Patents by Inventor SEIYA KONAYAGI

SEIYA KONAYAGI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030045628
    Abstract: There are provided a (meth)acrylic resin composition for thermosetting type injection molding comprising a (meth)acrylic monomer (a), a (meth)acrylic polymer (b) and an inorganic filler (c), wherein the spiral flow length is in the range from 400 to 1600 mm; a method for producing the above-described (meth)acrylic resin composition which is BMC, wherein a part or all of the component (b) is used as a thickening agent; and a method for producing a (meth)acrylic resin molded article, wherein a (meth)acrylic resin composition comprising the component (a), component (b) and component (c) is subjected to thermosetting type injection molding. These are useful for producing a (meth)acrylic resin molded article excellent in properties such as appearance, heat resistance, hot water resistance, chemical resistance, dimension stability and damping property.
    Type: Application
    Filed: November 15, 1999
    Publication date: March 6, 2003
    Inventors: SEIYA KONAYAGI, YUICHIRO KISHIMOTO, AKITADA YANASE, YUUJI KAZEHAYA