Patents by Inventor Seiya Sugawara

Seiya Sugawara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240044822
    Abstract: A method of evaluating central segregation in steel with excellent correlation with HIC susceptibility is provided. A method of evaluating central segregation in steel includes: taking a sample from a steel, the sample having a cross section including a central segregation area; measuring an area ratio of an inclusion containing a segregation metal element in a region to be measured including the central segregation area in the cross section; and evaluating central segregation in the steel based on the area ratio measured.
    Type: Application
    Filed: September 6, 2021
    Publication date: February 8, 2024
    Applicant: JFE STEEL CORPORATION
    Inventors: Tomoharu ISHIDA, Seiya SUGAWARA, Kenji TSUZUMI
  • Publication number: 20230003624
    Abstract: A precipitate and/or an inclusion in a metal material is extracted by electrolysis using an electrolyte solution. The electrolyte solution contains an adsorbent that is adsorbed to a surface of the precipitate and/or a surface of the inclusion. The extracted precipitate and/or the inclusion can be quantitatively analyzed with high accuracy.
    Type: Application
    Filed: November 18, 2020
    Publication date: January 5, 2023
    Inventors: Seiya Sugawara, Michitoshi Saeki, Manabu Watanabe
  • Publication number: 20220411947
    Abstract: A precipitate and/or an inclusion in a metal material are extracted by electrolysis using an electrolyte solution. The electrolyte solution contains an adsorbent physically adsorbed and/or chemically adsorbed to any metal other than a matrix metal of the metal material. The extracted precipitate and/or inclusion can be quantitatively analyzed with high accuracy.
    Type: Application
    Filed: November 18, 2020
    Publication date: December 29, 2022
    Inventor: Seiya Sugawara