Patents by Inventor Seishiro Ohwaki

Seishiro Ohwaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging structure for semiconductor IC chip
    Patent number: 4262165
    Abstract: A packaging structure for a semiconductor IC chip, in which lead electrodes connected with the chip are extended out through a binding agent filled in a sealing gap, characterized in that in the vicinity of the lead electrodes the outer surface of the binding agent is recessed with respect to the outer surface of the packaging or sealing members.
    Type: Grant
    Filed: November 20, 1978
    Date of Patent: April 14, 1981
    Assignee: Hitachi, Ltd.
    Inventors: Seishiro Ohwaki, Motoharu Ogawa
  • Packaging structure for semiconductor IC chip and method of packaging the same
    Patent number: 4157611
    Abstract: A packaging structure for a semiconductor IC chip, in which lead electrodes connected with the chip are extended out through a binding agent filled in a sealing gap, characterized in that in the vicinity of the lead electrodes the outer surface of the binding agent is recessed with respect to the outer surface of the packaging or sealing members.
    Type: Grant
    Filed: March 11, 1977
    Date of Patent: June 12, 1979
    Assignee: Hitachi, Ltd.
    Inventors: Seishiro Ohwaki, Motoharu Ogawa