Patents by Inventor Seizo Murayama

Seizo Murayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of treating a nodic oxide film, printed wiring board and process of making the same
    Patent number: 4483751
    Abstract: A process of treating an anodic oxide film wherein a base material of a valve metal is anodized to form the anodic oxide film thereon, which is then impregnated with a polymerizable organic metal compound and thereafter subjected to polymerization of the compound, whereby the micropores of the anodic oxide film are filled and sealed with the polymerized organometallic compound. According to this process, there is provided a base material having an anodic oxide film impregnated with polymerized organometallic compound which is excellent in heat resistance, heat radiance, and electrical insulation, and hence the base material is useful for the printed wiring board, electrically-insulative heat sink, heat-resistant insulated wire and the like.
    Type: Grant
    Filed: February 1, 1982
    Date of Patent: November 20, 1984
    Assignee: Fujikura Cable Works, Ltd.
    Inventors: Seizo Murayama, Kazuo Isawa, Masatsugu Maejima, Takayoshi Usuki, Kohichi Saruwatari