Patents by Inventor Seiya Nakarai

Seiya Nakarai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240038561
    Abstract: A substrate storage container includes a container body configured to store a substrate, a lid that closes the opening of the container body, a retainer that is attached to the lid, and a substrate support portion formed in the retainer. The substrate support portion has an arc shape in a cross-sectional view from the top-to-bottom direction perpendicular to the closing direction of the lid. The substrate support portion includes a pair of left and right substrate support portions configured to hold the substrate together with the container body to retain the substrate.
    Type: Application
    Filed: October 5, 2023
    Publication date: February 1, 2024
    Inventors: Osamu Ogawa, Seiya Nakarai
  • Publication number: 20230245907
    Abstract: A storage container with improved strength and airtightness, and a method for manufacturing the storage container are provided. The storage container includes, as a functional resin member, an insert component for a container body insert-molded with a molding material containing predetermined resin. The functional resin member is a side wall plate with support pieces. The side wall plate has a thick portion having at least a thickness of a side wall of the container body, and a thin joint portion formed around the thick portion, to be interposed into and joined to a peripheral wall of the container body. Most of the peripheral wall and the thin joint portion are engaged and joined to enlarge their contact area to eliminate a decrease of the mechanical strength and leakage around the peripheral edge of the side wall plate and prevent the peripheral wall from parting from the side wall plate.
    Type: Application
    Filed: July 1, 2021
    Publication date: August 3, 2023
    Applicant: Shin-Etsu Polymer Co., Ltd.
    Inventors: Seiya Nakarai, Osamu Ogawa, Kiminori Tominaga, Shinichi Ohori, Tadahiko Ishizawa