Patents by Inventor Seizo Fujimoto
Seizo Fujimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20140305581Abstract: A X-Y plane is a plane parallel to abutting surfaces on which a joining portion is formed, and a Z direction is a direction perpendicular to the X-Y plane. A sealing member is held between the outer circumference side of a guide provided on a lid body and the inner circumference side of a rib provided on a case, and is pressed in a direction parallel to the X-Y plane. Laser light is scanned on the inner circumference side with respect to a ring-shaped pressurization jig with a stopper pressurized by the pressurization jig, so the pressurization jig does not break the path of the laser light. This expands the range of options in the material for the pressurization jig, which enables an easy-maintenance jig to be used, improving productivity.Type: ApplicationFiled: June 25, 2014Publication date: October 16, 2014Applicant: MITSUBISHI ELECTRIC CORPORATIONInventor: Seizo FUJIMOTO
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Patent number: 8852704Abstract: A X-Y plane is a plane parallel to abutting surfaces on which a joining portion is formed, and a Z direction is a direction perpendicular to the X-Y plane. A sealing member is held between the outer circumference side of a guide provided on a lid body and the inner circumference side of a rib provided on a case, and is pressed in a direction parallel to the X-Y plane. Laser light is scanned on the inner circumference side with respect to a ring-shaped pressurization jig with a stopper pressurized by the pressurization jig, so the pressurization jig does not break the path of the laser light. This expands the range of options in the material for the pressurization jig, which enables an easy-maintenance jig to be used, improving productivity.Type: GrantFiled: February 26, 2013Date of Patent: October 7, 2014Assignee: Mitsubishi Electric CorporationInventor: Seizo Fujimoto
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Publication number: 20140037914Abstract: A X-Y plane is a plane parallel to abutting surfaces on which a joining portion is formed, and a Z direction is a direction perpendicular to the X-Y plane. A sealing member is held between the outer circumference side of a guide provided on a lid body and the inner circumference side of a rib provided on a case, and is pressed in a direction parallel to the X-Y plane. Laser light is scanned on the inner circumference side with respect to a ring-shaped pressurization jig with a stopper pressurized by the pressurization jig, so the pressurization jig does not break the path of the laser light. This expands the range of options in the material for the pressurization jig, which enables an easy-maintenance jig to be used, improving productivity.Type: ApplicationFiled: February 26, 2013Publication date: February 6, 2014Inventor: Seizo FUJIMOTO
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Patent number: 8632245Abstract: A temperature sensor is provided that can easily make possible stuffing with the filler or burying of the temperature detector element so that faster temperature response can be achieved. A temperature sensor has a closed-bottom tubular shaped case, a temperature detector element inserted and accommodated in the case, and a filler filled in the case and sealing the temperature detector element. The temperature sensor is provided with a filler flowing portion formed in a relative gap between the case and the temperature detector element along an insertion direction of the temperature detector element and having a gap relative to the temperature detector element larger than that relative to the remainder portion of the gap.Type: GrantFiled: September 23, 2011Date of Patent: January 21, 2014Assignee: Mitsubishi Electric CorporationInventor: Seizo Fujimoto
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Patent number: 8597755Abstract: A resin welded body where a first resin part that is absorbent with respect to laser light and a second resin part that is transparent with respect to laser light are fitted together and the laser light is emitted to a predetermined position from the side of the second resin part to weld together the first and the second resin parts and form a joint portion between both resin parts, wherein on either the first or the second resin part there is disposed a projection that comes into contact with the other resin part during the welding and regulates the sinking amount at the joint portion.Type: GrantFiled: August 20, 2007Date of Patent: December 3, 2013Assignee: Mitsubishi Electric CorporationInventors: Seizo Fujimoto, Takafumi Hara, Shinsuke Asada, Hiroshi Kobayashi, Masaaki Taruya
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Publication number: 20120294330Abstract: A temperature sensor is provided that can easily make possible stuffing with the filler or burying of the temperature detector element so that faster temperature response can be achieved. A temperature sensor has a closed-bottom tubular shaped case, a temperature detector element inserted and accommodated in the case, and a filler filled in the case and sealing the temperature detector element. The temperature sensor is provided with a filler flowing portion formed in a relative gap between the case and the temperature detector element along an insertion direction of the temperature detector element and having a gap relative to the temperature detector element larger than that relative to the remainder portion of the gap.Type: ApplicationFiled: September 23, 2011Publication date: November 22, 2012Applicant: MITSUBISHI ELECTRIC CORPORATIONInventor: Seizo FUJIMOTO
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Patent number: 8110062Abstract: A welding method and welding apparatus for resin members is provided in which dimensional accuracy of two resin members after welding can be secured and reduction in joining strength due to excessive laser irradiation can be prevented. In a method of superimposing a resin having a laser-transmitting property and a resin having laser absorptiveness and irradiating the resin members with a laser beam from the side of the laser-transmitting resin member to deposit the resin members on each other, irradiation with the laser beam is ended in accordance with reduction in the approaching speed of the two resin members during the irradiation with the laser beam.Type: GrantFiled: April 9, 2008Date of Patent: February 7, 2012Assignee: Mitsubishi Electric CorporationInventors: Shinsuke Asada, Takafumi Hara, Seizo Fujimoto, Masaaki Taruya
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Patent number: 7862874Abstract: A method for producing a welded resin material contains steps of: superimposing a resin member having transmissibility to laser light and a resin member having absorptivity to laser light to form a contact part where the resin members are in contact with each other; forming a closed space that is adjacent to the contact part and faces one end of the contact part; and radiating the laser light from the resin member having transmissibility while pressing the resin members to each other through the contact part, so as to heat the contact part to melt a resin at the contact part, housing a resin excluded from the contact part through melting in the closed space, solidifying the resin melted at the contact part to weld the resin members.Type: GrantFiled: October 5, 2007Date of Patent: January 4, 2011Assignee: Mitsubishi Electric CorporationInventors: Shinsuke Asada, Takafumi Hara, Seizo Fujimoto, Masaaki Taruya
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Patent number: 7707892Abstract: A mounting structure for a pressure sensor serves to facilitate easy attachment of the pressure sensor as well as easy detachment thereof without requiring any large work space. A pair of elastic snap fit portions (8) are formed on a surge tank (4) so as to protrude from a surface thereof, and have engagement protrusions (8a) formed at their one end, respectively, so as to protrude to a side opposite to a case (2). A pair of engaged portions (2b) are formed on the case (2) so as to be engaged with the engagement protrusions (8a), respectively. The snap fit portions (8) are forced to flexibly deform to the pressure sensor (1) when the pressure sensor (1) is attached to and detached from the surge tank (4).Type: GrantFiled: July 11, 2008Date of Patent: May 4, 2010Assignee: Mitsubishi Electric CorporationInventor: Seizo Fujimoto
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Publication number: 20090126869Abstract: A welding method and welding apparatus for resin members is provided in which dimensional accuracy of two resin members after welding can be secured and reduction in joining strength due to excessive laser irradiation can be prevented. In a method of superimposing a resin having a laser-transmitting property and a resin having laser absorptiveness and irradiating the resin members with a laser beam from the side of the laser-transmitting resin member to deposit the resin members on each other, irradiation with the laser beam is ended in accordance with reduction in the approaching speed of the two resin members during the irradiation with the laser beam.Type: ApplicationFiled: April 9, 2008Publication date: May 21, 2009Applicant: Mitsubishi Electric CorporationInventors: Shinsuke ASADA, Takafumi HARA, Seizo FUJIMOTO, Masaaki TARUYA
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Publication number: 20080302189Abstract: A mounting structure for a pressure sensor serves to facilitate easy attachment of the pressure sensor as well as easy detachment thereof without requiring any large work space. A pair of elastic snap fit portions (8) are formed on a surge tank (4) so as to protrude from a surface thereof, and have engagement protrusions (8a) formed at their one end, respectively, so as to protrude to a side opposite to a case (2). A pair of engaged portions (2b) are formed on the case (2) so as to be engaged with the engagement protrusions (8a), respectively. The snap fit portions (8) are forced to flexibly deform to the pressure sensor (1) when the pressure sensor (1) is attached to and detached from the surge tank (4).Type: ApplicationFiled: July 11, 2008Publication date: December 11, 2008Inventor: Seizo FUJIMOTO
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Publication number: 20080261065Abstract: A resin welded body where a first resin part that is absorbent with respect to laser light and a second resin part that is transparent with respect to laser light are fitted together and the laser light is emitted to a predetermined position from the side of the second resin part to weld together the first and the second resin parts and form a joint portion between both resin parts, wherein on either the first or the second resin part there is disposed a projection that comes into contact with the other resin part during the welding and regulates the sinking amount at the joint portion.Type: ApplicationFiled: August 20, 2007Publication date: October 23, 2008Applicant: Mitsubishi Electric CorporationInventors: Seizo Fujimoto, Takafumi Hara, Shinsuke Asada, Hiroshi Kobayashi, Masaaki Taruya
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Publication number: 20080254242Abstract: A method for producing a welded resin material contains steps of: superimposing a resin member having transmissibility to laser light and a resin member having absorptivity to laser light to form a contact part where the resin members are in contact with each other; forming a closed space that is adjacent to the contact part and faces one end of the contact part; and radiating the laser light from the resin member having transmissibility while pressing the resin members to each other through the contact part, so as to heat the contact part to melt a resin at the contact part, housing a resin excluded from the contact part through melting in the closed space, solidifying the resin melted at the contact part to weld the resin members.Type: ApplicationFiled: October 5, 2007Publication date: October 16, 2008Applicant: Mitsubishi Electric CorporationInventors: Shinsuke ASADA, Takafumi Hara, Seizo Fujimoto, Masaaki Taruya
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Patent number: 7426869Abstract: A mounting structure for a pressure sensor serves to facilitate easy attachment of the pressure sensor as well as easy detachment thereof without requiring any large work space. A pair of elastic snap fit portions (8) are formed on a surge tank (4) so as to protrude from a surface thereof, and have engagement protrusions (8a) formed at their one end, respectively, so as to protrude to a side opposite to a case (2). A pair of engaged portions (2b) are formed on the case (2) so as to be engaged with the engagement protrusions (8a), respectively. The snap fit portions (8) are forced to flexibly deform to the pressure sensor (1) when the pressure sensor (1) is attached to and detached from the surge tank (4).Type: GrantFiled: September 25, 2006Date of Patent: September 23, 2008Assignee: Mitsubishi Electric CorporationInventor: Seizo Fujimoto
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Publication number: 20070272028Abstract: A mounting structure for a pressure sensor serves to facilitate easy attachment of the pressure sensor as well as easy detachment thereof without requiring any large work space. A pair of elastic snap fit portions (8) are formed on a surge tank (4) so as to protrude from a surface thereof, and have engagement protrusions (8a) formed at their one end, respectively, so as to protrude to a side opposite to a case (2). A pair of engaged portions (2b) are formed on the case (2) so as to be engaged with the engagement protrusions (8a), respectively. The snap fit portions (8) are forced to flexibly deform to the pressure sensor (1) when the pressure sensor (1) is attached to and detached from the surge tank (4).Type: ApplicationFiled: September 25, 2006Publication date: November 29, 2007Inventor: Seizo Fujimoto
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Patent number: 7219554Abstract: A semiconductor pressure sensor is not influenced by a charged object in a fluid to be measured or an electric field from the outside, so satisfactory sensitivity and accuracy can be ensured. The semiconductor pressure sensor is provided with a diaphragm 4 that responds to the pressure of the fluid to be measured. The diaphragm includes a silicon substrate with piezoresistive elements, which together constitute a bridge circuit, being embedded therein, and a shield film for electromagnetic shielding formed on a surface of the silicon substrate at a side thereof at which the fluid to be measured is in contact with the silicon substrate. The shield film is electrically connected to the silicon substrate so as to have the same potential as that of the silicon substrate.Type: GrantFiled: September 14, 2005Date of Patent: May 22, 2007Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Seizo Fujimoto, Takafumi Hara, Masaaki Taruya
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Publication number: 20060278012Abstract: A semiconductor pressure sensor is not influenced by a charged object in a fluid to be measured or an electric field from the outside, so satisfactory sensitivity and accuracy can be ensured. The semiconductor pressure sensor is provided with a diaphragm 4 that responds to the pressure of the fluid to be measured. The diaphragm includes a silicon substrate with piezoresistive elements, which together constitute a bridge circuit, being embedded therein, and a shield film for electromagnetic shielding formed on a surface of the silicon substrate at a side thereof at which the fluid to be measured is in contact with the silicon substrate. The shield film is electrically connected to the silicon substrate so as to have the same potential as that of the silicon substrate.Type: ApplicationFiled: September 14, 2005Publication date: December 14, 2006Inventors: Seizo Fujimoto, Takafumi Hara, Masaaki Taruya
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Patent number: 6955091Abstract: A pressure sensor apparatus is substantially miniaturized by utilizing dead space. A sensor element is arranged to be present in a medium for detecting the pressure of the medium. A control element serves to control an electric signal from the sensor element, and a power supply element serves to control an input from the power supply and a signal from the control element thereby to generate an output. A lead frame has the control element and the power supply element mounted thereon and serves as an electrical conduction path. A resin body is formed by integrating the control element, the power supply element and the lead frame with one another. Either one of the sensor element, the control element and the power supply element is arranged on one side surface of the lead frame, and the remaining two are arranged on the other side surface of the lead frame.Type: GrantFiled: September 2, 2003Date of Patent: October 18, 2005Inventors: Seizo Fujimoto, Hisato Umemaru
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Publication number: 20040231426Abstract: A pressure sensor apparatus is substantially miniaturized by utilizing dead space. A sensor element is arranged to be present in a medium for detecting the pressure of the medium. A control element serves to control an electric signal from the sensor element, and a power supply element serves to control an input from the power supply and a signal from the control element thereby to generate an output. A lead frame has the control element and the power supply element mounted thereon and serves as an electrical conduction path. A resin body is formed by integrating the control element, the power supply element and the lead frame with one another. Either one of the sensor element, the control element and the power supply element is arranged on one side surface of the lead frame, and the remaining two are arranged on the other side surface of the lead frame.Type: ApplicationFiled: September 2, 2003Publication date: November 25, 2004Applicant: MITSUBISHI DENKI KABUSHIKI KAISHAInventors: Seizo Fujimoto, Hisato Umemaru