishing apparatus and polishing method
    Patent number: 8025759
    Abstract: A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310) configured to input a desired thickness of a film formed on a substrate to be polished and a storage device (308a) configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit (308b) operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: September 27, 2011
    Assignee: Ebara Corporation
    Inventors: Tatsuya Sasaki, Naoshi Yamada, Yoshifumi Katsumata, Noburu Shimizu, Seiryo Tsuno, Takashi Mitsuya
  • Polishing apparatus and polishing method
    Publication number: 20060166503
    Abstract: A polishing apparatus has a polishing section (302) configured to polish a substrate and a measurement section (307) configured to measure a thickness of a film formed on the substrate. The polishing apparatus also has an interface (310) configured to input a desired thickness of a film formed on a substrate to be polished and a storage device (308a) configured to store polishing rate data on at least one past substrate therein. The polishing apparatus includes an arithmetic unit (308b) operable to calculate a polishing rate and an optimal polishing time based on the polishing rate data and the desired thickness by using a weighted average method which weights the polishing rate data on a lately polished substrate.
    Type: Application
    Filed: July 1, 2004
    Publication date: July 27, 2006
    Inventors: Tatsuya Sasaki, Naoshi Yamada, Yoshifumi Katsumata, Noburu Shimizu, Seiryo Tsuno, Takashi Mitsuya