Patents by Inventor Seiya YUKI

Seiya YUKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230298961
    Abstract: An insulating substrate in which one principal surface of a heat-dissipation-side metal plate is bonded to one principal surface of a ceramic substrate via a brazing material layer provided therebetween, and a solder resist portion is formed on at least one selected from a periphery of the other principal surface of the heat-dissipation-side metal plate, a side surface of the heat-dissipation-side metal plate, and a surface of the brazing material layer. A solder resist prevents solder from wrapping around the brazing material layer, and thereby, what is called “the brazing material layer leaching into solder” no longer occurs and the occurrence of cracks inside the brazing material layer is avoided. This prevents stress concentration from occurring in the ceramic substrate at an inner portion relative to an end portion of the heat-dissipation-side metal plate.
    Type: Application
    Filed: June 29, 2021
    Publication date: September 21, 2023
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Seiya YUKI, Takashi IDENO, Eitarou SATOU, Yukihiro KITAMURA
  • Publication number: 20230268245
    Abstract: An insulating substrate in which one principal surface of a heat-dissipation-side metal plate is brazed to one principal surface of a ceramic substrate via a brazing material layer provided therebetween, in which a Ni plating layer that covers the brazing material layer exposed between the ceramic substrate and the heat-dissipation-side metal plate is provided, and at least a portion of the other principal surface of the heat-dissipation-side metal plate is not covered with a Ni plating layer, leaving the surface of the heat-dissipation-side metal plate exposed. According to the present invention, it becomes possible to obtain the insulating substrate having excellent furnace passing resistance of the insulating substrate (alone) and further having excellent heat cycle characteristics in a state of a heat sink plate being soldered to the insulating substrate.
    Type: Application
    Filed: June 29, 2021
    Publication date: August 24, 2023
    Applicant: DOWA METALTECH CO., LTD.
    Inventors: Seiya YUKI, Takashi IDENO, Junichi KINOSHITA, Yukihiro KITAMURA
  • Publication number: 20220130597
    Abstract: A coil component includes a core that has a columnar winding core portion and a flange formed at an end of the winding core portion in an axial direction. The coil component also includes a terminal electrode formed at an end surface of the flange and a wire being wound around the winding core portion with one end portion coupled to the terminal electrode. The flange protrudes toward the first end of the coil component in the first direction. A curved surface and an inclined surface are formed at a boundary between a surface of the flange and a peripheral surface of the winding core portion. The inclined surface has a curvature smaller than that of the curved surface. In addition, the inclined surface is disposed where the wire intersects the boundary as viewed in the first direction.
    Type: Application
    Filed: October 12, 2021
    Publication date: April 28, 2022
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Tomoyuki WADA, Kazuto SHIBUYA, Seiya YUKI, Yuki KANBE
  • Publication number: 20220102063
    Abstract: A coil component includes a core having a winding core portion and one pair of guard portions, a terminal electrode provided on each guard portion, and a wire wound around the winding core portion and having both ends electrically connected to the terminal electrodes. Each guard portion has an inner end face, an outer end face, a bottom surface, a top surface, and two side surfaces. Each terminal electrode has a bottom surface electrode portion continuous over at least the bottom surface and an outer end face electrode portion on the outer end face. The bottom surface electrode portion has a side surface extension portion located lower than a lowest portion of the winding core portion. The outer end face electrode portion is connected to the bottom surface electrode portion, and both end edges of the outer end face electrode portion are located away from both the side surfaces.
    Type: Application
    Filed: September 8, 2021
    Publication date: March 31, 2022
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yuki KANBE, Tomoyuki WADA, Kazuto SHIBUYA, Seiya YUKI