Abstract: Provided are a structure having excellent shielding performance against electromagnetic waves in a frequency band of several tens of GHz, and a composition. Further, provided is a method for manufacturing a structure which makes it possible to easily manufacture a structure having excellent shielding performance against electromagnetic waves in a frequency band of several tens of GHz. The structure includes a substrate, a plurality of passive elements disposed on the substrate, and an electromagnetic wave absorbing film positioned at least in a region between the plurality of passive elements disposed on the substrate. The passive element is selected from the group consisting of an inductor and a balun. The electromagnetic wave absorbing film contains magnetic particles.

Abstract: Provided are a method for producing a laminate, which enables easy production of a laminate having a magnetic pattern that absorbs electromagnetic waves transmitted from or received by an antenna; a method for producing an antenna-in-package; a laminate having a magnetic pattern that absorbs electromagnetic waves transmitted from or received by an antenna; and a composition. The method for producing a laminate is a method for producing a laminate including a step of applying a composition containing magnetic particles and a polymerizable compound onto a substrate on which an antenna is disposed to form a composition layer, and a step of subjecting the composition layer to an exposure treatment and a development treatment to form a magnetic pattern portion, in which the magnetic pattern portion is disposed on at least a part of a periphery of the antenna while being spaced apart from the antenna on the substrate.

Abstract: Provided are a laminate which includes an organic semiconductor film, a water-soluble resin layer, and a photosensitive resin layer and in which cracks are unlikely to occur; and a kit. The laminate includes a water-soluble resin layer containing a water-soluble resin and a photosensitive resin layer containing a photosensitive resin, which are provided in this order on an organic semiconductor film. The water-soluble resin layer and the photosensitive resin layer are adjacent to each other, the water-soluble resin is at least one of polyvinylpyrrolidone having a weight-average molecular weight of 300,000 or greater or polyvinyl alcohol having a weight-average molecular weight of 15,000 or greater, and the photosensitive resin has a weight-average molecular weight of 30,000 or greater.

Abstract: Provided are a laminate which includes an organic semiconductor film, a water-soluble resin layer, and a photosensitive resin layer and in which cracks are unlikely to occur; and a kit. The laminate includes a water-soluble resin layer containing a water-soluble resin and a photosensitive resin layer containing a photosensitive resin, which are provided in this order on an organic semiconductor film. The water-soluble resin layer and the photosensitive resin layer are adjacent to each other, the water-soluble resin is at least one of polyvinylpyrrolidone having a weight-average molecular weight of 300,000 or greater or polyvinyl alcohol having a weight-average molecular weight of 15,000 or greater, and the photosensitive resin has a weight-average molecular weight of 30,000 or greater.

Abstract: Provided are a laminate which includes an organic semiconductor film, a water-soluble resin layer, and a photosensitive resin layer and in which cracks are unlikely to occur; and a kit. The laminate includes a water-soluble resin layer containing a water-soluble resin and a photosensitive resin layer containing a photosensitive resin, which are provided in this order on an organic semiconductor film. The water-soluble resin layer and the photosensitive resin layer are adjacent to each other, the water-soluble resin is at least one of polyvinylpyrrolidone having a weight-average molecular weight of 300,000 or greater or polyvinyl alcohol having a weight-average molecular weight of 15,000 or greater, and the photosensitive resin has a weight-average molecular weight of 30,000 or greater.

Abstract: A radiation-sensitive composition comprising:an acid-generating compound capable of generating an acid upon exposure to radiation and represented by the formula (I): ##STR1## wherein X, Y and R.sup.1 to R.sup.5 have the following meanings: X and Y: independently a direct bond, C.sub.1 -C.sub.8 alkylene, C.sub.1 -C.sub.4 alkene, --O--R.sup.11 --O-- (wherein R.sup.11 is an alkylene group having 1 to 4 carbon atoms), --NH--, --O--, --S--, --SO.sub.2 --, --CO--, --COO-- or --CONR.sup.12 -- (wherein R.sup.12 is a hydrogen atom, C.sub.1 -C.sub.8 alkyl, alkylaryl, halogenated alkyl, halogenated aryl, a halogen atom, alkoxy, phenoxy, alkylsulfonyl-oxy, halogenated alkylsulfonyl-oxy, or substituted or unsubstituted arylsulfonyl-oxy);R.sup.1 to R.sup.4 : a hydrogen atom, C.sub.1 -C.sub.

Abstract: Acid-labile group protected hydroxystyrene polymers having recurrent pendant groups such as 1-(2-methanecarbonyl oxyethoxy)ethoxy group and 1-(2-N-methylcarbamatoethoxy) ethoxy group. A resist containing the polymer, a photo acid generator, a base, additives and a solvent is sensitive to UV, electron beam and X-ray. In the resist, acid is formed in the exposed area during irradiation, which deprotects acid-labile group catalytically during application of post-exposure baking. Positive patterns are formed after development using an alkaline solution.

Abstract: A radiation-sensitive composition is disclosed which includes (a) a binder insoluble in water but soluble in or capable of being swelled in an aqueous alkali solution, (b) a dissolution inhibitor composed of (b1) a poly(N,O-acetal) having a general formula: ##STR1## wherein R.sup.3 is alkyl or substituted or unsubstituted aryl, R.sup.4 is a divalent group selected from alkylene, cycloalkylene, alkene or alkyne, R.sup.5 is alkyl, alkene, alkyne or cycloalkyl, X is --OCO--, --CO-- or --NHCO--, and p is a number not less than 1, and/or (b2) a phenol compound having a hydroxyl group which is protected by a group which can be cleaved in the presence of an acid, (c) a photosensitive compound capable of generating an acid when exposed to an active radiation, (d) a base capable of being decomposed when exposed to an active radiation to form a neutral compound derived therefrom, (e) a plasticizer, and (f) a solvent.

Abstract: A process for producing a solution of a basic or non-basic sulfonium compound (A) of formulae II-V: ##STR1## wherein R.sup.5, R.sup.6 and R.sup.7 each independently represent a C.sub.1 -C.sub.18 alkyl, aryl or heteroaryl group or an aryl group mono-, di- or tri-substituted with an alkyl, an alkylaryl, an aryl, a halogen, an alkoxy, a phenoxy, a thiophenol, a phenylsulfonyl or a phenylsulphenyl;Y represents (CH.sub.2).sub.n (wherein n is 0 or 1), O or S;R.sup.8 and R.sup.9 represent a C.sub.1 -C.sub.4 alkyl, alkoxy or a halogen;R.sup.10 and R.sup.11 represent a C.sub.1 -C.sub.4 alkyl, alkoxy or a halogen;n is 5 or 6; andX.sub.2.sup.- represents a basic anion having a pK.sub.B value of -3 to +5; comprising the steps of:(a) dissolving a sulfonium salt (B) in a metal-ion free polar or non-polar solvent to form a solution, said sulfonium salt (B) being selected from said formulae II-V, wherein R.sup.5 to R.sup.11, Y and n of said sulfonium salt (B) have the sane meaning as above and X.sub.2.sup.

Abstract: A chemically amplified resist material comprising: a) a homopolymer or a copolymer of hydroxystyrene or hydroxystyrene partly protected by a group sensitive to an acid such as a tetrahydropyranyl or t-butoxycarbonyl group, b) a dissolution inhibitor such as poly(N,O-acetal) or phenol or bisphenol protected by a group cleavable with an acid, c) a photosensitive compound capable of generating an acid upon exposure, d) a base capable of degrading upon radiation to regulate the line width in a period between the exposure step and the processing steps after exposure, e) a low-molecular weight phenolic or polyphenolic compound having a structure represented by the following general formula or a mixture of the phenolic or polyphenolic compounds: ##STR1## where n is an integer of 1 to 5, m is an integer of 0 to 4, n+m.ltoreq.5, and p is an integer of 1 to 10, each R is a C.sub.1 -C.sub.12 alkyl group or an unsubstituted or substituted cycloalkyl group or a C.sub.1 -C.sub.

Abstract: A material for the formation of a pattern is provided which has a wide exposure latitude and is less liable to cause a dimensional change of a pattern with a change in exposure. The material comprises (A) a compound having a capability of producing an acid upon irradiation with an active beam, (B) a compound capable of producing a base or increasing its basicity, (C) a compound having at least one bond clearable with an acid and/or (D) a compound insoluble in water but soluble in an aqueous alkaline solution.

Abstract: A radiation-sensitive mixture for use in the production of semiconductor elements, which has high sensitivity and high resolution, which can be developed by an aqueous alkaline solution, and which is based on a novel concept in that a stable acid latent image is controlled by using a radiation-decomposable base.The mixture is characterized by comprising as essential components a) a binder which is insoluble in water but soluble in an aqueous alkaline solution; b.sup.1) a compound having at least one bond which can be cleaved by an acid, or b.sup.2) a compound having at least one bond which is crosslinked with the compound a) by an acid; c) a compound which generates an acid when irradiated; and d) a basic iodonium compound.

Abstract: A colored, photosensitive resin composition of a pigment dispersing-type is disclosed.The colored, photosensitive resin composition is characterized by containing (a) a polymer having alcohlic or phenolic hydroxyl groups, (b) a compound capable of producing a nitrene when irradiated with an actinic radiation, (c) a pigment, and (d) a solvent. Preferably, the composition further contains (e) a heat crosslinking agent and/or (f) a compound having a polymerizable double bond in addition to the above ingredients.According to the present invention, the production of a color filter need not be performed in an inert gas atmosphere, does not require an oxygen barrier film and does not require heating during the period of from the exposure step to the development step. Thus, the use of the composition permits the color filter production steps to be made significantly simple so that the composition provides a great value in industrial utilization.

Abstract: A chemically amplified radiation sensitive composition comprising: (a) a copolymer such as poly(4-hydroxystyrene-co-styrene), (b) a dissolution inhibitor such as polyacetal or (b') a crosslinking agent, (c) a radiation sensitive compound capable of generating an acid upon exposure to actinic radiation, (d) a radiation sensitive base capable of stabilizing the width of lines throughout steps from exposure to post-exposure bake treatment, and (e) a solvent for dissolving the components (a) to (d), can realize fine lines and spaces down to 0.22 microns, for example, using KrF laser, and possesses excellent heat and etch resistance and adhesiveness to substrates, and produces patterns with low standing waves arising due to substrate reflectiveness of exposed light.

Abstract: A novel positive-working radiation-sensitive mixture having a high sensitivity to radiation in a short-wavelength UV region is provided which can be developed in an aqueous alkaline solution, has a stable acid latent image and is used for the production of a semiconductor. The mixture comprises, as indispensable components, a) a binder insoluble in water but soluble in an aqueous alkaline solution, b) a compound having at least one bond cleavable with an acid, c) a compound capable of producing an acid upon radiation, and d.sub.1) a basic ammonium compound or d.sub.2) a basic sulfonium compound.