Patents by Inventor Seishi Nishioka

Seishi Nishioka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of arranging components in semiconductor device
    Patent number: 5519631
    Abstract: A method of arranging components in a semiconductor device on a substrate (11), comprising provisionally determining a wiring path (3) so that a predetermined wiring capacitance is not exceeded in a specific network (1) and then performing a wiring process of elements (12) in the specific network within a component placement region (2) determined by the wiring path.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: May 21, 1996
    Assignees: Fujitsu Limited, Fujitsu VLSI Limited
    Inventors: Seishi Nishioka, Atsuhiko Okada