Abstract: Reliable resin packages and semiconductor light-emitting devices using the resin package can include a printed circuit board including a resin layer, metallic layers formed on a top surface of the resin layer and underneath a bottom surface of the resin layer and a frame arranged from a top surface of the printed circuit board toward a bottom surface of the printed circuit board. The semiconductor light-emitting device using the resin package can prevent the printed circuit board from warping toward the frame when forming the frame incorporating the printed circuit board because a total of each thickness of the metallic layers formed on the top surface and underneath the bottom surface of the resin layer can be thicker than a thickness of the resin layer. Thus, the present invention can provide the semiconductor light-emitting devices having high reliability, which can be used as a light source for vehicle lamps, etc.

Abstract: A binding beam includes a steel form having a bottom plate portion and a pair of side plate portions extending upward from both ends of the bottom plate portion and binding beam concrete placed in a groove portion configured by the bottom plate portion and the pair of side plate portions of the steel form.

Abstract: A steel form is a steel form for forming a binding beam, including: a pair of Z-steels, wherein each of the pair of Z-steels is provided with a bottom plate portion and a side plate portion extending upward from the bottom plate portion, the bottom plate portion has a joining surface for joining the respective bottom plate portions of the pair of Z-steels to each other, and a groove portion allowing concrete placement is formed by the bottom plate portion and the side plate portion of each of the pair of Z-steels

Abstract: A binding beam includes a steel form having a bottom plate portion and a pair of side plate portions extending upward from both ends of the bottom plate portion and binding beam concrete placed in a groove portion configured by the bottom plate portion and the pair of side plate portions of the steel form.

Abstract: Reliable resin packages and semiconductor light-emitting devices using the resin package can include a printed circuit board including a resin layer, metallic layers formed on a top surface of the resin layer and underneath a bottom surface of the resin layer and a frame arranged from a top surface of the printed circuit board toward a bottom surface of the printed circuit board. The semiconductor light-emitting device using the resin package can prevent the printed circuit board from warping toward the frame when forming the frame incorporating the printed circuit board because a total of each thickness of the metallic layers formed on the top surface and underneath the bottom surface of the resin layer can be thicker than a thickness of the resin layer. Thus, the present invention can provide the semiconductor light-emitting devices having high reliability, which can be used as a light source for vehicle lamps, etc.

Abstract: The disclosed subject matter includes a surface mount electronic device with high reliability and favorable optical characteristics. The surface mount electronic device can include a circuit board with at least one conductor pattern formed on an insulating board and an electronic component that is mounted on a die bonding pad located on the at least one conductor pattern with an adhesive material. The die bonding pad can include a plurality of cutout sections that expose the insulating board and extend towards a center from a circumference thereof. Therefore, the adhesive material can adhere to both the die bonding pad and the insulating board exposed in the plurality of cutout sections along with the electronic component. In this case, the plurality of cutout sections can be formed so as not to drag the adhesive material upwards on each of the side surfaces of the electronic component.

Abstract: A surface mount LED apparatus is provided which can prevent separation of the surface of an LED chip from a sealing resin portion. Patterned circuits on a substrate are provided with a device mounting region and a wire bond region, and an increased-thickness portion having a thickness 1.6 times or more than the greater of the thickness of the device mounting region and the thickness of the wire bond region. When the apparatus is heated, this configuration allows for inducing interfacial separation between the increased-thickness portion and the sealing resin portion earlier than interfacial separation is induced between the LED chip and the sealing resin portion. This configuration can prevent interfacial separation between the LED chip and the sealing resin portion.

Abstract: The disclosed subject matter includes a surface mount electronic device with high reliability and favorable optical characteristics. The surface mount electronic device can include a circuit board with at least one conductor pattern formed on an insulating board and an electronic component that is mounted on a die bonding pad located on the at least one conductor pattern with an adhesive material. The die bonding pad can include a plurality of cutout sections that expose the insulating board and extend towards a center from a circumference thereof. Therefore, the adhesive material can adhere to both the die bonding pad and the insulating board exposed in the plurality of cutout sections along with the electronic component. In this case, the plurality of cutout sections can be formed so as not to drag the adhesive material upwards on each of the side surfaces of the electronic component.

Abstract: In a surface mount LED, circuit patterns can be formed on selective portions of the bottom and inner circumferential surfaces of a recess in a substrate in which an LED chip is mounted. A sealant material composed of a light transmissive resin can be applied to cover the LED chip for sealing. An intimate contact interface is formed between the material of the insulator/substrate which is exposed at a portion with no circuit pattern formed thereon, and the light transmissive resin. The strength of intimate contact can be enhanced to prevent the circuit patterns and conductive adhesive from peeling off at an interface therebetween.

Abstract: A surface mount LED apparatus is provided which can prevent separation of the surface of an LED chip from a sealing resin portion. Patterned circuits on a substrate are provided with a device mounting region and a wire bond region, and an increased-thickness portion having a thickness 1.6 times or more than the greater of the thickness of the device mounting region and the thickness of the wire bond region. When the apparatus is heated, this configuration allows for inducing interfacial separation between the increased-thickness portion and the sealing resin portion earlier than interfacial separation is induced between the LED chip and the sealing resin portion. This configuration can prevent interfacial separation between the LED chip and the sealing resin portion.

Abstract: In a surface mount LED, circuit patterns can be formed on selective portions of the bottom and inner circumferential surfaces of a recess in a substrate in which an LED chip is mounted. A sealant material composed of a light transmissive resin can be applied to cover the LED chip for sealing. An intimate contact interface is formed between the material of the insulator/substrate which is exposed at a portion with no circuit pattern formed thereon, and the light transmissive resin. The strength of intimate contact can be enhanced to prevent the circuit patterns and conductive adhesive from peeling off at an interface therebetween.

Abstract: An improved surface treatment system, assembly, workstation, method, and liquid for plating and the like. The assembly includes a member defining a fluid passage within the interior surface of a workpiece which is connected to a treating liquid feed channel and a treating liquid discharge channel. Desirably, the assembly includes a sealing mechanism at least partially insertable into the opening of the sealing mechanism to avoid leakage.

Abstract: A chemical treating system includes a main row or line of equally spaced, equal length chemical treatment workstations for sequentially treating a workpiece such as the cylinder bore of an internal combustion engine cylinder. Additional longer chemical treatment workstations are located transversely of the main row of workstations so that larger workstations can be included in the chemical treatment system without increasing the total length of the main row of workstations. By locating the longer workstations transversely of the main row, equal distances between the main row of workstations can be maintained by using work transfer devices that move the workpieces longitudinally along the main row and transversely to the additional chemical treatment workstations in a sequential process. At the transversely located workstation, an airblower is provided to remove residual chemical treatment solution from the workpieces before they are returned to the main line of workstations.