Patents by Inventor SEIYA TSUZAKI

SEIYA TSUZAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11877045
    Abstract: To suppress a reduction in yield and to reduce production costs even when a failure has occurred with respect to the alignment and the like of a camera module in a multi-ocular configuration in which a plurality of camera modules is included. An image-capturing apparatus includes a plurality of camera modules; and a support member used to support the plurality of camera modules in a specified positional relationship, the image-capturing apparatus including a first camera module and at least one second camera module as the plurality of camera modules, the first camera module being fixed to the support member, the at least one second camera module being fixed to the support member using an adhesive portion formed of an adhesive that has a property of being released in a specific temperature range.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: January 16, 2024
    Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
    Inventors: Seiya Tsuzaki, Yasuhiro Hosokawa, Yoichiro Fujinaga
  • Publication number: 20210152717
    Abstract: To suppress a reduction in yield and to reduce production costs even when a failure has occurred with respect to the alignment and the like of a camera module in a multi-ocular configuration in which a plurality of camera modules is included. An image-capturing apparatus includes a plurality of camera modules; and a support member used to support the plurality of camera modules in a specified positional relationship, the image-capturing apparatus including a first camera module and at least one second camera module as the plurality of camera modules, the first camera module being fixed to the support member, the at least one second camera module being fixed to the support member using an adhesive portion formed of an adhesive that has a property of being released in a specific temperature range.
    Type: Application
    Filed: February 5, 2019
    Publication date: May 20, 2021
    Inventors: SEIYA TSUZAKI, YASUHIRO HOSOKAWA, YOICHIRO FUJINAGA
  • Patent number: 10915009
    Abstract: The present technology relates to a compound-eye camera module and an electronic device in which a plurality of monocular camera modules can be fixed together by a connecting member more effectively. In the compound-eye camera module, a camera-side positioning portion for positioning formed on a camera-side reference surface of each of the monocular camera modules and a member-side positioning portion for positioning formed on a member-side reference surface of the connecting member are fitted together, to connect the plurality of monocular camera modules together, whereby the plurality of monocular camera modules can be fixed together by the connecting member more effectively. The present technology can be applied to, for example, a compound-eye camera module in which a plurality of CMOS image sensors is connected together.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: February 9, 2021
    Assignee: SONY CORPORATION
    Inventors: Junichi Tokunaga, Seiya Tsuzaki, Yuuji Kishigami
  • Publication number: 20190121223
    Abstract: The present technology relates to a compound-eye camera module and an electronic device in which a plurality of monocular camera modules can be fixed together by a connecting member more effectively. In the compound-eye camera module, a camera-side positioning portion for positioning formed on a camera-side reference surface of each of the monocular camera modules and a member-side positioning portion for positioning formed on a member-side reference surface of the connecting member are fitted together, to connect the plurality of monocular camera modules together, whereby the plurality of monocular camera modules can be fixed together by the connecting member more effectively. The present technology can be applied to, for example, a compound-eye camera module in which a plurality of CMOS image sensors is connected together.
    Type: Application
    Filed: March 31, 2017
    Publication date: April 25, 2019
    Inventors: JUNICHI TOKUNAGA, SEIYA TSUZAKI, YUUJI KISHIGAMI