Patents by Inventor Seizo Kitatani

Seizo Kitatani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metallurgically bonded diamond-metal composite sintered materials and method of making same
    Patent number: 4439237
    Abstract: A metallurgically bonded diamond-metal composite sintered material suitable for lapping comprises a Ni and/or Co base, an intermetallic compound dispersed in said base and diamond powder, and the method of making said material comprises specifying the particle size of the base powder and then sintering same at a low temperature not exceeding a diamond graphitization temperature.
    Type: Grant
    Filed: September 25, 1981
    Date of Patent: March 27, 1984
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Shiro Kuminitsu, Izumi Hayakawa, Seizo Kitatani, Akira Emura