Abstract: An imprint lithography apparatus uses a mold having a pattern formed thereon and transfers the pattern to an imprint material fed to a substrate. The apparatus includes a light-receiving element; a detection system that irradiates a mark formed on the substrate and a mark formed on the mold with light which is reflected therefrom, and guides the light reflected from the mark formed on the substrate and from the mark formed on the mold to the light-receiving element; a relay optical system that causes the light reflected to focus between the mold and the detection system; an illumination system that emits illumination light for curing the imprint material; an optical element having a surface that transmits one of the illumination light and the light from the detection system and reflects the other; and a plate-shaped optical member that corrects aberration of the relay optical system.

Abstract: An imprint apparatus, which is configured to transfer a pattern to an imprint material supplied on a substrate by using a mold having the pattern formed thereon, includes a light-receiving element, a detection system configured to illuminate a mark formed on the substrate and a mark formed on the mold, and guide light reflected from the mark formed on the substrate and the mark formed on the mold to the light-receiving element, and a relay optical system. The relay optical system is configured to form images of the light reflected from the mark formed on the substrate and the mark formed on the mold between the relay optical system and the detection system. The detection system is configured to guide the light image-formed by the relay optical system to the light-receiving element.

Abstract: The present invention provides a forming method of forming a through electrode, in a second substrate joined on a first substrate having an electrode pad, to electrically connect a pattern to be formed on the second substrate to the electrode pad, the method comprising steps of detecting a position of a first mark formed on the first substrate and a position of a second mark formed on the second substrate in a state in which the first substrate and the second substrate are joined, determining, based on the position of the first mark and the position of the second mark detected in the detecting, a point to form the through electrode in the second substrate so as to electrically connect the pattern to the electrode pad, and forming the through electrode at the determined point.

Abstract: An imprint apparatus, which is configured to transfer a pattern to an imprint material supplied on a substrate by using a mold having the pattern formed thereon, includes a light-receiving element, a detection system configured to illuminate a mark formed on the substrate and a mark formed on the mold, and guide light reflected from the mark formed on the substrate and the mark formed on the mold to the light-receiving element, and a relay optical system. The relay optical system is configured to form images of the light reflected from the mark formed on the substrate and the mark formed on the mold between the relay optical system and the detection system. The detection system is configured to guide the light image-formed by the relay optical system to the light-receiving element.

Abstract: An imprint apparatus, which is configured to transfer a pattern to an imprint material supplied on a substrate by using a mold having the pattern formed thereon, includes a light-receiving element, a detection system configured to illuminate a mark formed on the substrate and a mark formed on the mold, and guide light reflected from the mark formed on the substrate and the mark formed on the mold to the light-receiving element, and a relay optical system. The relay optical system is configured to form images of the light reflected from the mark formed on the substrate and the mark formed on the mold between the relay optical system and the detection system. The detection system is configured to guide the light image-formed by the relay optical system to the light-receiving element.

Abstract: The present invention provides a forming method of forming a through electrode, in a second substrate joined on a first substrate having an electrode pad, to electrically connect a pattern to be formed on the second substrate to the electrode pad, the method comprising steps of detecting a position of a first mark formed on the first substrate and a position of a second mark formed on the second substrate in a state in which the first substrate and the second substrate are joined, determining, based on the position of the first mark and the position of the second mark detected in the detecting, a point to form the through electrode in the second substrate so as to electrically connect the pattern to the electrode pad, and forming the through electrode at the determined point.

Abstract: An imprint apparatus, which is configured to transfer a pattern to an imprint material supplied on a substrate by using a mold having the pattern formed thereon, includes a light-receiving element, a detection system configured to illuminate a mark formed on the substrate and a mark formed on the mold, and guide light reflected from the mark formed on the substrate and the mark formed on the mold to the light-receiving element, and a relay optical system. The relay optical system is configured to form images of the light reflected from the mark formed on the substrate and the mark formed on the mold between the relay optical system and the detection system. The detection system is configured to guide the light image-formed by the relay optical system to the light-receiving element.

Abstract: An exposure apparatus includes an image sensor, a measurement optical system configured to guide measurement light to obliquely enter the projection optical system, and further, to guide the measurement light returned from the projection optical system to the image sensor, and a control unit configured to calculate surface position information of the substrate based on the output from the image sensor. The control unit calculates the surface position information of the substrate based on an interval between the image, of a mark arranged on the original stage, formed by the measurement light, which has passed through the mark, and the image of the mark formed by the measurement light reflected by the mark.

Abstract: An exposure apparatus including an illumination optical system to illuminate an original with exposure light of plural wavelengths, a projection optical system to project an image of a pattern of the original onto a substrate, an original-side reference pattern provided at an original side of the projection optical system, a substrate-side reference pattern provided at a substrate side of the projection optical system, and an image plane detecting system configured so that the original-side reference pattern is illuminated with the exposure light or light equivalent to the exposure light with respect to a wavelength component rate.

Abstract: The invention disclosed herein concerns technology that ensures, in a projection exposure process using a transmission type reticle, exposure with an even finish size throughout the entire exposure region, without adverse influence of external disturbance light such as back-surface reflection, for example.

Abstract: An exposure apparatus is disclosed. The apparatus comprises an image sensor, a measurement optical system configured to guide measurement light to obliquely enter the projection optical system, and further guide the measurement light returned from the projection optical system to the image sensor, and a control unit configured to calculate surface position information of the substrate based on the output from the image sensor. The control unit calculates the surface position information of the substrate based on an interval between the image, of a mark arranged on the original stage, formed by the measurement light which has passed through the mark and the image of the mark formed by the measurement light reflected by the mark.

Abstract: An exposure apparatus includes an illumination optical system to illuminate an original with exposure light of plural wavelengths, a projection optical system to project an image of a pattern of the original onto a substrate, an original-side reference pattern provided at an original side of the projection optical system, a substrate-side reference pattern provided at a substrate side of the projection optical system, and an image plane detecting system configured so that the original-side reference pattern is illuminated with the exposure light or light equivalent to the exposure light with respect to a wavelength component rate.

Abstract: An exposure method for an exposure apparatus that exposes a mask pattern onto a plate using a projection optical system includes the steps of obtaining information about flatness of a first mask, condition of an image plane when projecting a pattern of the first mask by using the projection optical system, information about a driving amount of a driving system, which can change an imaging condition on the plate based on the condition of the image plane, and information about flatness of a second mask, changing information about the driving amount by using information about flatness of the first and second masks, and driving the driving system based on changed information about the driving amount of the driving system to project a pattern of the second mask onto the plate using the projection optical system.

Abstract: An exposure apparatus includes a projection optical system for projecting a pattern on a reticle mounted on a first stage onto an object mounted on a second stage, a first reference plate provided on the reticle or a surface equivalent to the reticle, the first reference plate having three or more first reference marks each of which serves as a reference for an alignment between the reticle and the object, a measuring unit for measuring focus position at imaging positions of the first reference marks and for measuring an image surface of the projection optical system, and a correcting unit for correcting a relationship between the image surface and a reference surface as a reference of a measurement by the measuring unit.

Abstract: An exposure method for an exposure apparatus that exposes a mask pattern onto a plate using a projection optical system includes the steps of obtaining information about flatness of a first mask, condition of an image plane when projecting a pattern of the first mask by using the projection optical system, information about a driving amount of a driving system, which can change an imaging condition on the plate based on the condition of the image plane, and information about flatness of a second mask, changing information about the driving amount by using information about flatness of the first and second masks, and driving the driving system based on changed information about the driving amount of the driving system to project a pattern of the second mask onto the plate using the projection optical system.

Abstract: To provide an exposure apparatus with which a wafer surface to be exposed can be aligned with a best imaging plane with respect to a reduced focal depth and a high resolution can be attained. The exposure apparatus for exposing a pattern formed on a reticle to an object to be exposed includes: a detecting unit for measuring a position of the object to be exposed at a plurality of first measurement positions that meet a predetermined relative positional relationship in an exposure region of the object to be exposed to which the pattern is exposed and for measuring a position of the object to be exposed at a plurality of second measurement positions that meet the predetermined relative positional relationship in regions outside the exposure region; and a control unit for controlling at least one of a position, a height, and a tilt of the object to be exposed based on information on the position of the object to be exposed which is measured by the detecting unit.

Abstract: A position detecting system including a detecting system for detecting positions, at different points on a surface of a reticle having a predetermined pattern formed thereon, with respect to a direction substantially perpendicular to the reticle surface, wherein the detecting system includes a light projecting portion for directing light from a light source to the reticle surface and a light receiving portion for receiving reflection light from the reticle surface, and wherein the angle of incidence of light from the light projecting portion, being incident on the reticle surface, is not less than 45 degrees.

Abstract: An exposure apparatus includes a projection optical system for projecting a pattern on a reticle mounted on a first stage onto an object mounted on a second stage, a first reference plate provided on the reticle or a surface equivalent to the reticle, the first reference plate having three or more first reference marks each of which serves as a reference for an alignment between the reticle and the object, a measuring unit for measuring focus position at imaging positions of the first reference marks and for measuring an image surface of the projection optical system, and a correcting unit for correcting a relationship between the image surface and a reference surface as a reference of a measurement by the measuring unit.

Abstract: The invention disclosed herein concerns technology that ensures, in a projection exposure process using a transmission type reticle, exposure with an even finish size throughout the entire exposure region, without adverse influence of external disturbance light such as back-surface reflection, for example.

Abstract: To provide an exposure apparatus with which a wafer surface to be exposed can be aligned with a best imaging plane with respect to a reduced focal depth and a high resolution can be attained. The exposure apparatus for exposing a pattern formed on a reticle to an object to be exposed includes: a detecting unit for measuring a position of the object to be exposed at a plurality of first measurement positions that meet a predetermined relative positional relationship in an exposure region of the object to be exposed to which the pattern is exposed and for measuring a position of the object to be exposed at a plurality of second measurement positions that meet the predetermined relative positional relationship in regions outside the exposure region; and a control unit for controlling at least one of a position, a height, and a tilt of the object to be exposed based on information on the position of the object to be exposed which is measured by the detecting unit.