Abstract: A conductive paste containing: a conductive powder; a glass frit; an organic vehicle; and a silicon resonate sintering retardant, and a content of the silicon resinate sintering retardant is 0.005 wt % or more in terms of metal based on 100 wt % of the conductive powder.

Abstract: A bonding member that includes a resin body defining an airtight interior, and a bonding material enclosed in the interior of the resin body. The bonding material is a mixed powder that includes a plurality of particles of a first metal powder and a plurality of particles of a second metal powder. The second metal powder reacts with the first metal powder when melted to thereby produce an intermetallic compound. The resin body has a melting point higher than a softening point of the mixed powder.

Abstract: A metal paste that includes a metal component and a flux. The metal component includes a first metal powder and a second metal powder. The first metal powder is Sn. The second metal powder is a CuNi alloy. The metal paste is heated for a time t1 to a temperature T1 where the first metal powder is melted. Next, the metal paste is heated for a time t2 longer than the time t1 at a temperature T2 lower than the temperature T1 to produce an intermetallic compound from the first metal Sn and the second metal CuNi alloy.

Abstract: A bonding member that includes a base material that has a spiral shape when viewing a cross section thereof orthogonal to a longitudinal direction thereof, and contains a low melting point metal; and a coating film in a gap between opposed surfaces of the base material when the base material is in the spiral shape. The coating film contains metal particles of a high melting point metal that forms an intermetallic compound having a melting point higher than that of the low melting point metal by reaction of the high melting point metal with a melt of the low melting point metal. The low melting point metal is, for example, Sn or a Sn alloy. The high melting point metal is, for example, a Cu—Ni alloy, a Cu—Mn alloy, a Cu—Cr alloy, or a Cu—Al alloy.

Abstract: A bonding member having a container between a first foil and a second foil. The container includes metal particles having a melting point higher than a melting point of the first foil and a melting point of the second foil, a film material in which the metal particles are dispersed, and intermetallic compounds formed by a reaction between the first foil or the second foil and the metal particles. The first foil and the metal particles are bonded with the intermetallic compound interposed therebetween, and the second foil and the metal particles are bonded with the intermetallic compound interposed therebetween.

Abstract: A heat pipe that includes a pipe casing, a porous wick, and sealing members. Both end portions of the pipe casing are sealed by the sealing members, respectively. The sealing members each comprise a first metal foil and an intermetallic compound phase. The inside of the pipe casing is filled with a working fluid. The porous wick generates capillarity for the working fluid by a plurality of pores. The porous wick is provided inside the pipe casing. As a result, the pipe casing and the porous wick form a cavity extending in a longitudinal direction of the pipe casing. The porous wick comprises first metal grains, second metal grains, and an intermetallic compound phase.

Abstract: A method for manufacturing a semiconductor package by preparing a lead frame including a to-be-cut portion containing a Cu alloy; applying a joining material including Sn or a Sn alloy to the to-be-cut portion; heating the to-be-cut portion so as to react the Sn or Sn alloy and the Cu alloy so as to form an intermetallic compound having a void therein; and cutting the to-be-cut portion together with the intermetallic compound.

Abstract: A bonding member having a container between a first foil and a second foil. The container includes metal particles having a melting point higher than a melting point of the first foil and a melting point of the second foil, a film material in which the metal particles are dispersed, and intermetallic compounds formed by a reaction between the first foil or the second foil and the metal particles. The first foil and the metal particles are bonded with the intermetallic compound interposed therebetween, and the second foil and the metal particles are bonded with the intermetallic compound interposed therebetween.

Abstract: A bonding member that includes a base material that has a spiral shape when viewing a cross section thereof orthogonal to a longitudinal direction thereof, and contains a low melting point metal; and a coating film in a gap between opposed surfaces of the base material when the base material is in the spiral shape. The coating film contains metal particles of a high melting point metal that forms an intermetallic compound having a melting point higher than that of the low melting point metal by reaction of the high melting point metal with a melt of the low melting point metal. The low melting point metal is, for example, Sn or a Sn alloy. The high melting point metal is, for example, a Cu—Ni alloy, a Cu—Mn alloy, a Cu—Cr alloy, or a Cu—Al alloy.

Abstract: A heat pipe that includes a pipe casing, a porous wick, and sealing members. Both end portions of the pipe casing are sealed by the sealing members, respectively. The sealing members each comprise a first metal foil and an intermetallic compound phase. The inside of the pipe casing is filled with a working fluid. The porous wick generates capillarity for the working fluid by a plurality of pores. The porous wick is provided inside the pipe casing. As a result, the pipe casing and the porous wick form a cavity extending in a longitudinal direction of the pipe casing. The porous wick comprises first metal grains, second metal grains, and an intermetallic compound phase.

Abstract: A bonding member that includes a resin body defining an airtight interior, and a bonding material enclosed in the interior of the resin body. The bonding material is a mixed powder that includes a plurality of particles of a first metal powder and a plurality of particles of a second metal powder. The second metal powder reacts with the first metal powder when melted to thereby produce an intermetallic compound. The resin body has a melting point higher than a softening point of the mixed powder.

Abstract: A metal paste that includes a metal component and a flux. The metal component includes a first metal powder and a second metal powder. The first metal powder is Sn. The second metal powder is a CuNi alloy. The metal paste is heated for a time t1 to a temperature T1 where the first metal powder is melted. Next, the metal paste is heated for a time t2 longer than the time t1 at a temperature T2 lower than the temperature T1 to produce an intermetallic compound from the first metal Sn and the second metal CuNi alloy.

Abstract: A non-aqueous electrolyte secondary battery that has a battery element including a positive electrode member, a negative electrode member, and a non-aqueous electrolyte solution. The negative electrode member contains graphitizable carbon. With respect to 100 parts by weight of the non-aqueous electrolyte solution, fluoroethylenecarbonate is added at 0.5 parts by weight or more and 1.0 parts by weight or less, and lithium difluorobis(oxalato)phosphate is added at 0.5 parts by weight or more and 1.0 parts by weight or less, or fluoroethylenecarbonate and lithium difluorobis(oxalato)phosphate are added at 0.5 parts by weight or more and 2.0 parts by weight or less in total.

Abstract: A non-aqueous electrolyte secondary battery that has a battery element including a positive electrode member, a negative electrode member, and a non-aqueous electrolyte solution. The negative electrode member contains graphitizable carbon. With respect to 100 parts by weight of the non-aqueous electrolyte solution, fluoroethylenecarbonate is added at 0.5 parts by weight or more and 1.0 parts by weight or less, and lithium difluorobis(oxalato)phosphate is added at 0.5 parts by weight or more and 1.0 parts by weight or less, or fluoroethylenecarbonate and lithium difluorobis(oxalato)phosphate are added at 0.5 parts by weight or more and 2.0 parts by weight or less in total.