Abstract: A technique for stable, high-speed treatment of reinforcement fiber. In a state where a unidirectional fiber bundle is held between a supporting surface of a support and a pressing surface of a resonator ultrasonically vibrating in a pressing direction perpendicular to the supporting surface, a pressed part of the unidirectional fiber bundle pressed by the pressing surface is moved in a longitudinal direction of the unidirectional fiber bundle. By doing so, the unidirectional fiber bundle can be stably treated at high speed when the unidirectional fiber bundle is opened or impregnated with a resin.

Abstract: A compact pressing body with a pressing surface smaller in area than a welding range welds together sheet-like members over the whole area of the welding range by pressing the sheet-like members being reliably moved in a direction substantially orthogonal to a pressing direction of the pressing body.

Abstract: A technique for stable, high-speed treatment of reinforcement fiber. In a state where a unidirectional fiber bundle is held between a supporting surface of a support and a pressing surface of a resonator ultrasonically vibrating in a pressing direction perpendicular to the supporting surface, a pressed part of the unidirectional fiber bundle pressed by the pressing surface is moved in a longitudinal direction of the unidirectional fiber bundle. By doing so, the unidirectional fiber bundle can be stably treated at high speed when the unidirectional fiber bundle is opened or impregnated with a resin.

Abstract: A compact pressing body with a pressing surface smaller in area than a welding range welds together sheet-like members over the whole area of the welding range by pressing the sheet-like members being reliably moved in a direction substantially orthogonal to a pressing direction of the pressing body.

Abstract: The purpose of the invention is to provide a mounting apparatus that can mount a part such as a chip, etc. on a substrate effectively and precisely. A wafer is placed on the upper surface of turntable, which has opening section, and a backup section and a head section that hold a chip are lifted up and lowered respectively, at opening section. The wafer and the chip are contacted, pinched and held locally, and then they are heat-bonded. After that, the backup section and the head section are removed. Lift arms equipped on a holding table are inserted between the wafer and turntable, the wafer is lifted up, and opening section is moved relative to the wafer when turntable is rotated. The wafer is placed on turntable again and the bonding process is performed.

Abstract: Provided is a technique which can prevent abnormal vibrations from occurring on a resonator and apply, to a putting edge, vibrations with the magnitude of amplitude thereof adjusted in the direction of width of the edge, thereby cutting an object of interest with high accuracy. The resonator (21) with a grip portion grasped with clamp means (28) is supported by a support means (24), thereby preventing abnormal vibrations from occurring on the resonator (21). The resonator (21) has at least one elongated hole (26b) defined through a side thereof, thus allowing for adjusting the amplitude magnitude of vibrations in the direction of width of the cutting edge (23) on one end of the resonator (21). This enables vibrations with the amplitude of an adjusted magnitude in the direction of width to be applied to the cutting edge (23). Accordingly, the cutting edge (23) which is adequately vibrated can be used to cut the object of interest with high accuracy.

Abstract: The purpose of this invention is to provide a support device for a resonator that can support the resonator at an optional location, can let the resonator vibrate with a specified vibration consistently, and can apply an ultrasonic vibration to objects efficiently. By inserting first clamping means and second clamping means, which comprise supporting member at least at each contacting portion, into first portion-to-be-supported and second portion-to-be-supported of resonator, the resonator is supported. As substances of the supporting member, substances that have a logarithmic decrement higher than 0.01 and lower than 1.0 and/or a sound propagation speed of more than 5900 m/s are suitable.

Abstract: The purpose of the invention is to provide a mounting apparatus that can mount a part such as a chip, etc. on a substrate effectively and precisely. A wafer is placed on the upper surface of turntable, which has opening section, and a backup section and a head section that hold a chip are lifted up and lowered respectively, at opening section. The wafer and the chip are contacted, pinched and held locally, and then they are heat-bonded. After that, the backup section and the head section are removed. Lift arms equipped on a holding table are inserted between the wafer and turntable, the wafer is lifted up, and opening section is moved relative to the wafer when turntable is rotated. The wafer is placed on turntable again and the bonding process is performed.

Abstract: The purpose of this invention is to provide a support device for a resonator that can support the resonator at an optional location, can let the resonator vibrate with a specified vibration consistently, and can apply an ultrasonic vibration to objects efficiently. By inserting first clamping means and second clamping means, which comprise supporting member at least at each contacting portion, into first portion-to-be-supported and second portion-to-be-supported of resonator, the resonator is supported. As substances of the supporting member, substances that have a logarithmic decrement higher than 0.01 and lower than 1.0 and/or a sound propagation speed of more than 5900 m/s are suitable.

Abstract: After the fixing of an angle indexing body to a holder by fixtures is canceled by loosening the fixtures, a resonator is turned by operating the angle indexing body with an axis in a vibration transmission direction as the center of rotation, a bonding work face is replaced by another bonding work face, and the angle indexing body is fixed to the holder by the fixtures so that the new bonding work face becomes parallel to the top face of a mounting table. Therefore, the replacement of the bonding work face can be simplified. Since overlapped workpieces are sandwiched between the bonding work face of the resonator and the mounting table, the mounting table makes a follow-up movement by a bearing composed of a spherical projection portion and a spherical depression portion to ensure that the bonding work face becomes parallel to the top face of the mounting table, thereby making it possible to optimize the position of the sandwiched workpieces.

Abstract: After the fixing of an angle indexing body to a holder by fixtures is canceled by loosening the fixtures, a resonator is turned by operating the angle indexing body with an axis in a vibration transmission direction as the center of rotation, a bonding work face is replaced by another bonding work face, and the angle indexing body is fixed to the holder by the fixtures so that the new bonding work face becomes parallel to the top face of a mounting table. Therefore, the replacement of the bonding work face can be simplified. Since overlapped workpieces are sandwiched between the bonding work face of the resonator and the mounting table, the mounting table makes a follow-up movement by a bearing composed of a spherical projection portion and a spherical depression portion to ensure that the bonding work face becomes parallel to the top face of the mounting table, thereby making it possible to optimize the position of the sandwiched workpieces.

Abstract: An ultrasonic vibration bonding machine which enables appropriate bonding by selecting a pressure curve according to the sizes of portions to be bonded together and the physical properties of their materials and the like. Pressure inside the pressure chamber of an air cylinder which is a pressure control unit for bonding work and the normal rotation and reverse rotation of a motor which constitutes part of a vertical drive unit for bonding work are controlled to bond together a first member and a second member with ultrasonic vibration under pressure which rises from a first pressure set value to a second pressure value from a vibration start time.

Abstract: An ultrasonic vibration bonding tool comprising a square bar-like horn body, bonding working portions projecting from the upper and lower surfaces of the horn body at the central maximum vibration amplitude point, and crooked support portions projecting from front and rear surfaces of the horn body at the two minimum vibration amplitude points which are separate the same distance from the bonding working portions on both sides. Proper bonding can be carried out with this ultrasonic vibration bonding tool.

Abstract: An ultrasonic vibration bonding machine which can simplify a suction passage structure. A resonator has a suction passage at the maximum vibration amplitude point where a bonding working portion is provided, the positions of the pads of a circuit board mounted on a mounting unit and the positions of the pads of a semiconductor chip absorbed and adsorbed to the bonding working portion are measured to align the pads accurately, and then the pads are bonded together.

Abstract: A resonator for an ultrasonic bonding apparatus, which comprises an ultrasonic horn having a recessed portion in the exterior surface and a threaded hole, a bonding working portion having a chip base fitted in the recessed portion and a chip body provided on the chip base, and a screw member having a screw portion to fit into the threaded hole and a through-hole through which the chip body is put without contact with said screw member so that the screw member is screwed into the threaded hole, the bonding portion is fixed to the ultrasonic horn, with the chip body projecting through the through-hole for contact with a workpiece.

Abstract: An ultrasonic vibration bonding chip mounter includes a chip carrying unit arranged above a chip supply unit, a prealignment unit and a mounting unit which are arranged in a row and having a movable table which can move back and forth in a direction parallel to a direction where these units are arranged, a pick-up unit, attached to the movable table, for transferring a chip from the chip supply unit to the prealignment unit, and an ultrasonic vibration bonding unit, attached to the movable table, for transferring the chip from the prealignment unit to a mounting unit so that the chips are transferred from the chip supply unit to the prealignment unit and further to the mounting unit by the reciprocation of the movable table one by one.

Abstract: First and second boosters are attached to a holder in the following manner to prevent a portion between the first and second boosters from being curved. The outer side surface of a projecting portion on the outer peripheral surface of a second booster is pressed toward the inward of the holder by a stopper attached to the holder so that a stepped portion formed in the interior surface of the holder is pressed by the projecting portion through a bridge member and a projecting portion on the outer peripheral surface of the first booster.

Abstract: To stabilize bonding strength by concentrating bonding energy upon members to be bonded together, when an overlapped interface of a plurality of members to be bonded together is to be bonded by ultrasonic vibration, heaters 6 and 7 are caused to generate heat to heat the bonding working portion 3d of a resonator 2, whereby bonding energy generated by ultrasonic vibration and bonding energy generated by heating are provided to the interface so that bonding energy can be concentrated upon the interface without increasing the energy of ultrasonic vibration and bonding strength can be stabilized. Further, when electric heaters are used as the heaters 6 and 7, operationability is improved. Moreover, when heater holes 3e and 3f are formed in the resonator 2 and electric heaters are fitted into the holes 3e and 3f, heater installation work is facilitated. The heater may be provided in the mount.