Patents by Inventor Seizo Fujimoto

Seizo Fujimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140305581
    Abstract: A X-Y plane is a plane parallel to abutting surfaces on which a joining portion is formed, and a Z direction is a direction perpendicular to the X-Y plane. A sealing member is held between the outer circumference side of a guide provided on a lid body and the inner circumference side of a rib provided on a case, and is pressed in a direction parallel to the X-Y plane. Laser light is scanned on the inner circumference side with respect to a ring-shaped pressurization jig with a stopper pressurized by the pressurization jig, so the pressurization jig does not break the path of the laser light. This expands the range of options in the material for the pressurization jig, which enables an easy-maintenance jig to be used, improving productivity.
    Type: Application
    Filed: June 25, 2014
    Publication date: October 16, 2014
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Seizo FUJIMOTO
  • Patent number: 8852704
    Abstract: A X-Y plane is a plane parallel to abutting surfaces on which a joining portion is formed, and a Z direction is a direction perpendicular to the X-Y plane. A sealing member is held between the outer circumference side of a guide provided on a lid body and the inner circumference side of a rib provided on a case, and is pressed in a direction parallel to the X-Y plane. Laser light is scanned on the inner circumference side with respect to a ring-shaped pressurization jig with a stopper pressurized by the pressurization jig, so the pressurization jig does not break the path of the laser light. This expands the range of options in the material for the pressurization jig, which enables an easy-maintenance jig to be used, improving productivity.
    Type: Grant
    Filed: February 26, 2013
    Date of Patent: October 7, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventor: Seizo Fujimoto
  • Publication number: 20140037914
    Abstract: A X-Y plane is a plane parallel to abutting surfaces on which a joining portion is formed, and a Z direction is a direction perpendicular to the X-Y plane. A sealing member is held between the outer circumference side of a guide provided on a lid body and the inner circumference side of a rib provided on a case, and is pressed in a direction parallel to the X-Y plane. Laser light is scanned on the inner circumference side with respect to a ring-shaped pressurization jig with a stopper pressurized by the pressurization jig, so the pressurization jig does not break the path of the laser light. This expands the range of options in the material for the pressurization jig, which enables an easy-maintenance jig to be used, improving productivity.
    Type: Application
    Filed: February 26, 2013
    Publication date: February 6, 2014
    Inventor: Seizo FUJIMOTO
  • Patent number: 8632245
    Abstract: A temperature sensor is provided that can easily make possible stuffing with the filler or burying of the temperature detector element so that faster temperature response can be achieved. A temperature sensor has a closed-bottom tubular shaped case, a temperature detector element inserted and accommodated in the case, and a filler filled in the case and sealing the temperature detector element. The temperature sensor is provided with a filler flowing portion formed in a relative gap between the case and the temperature detector element along an insertion direction of the temperature detector element and having a gap relative to the temperature detector element larger than that relative to the remainder portion of the gap.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: January 21, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventor: Seizo Fujimoto
  • Patent number: 8597755
    Abstract: A resin welded body where a first resin part that is absorbent with respect to laser light and a second resin part that is transparent with respect to laser light are fitted together and the laser light is emitted to a predetermined position from the side of the second resin part to weld together the first and the second resin parts and form a joint portion between both resin parts, wherein on either the first or the second resin part there is disposed a projection that comes into contact with the other resin part during the welding and regulates the sinking amount at the joint portion.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: December 3, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Seizo Fujimoto, Takafumi Hara, Shinsuke Asada, Hiroshi Kobayashi, Masaaki Taruya
  • Publication number: 20120294330
    Abstract: A temperature sensor is provided that can easily make possible stuffing with the filler or burying of the temperature detector element so that faster temperature response can be achieved. A temperature sensor has a closed-bottom tubular shaped case, a temperature detector element inserted and accommodated in the case, and a filler filled in the case and sealing the temperature detector element. The temperature sensor is provided with a filler flowing portion formed in a relative gap between the case and the temperature detector element along an insertion direction of the temperature detector element and having a gap relative to the temperature detector element larger than that relative to the remainder portion of the gap.
    Type: Application
    Filed: September 23, 2011
    Publication date: November 22, 2012
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventor: Seizo FUJIMOTO
  • Patent number: 8110062
    Abstract: A welding method and welding apparatus for resin members is provided in which dimensional accuracy of two resin members after welding can be secured and reduction in joining strength due to excessive laser irradiation can be prevented. In a method of superimposing a resin having a laser-transmitting property and a resin having laser absorptiveness and irradiating the resin members with a laser beam from the side of the laser-transmitting resin member to deposit the resin members on each other, irradiation with the laser beam is ended in accordance with reduction in the approaching speed of the two resin members during the irradiation with the laser beam.
    Type: Grant
    Filed: April 9, 2008
    Date of Patent: February 7, 2012
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shinsuke Asada, Takafumi Hara, Seizo Fujimoto, Masaaki Taruya
  • Patent number: 7862874
    Abstract: A method for producing a welded resin material contains steps of: superimposing a resin member having transmissibility to laser light and a resin member having absorptivity to laser light to form a contact part where the resin members are in contact with each other; forming a closed space that is adjacent to the contact part and faces one end of the contact part; and radiating the laser light from the resin member having transmissibility while pressing the resin members to each other through the contact part, so as to heat the contact part to melt a resin at the contact part, housing a resin excluded from the contact part through melting in the closed space, solidifying the resin melted at the contact part to weld the resin members.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: January 4, 2011
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shinsuke Asada, Takafumi Hara, Seizo Fujimoto, Masaaki Taruya
  • Patent number: 7707892
    Abstract: A mounting structure for a pressure sensor serves to facilitate easy attachment of the pressure sensor as well as easy detachment thereof without requiring any large work space. A pair of elastic snap fit portions (8) are formed on a surge tank (4) so as to protrude from a surface thereof, and have engagement protrusions (8a) formed at their one end, respectively, so as to protrude to a side opposite to a case (2). A pair of engaged portions (2b) are formed on the case (2) so as to be engaged with the engagement protrusions (8a), respectively. The snap fit portions (8) are forced to flexibly deform to the pressure sensor (1) when the pressure sensor (1) is attached to and detached from the surge tank (4).
    Type: Grant
    Filed: July 11, 2008
    Date of Patent: May 4, 2010
    Assignee: Mitsubishi Electric Corporation
    Inventor: Seizo Fujimoto
  • Publication number: 20090126869
    Abstract: A welding method and welding apparatus for resin members is provided in which dimensional accuracy of two resin members after welding can be secured and reduction in joining strength due to excessive laser irradiation can be prevented. In a method of superimposing a resin having a laser-transmitting property and a resin having laser absorptiveness and irradiating the resin members with a laser beam from the side of the laser-transmitting resin member to deposit the resin members on each other, irradiation with the laser beam is ended in accordance with reduction in the approaching speed of the two resin members during the irradiation with the laser beam.
    Type: Application
    Filed: April 9, 2008
    Publication date: May 21, 2009
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shinsuke ASADA, Takafumi HARA, Seizo FUJIMOTO, Masaaki TARUYA
  • Publication number: 20080302189
    Abstract: A mounting structure for a pressure sensor serves to facilitate easy attachment of the pressure sensor as well as easy detachment thereof without requiring any large work space. A pair of elastic snap fit portions (8) are formed on a surge tank (4) so as to protrude from a surface thereof, and have engagement protrusions (8a) formed at their one end, respectively, so as to protrude to a side opposite to a case (2). A pair of engaged portions (2b) are formed on the case (2) so as to be engaged with the engagement protrusions (8a), respectively. The snap fit portions (8) are forced to flexibly deform to the pressure sensor (1) when the pressure sensor (1) is attached to and detached from the surge tank (4).
    Type: Application
    Filed: July 11, 2008
    Publication date: December 11, 2008
    Inventor: Seizo FUJIMOTO
  • Publication number: 20080261065
    Abstract: A resin welded body where a first resin part that is absorbent with respect to laser light and a second resin part that is transparent with respect to laser light are fitted together and the laser light is emitted to a predetermined position from the side of the second resin part to weld together the first and the second resin parts and form a joint portion between both resin parts, wherein on either the first or the second resin part there is disposed a projection that comes into contact with the other resin part during the welding and regulates the sinking amount at the joint portion.
    Type: Application
    Filed: August 20, 2007
    Publication date: October 23, 2008
    Applicant: Mitsubishi Electric Corporation
    Inventors: Seizo Fujimoto, Takafumi Hara, Shinsuke Asada, Hiroshi Kobayashi, Masaaki Taruya
  • Publication number: 20080254242
    Abstract: A method for producing a welded resin material contains steps of: superimposing a resin member having transmissibility to laser light and a resin member having absorptivity to laser light to form a contact part where the resin members are in contact with each other; forming a closed space that is adjacent to the contact part and faces one end of the contact part; and radiating the laser light from the resin member having transmissibility while pressing the resin members to each other through the contact part, so as to heat the contact part to melt a resin at the contact part, housing a resin excluded from the contact part through melting in the closed space, solidifying the resin melted at the contact part to weld the resin members.
    Type: Application
    Filed: October 5, 2007
    Publication date: October 16, 2008
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shinsuke ASADA, Takafumi Hara, Seizo Fujimoto, Masaaki Taruya
  • Patent number: 7426869
    Abstract: A mounting structure for a pressure sensor serves to facilitate easy attachment of the pressure sensor as well as easy detachment thereof without requiring any large work space. A pair of elastic snap fit portions (8) are formed on a surge tank (4) so as to protrude from a surface thereof, and have engagement protrusions (8a) formed at their one end, respectively, so as to protrude to a side opposite to a case (2). A pair of engaged portions (2b) are formed on the case (2) so as to be engaged with the engagement protrusions (8a), respectively. The snap fit portions (8) are forced to flexibly deform to the pressure sensor (1) when the pressure sensor (1) is attached to and detached from the surge tank (4).
    Type: Grant
    Filed: September 25, 2006
    Date of Patent: September 23, 2008
    Assignee: Mitsubishi Electric Corporation
    Inventor: Seizo Fujimoto
  • Publication number: 20070272028
    Abstract: A mounting structure for a pressure sensor serves to facilitate easy attachment of the pressure sensor as well as easy detachment thereof without requiring any large work space. A pair of elastic snap fit portions (8) are formed on a surge tank (4) so as to protrude from a surface thereof, and have engagement protrusions (8a) formed at their one end, respectively, so as to protrude to a side opposite to a case (2). A pair of engaged portions (2b) are formed on the case (2) so as to be engaged with the engagement protrusions (8a), respectively. The snap fit portions (8) are forced to flexibly deform to the pressure sensor (1) when the pressure sensor (1) is attached to and detached from the surge tank (4).
    Type: Application
    Filed: September 25, 2006
    Publication date: November 29, 2007
    Inventor: Seizo Fujimoto
  • Patent number: 7219554
    Abstract: A semiconductor pressure sensor is not influenced by a charged object in a fluid to be measured or an electric field from the outside, so satisfactory sensitivity and accuracy can be ensured. The semiconductor pressure sensor is provided with a diaphragm 4 that responds to the pressure of the fluid to be measured. The diaphragm includes a silicon substrate with piezoresistive elements, which together constitute a bridge circuit, being embedded therein, and a shield film for electromagnetic shielding formed on a surface of the silicon substrate at a side thereof at which the fluid to be measured is in contact with the silicon substrate. The shield film is electrically connected to the silicon substrate so as to have the same potential as that of the silicon substrate.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: May 22, 2007
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Seizo Fujimoto, Takafumi Hara, Masaaki Taruya
  • Publication number: 20060278012
    Abstract: A semiconductor pressure sensor is not influenced by a charged object in a fluid to be measured or an electric field from the outside, so satisfactory sensitivity and accuracy can be ensured. The semiconductor pressure sensor is provided with a diaphragm 4 that responds to the pressure of the fluid to be measured. The diaphragm includes a silicon substrate with piezoresistive elements, which together constitute a bridge circuit, being embedded therein, and a shield film for electromagnetic shielding formed on a surface of the silicon substrate at a side thereof at which the fluid to be measured is in contact with the silicon substrate. The shield film is electrically connected to the silicon substrate so as to have the same potential as that of the silicon substrate.
    Type: Application
    Filed: September 14, 2005
    Publication date: December 14, 2006
    Inventors: Seizo Fujimoto, Takafumi Hara, Masaaki Taruya
  • Patent number: 6955091
    Abstract: A pressure sensor apparatus is substantially miniaturized by utilizing dead space. A sensor element is arranged to be present in a medium for detecting the pressure of the medium. A control element serves to control an electric signal from the sensor element, and a power supply element serves to control an input from the power supply and a signal from the control element thereby to generate an output. A lead frame has the control element and the power supply element mounted thereon and serves as an electrical conduction path. A resin body is formed by integrating the control element, the power supply element and the lead frame with one another. Either one of the sensor element, the control element and the power supply element is arranged on one side surface of the lead frame, and the remaining two are arranged on the other side surface of the lead frame.
    Type: Grant
    Filed: September 2, 2003
    Date of Patent: October 18, 2005
    Inventors: Seizo Fujimoto, Hisato Umemaru
  • Publication number: 20040231426
    Abstract: A pressure sensor apparatus is substantially miniaturized by utilizing dead space. A sensor element is arranged to be present in a medium for detecting the pressure of the medium. A control element serves to control an electric signal from the sensor element, and a power supply element serves to control an input from the power supply and a signal from the control element thereby to generate an output. A lead frame has the control element and the power supply element mounted thereon and serves as an electrical conduction path. A resin body is formed by integrating the control element, the power supply element and the lead frame with one another. Either one of the sensor element, the control element and the power supply element is arranged on one side surface of the lead frame, and the remaining two are arranged on the other side surface of the lead frame.
    Type: Application
    Filed: September 2, 2003
    Publication date: November 25, 2004
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Seizo Fujimoto, Hisato Umemaru