Abstract: A DC voltage conversion module includes a substrate, an input terminal, an output terminal, a ground terminal, a DC voltage conversion control element mounted on the substrate, a coil mounted on the substrate and connected to the DC voltage conversion control element and the output terminal, an input-side capacitor mounted on the substrate and connected to the input terminal and the ground terminal, and an output-side capacitor mounted on the substrate and connected to the output terminal and the ground terminal. The input terminal, the output terminal and the ground terminal project in a predetermined projecting direction parallel to each other. The ground terminal is arranged between the input terminal and the output terminal in a direction perpendicular to the projecting direction.

Abstract: A DC voltage conversion module includes a substrate, an input terminal, an output terminal, a ground terminal, a DC voltage conversion control element mounted on the substrate, a coil mounted on the substrate and connected to the DC voltage conversion control element and the output terminal, an input-side capacitor mounted on the substrate and connected to the input terminal and the ground terminal, and an output-side capacitor mounted on the substrate and connected to the output terminal and the ground terminal. The input terminal, the output terminal and the ground terminal project in a predetermined projecting direction parallel to each other. The ground terminal is arranged between the input terminal and the output terminal in a direction perpendicular to the projecting direction.

Abstract: A DC voltage conversion module includes a substrate, an input terminal, an output terminal, a ground terminal, a DC voltage conversion control element mounted on the substrate, a coil mounted on the substrate and connected to the DC voltage conversion control element and the output terminal, an input-side capacitor mounted on the substrate and connected to the input terminal and the ground terminal, and an output-side capacitor mounted on the substrate and connected to the output terminal and the ground terminal. The input terminal, the output terminal and the ground terminal project in a predetermined projecting direction parallel to each other. The ground terminal is arranged between the input terminal and the output terminal in a direction perpendicular to the projecting direction.

Abstract: A DC voltage conversion module includes a substrate, an input terminal, an output terminal, a ground terminal, a DC voltage conversion control element mounted on the substrate, a coil mounted on the substrate and connected to the DC voltage conversion control element and the output terminal, an input-side capacitor mounted on the substrate and connected to the input terminal and the ground terminal, and an output-side capacitor mounted on the substrate and connected to the output terminal and the ground terminal. The input terminal, the output terminal and the ground terminal project in a predetermined projecting direction parallel to each other. The ground terminal is arranged between the input terminal and the output terminal in a direction perpendicular to the projecting direction.

Abstract: A material board for producing a hybrid circuit board includes a plurality of hybrid circuit board sections 1 on each of which an electronic component 2 is mounted and a metallic terminal plate 3 for external connection is bonded so as to project from the hybrid circuit board section. A frame portion 6 is defined between the hybrid circuit board sections, and the hybrid circuit board sections are integrally connected to the frame portion via a thin strip 8 provided at an intermediate portion of grooves 7 each surrounding a respective one of the hybrid circuit board sections entirely. In bonding the terminal plate 3 to the hybrid circuit board by soldering, the terminal plate is temporarily bonded to the frame portion 6 with an adhesive 9. The adhesive is prevented from spreading toward the end of the terminal plate.

Abstract: A hybrid integrated circuit device includes: an insulating substrate (1) having a lower surface formed with wiring patterns including ends arranged along ends of the lower surface at a predetermined pitch (P); electronic components (3) mounted on the surfaces of the insulating substrate to be connected to the wiring patterns; a pair of insulating legs (2) arranged at the ends of the lower surface of the substrate (1), each insulating leg extending in parallel to the lower surface of the substrate (1); and a plurality of terminal electrodes (5) formed on each leg at the pitch and extending perpendicularly to the substrate, where the plurality of terminal electrodes are connected to the wiring patterns on the lower surface of the substrate (1). Each leg has a surface bonded to the substrate and formed with electrode films connected to the terminal electrodes.

Abstract: A hybrid integrated circuit device includes: an insulating substrate (1) having a lower surface formed with wiring patterns including ends arranged along ends of the lower surface at a predetermined pitch (P); electronic components (3) mounted on the surfaces of the insulating substrate to be connected to the wiring patterns; a pair of insulating legs (2) arranged at the ends of the lower surface of the substrate (1), each insulating leg extending in parallel to the lower surface of the substrate (1); and a plurality of terminal electrodes (5) formed on each leg at the pitch and extending perpendicularly to the substrate, where the plurality of terminal electrodes are connected to the wiring patterns on the lower surface of the substrate (1). Each leg has a surface bonded to the substrate and formed with electrode films connected to the terminal electrodes.

Abstract: A material board for producing a hybrid circuit board includes a plurality of hybrid circuit board sections 1 on each of which an electronic component 2 is mounted and a metallic terminal plate 3 for external connection is bonded so as to project from the hybrid circuit board section. A frame portion 6 is defined between the hybrid circuit board sections, and the hybrid circuit board sections are integrally connected to the frame portion via a thin strip 8 provided at an intermediate portion of grooves 7 each surrounding a respective one of the hybrid circuit board sections entirely. In bonding the terminal plate 3 to the hybrid circuit board by soldering, the terminal plate is temporarily bonded to the frame portion 6 with an adhesive 9. The adhesive is prevented from spreading toward the end of the terminal plate.