Patents by Inventor Seizo Seki

Seizo Seki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7285318
    Abstract: The present invention relates to a packing material used for wrapping an article to be packed and sealing and packing the article to be packed by heat-sealing mutually superposed end parts. The packing material is composed of a biodegradable film. Heat sealing agent layers are selectively provided in the heat sealing positions or the heat-sealed parts of the biodegradable film. The heat sealing agent layers are provided on the front surface and the back surface, the front surface and the front surface, or the back surface and the back surface of the mutually superposed biodegradable film when the article to be packed is packed. On the biodegradable film, picture pattern layers as well as the heat sealing agent layers are formed within a range 70% or less as large as the entire area including the front surface and the back surface of the biodegradable film.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: October 23, 2007
    Assignee: Sony Corporation
    Inventors: Toshiyuki Kaku, Takayuki Aneha, Seizo Seki, Yoshitaka Tsukidate
  • Publication number: 20040053012
    Abstract: The present invention relates to a packing material used for wrapping an article to be packed and sealing and packing the article to be packed by heat-sealing mutually superposed end parts. The packing material is composed of a biodegradable film. Heat sealing agent layers are selectively provided in the heat sealing positions or the heat-sealed parts of the biodegradable film. The heat sealing agent layers are provided on the front surface and the back surface, the front surface and the front surface, or the back surface and the back surface of the mutually superposed biodegradable film when the article to be packed is packed. On the biodegradable film, picture pattern layers as well as the heat sealing agent layers are formed within a range 70% or less as large as the entire area including the front surface and the back surface of the biodegradable film.
    Type: Application
    Filed: October 9, 2003
    Publication date: March 18, 2004
    Inventors: Toshiyuki Kaku, Takayuki Aneha, Seizo Seki, Yoshitaka Tsukidate
  • Patent number: 6443303
    Abstract: A package for a cassette storage case (2) that has a cassette insertion opening (4) formed at one lateral side thereof, cassette guide cuts (7) formed in main front and rear surfaces (5) and (6) thereof at the side of the opening (4), and a cassette receiving space (3) defined by the front and rear surfaces (5) and (6) and the other lateral side thereof, so that a tape cassette (1) is inserted into the cassette receiving space (3) through the cassette insertion opening (4). A sealing/packaging tape (1) is wound on the cassette storage case (2) across the cassette insertion opening (4) and (10) is wider than the cassette guide cuts (7) in the cassette storage case (2). Thus the sealing/packaging tape (10) covers the cassette guide cuts (7) to seal and wrap the cassette storage case (2). Thereby, a positive sealing and packaging can be realized with a reduced amount of the packaging material (to save the resources).
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: September 3, 2002
    Assignee: Sony Corporation
    Inventors: Seizo Seki, Chie Iwamoto
  • Patent number: 6089448
    Abstract: In a box-shaped packing case 20 having an overlap portion at which a third folding plate 24 folded from a first holding direction is superposedly adhesively attached onto first and second folding plates 22, 23 which are folded from two directions different from the first folding direction of the third folding plate 24 so that the boundary portions thereof are not overlapped with each other, the shape of the boundary portion between the first and second folding plates 22, 23 when the first and second folding plates 22, 23 are folded is designed so that the length of an adhesion area to which the third folding plate 24 adheres approaches to the length of the third folding plate 24 at a maximum irrespective of the boundary portion.
    Type: Grant
    Filed: May 18, 1999
    Date of Patent: July 18, 2000
    Assignee: Sony Corporation
    Inventor: Seizo Seki
  • Patent number: 6061997
    Abstract: A wrapping method in which a wrapped product is wrapped by a sheath film and partly-overlapped portions of the sheath film are melt-bonded by heat to heat-seal the sheath film. When the user opens the sheath film, the user can tear the same with ease. A heat sealing area of the sheath film (1) is printed by a halftone printing portion (10) to uniformly reduce the whole bonding area, thereby decreasing a bonding strength.
    Type: Grant
    Filed: December 30, 1998
    Date of Patent: May 16, 2000
    Assignee: Sony Corporation
    Inventors: Hiroshi Ozaki, Seizo Seki
  • Patent number: 5921464
    Abstract: A package for wrapping an object in which an outer packaging film can be positively unsealed without damaging the object or by using a strong force during unsealing. A non-adhered part which becomes an opening tap (10) for unsealing is formed in a part of an overlapped portion of an outer packaging film (2), weakly adhered parts (11a), (11b) each having a low degree of adhesiveness are formed at left and right sides of the opening tap (10), and a slit (12) is provided in one weakly adhered part only (11a) which allows for the outer packaging film (2) to be torn easily.
    Type: Grant
    Filed: February 27, 1998
    Date of Patent: July 13, 1999
    Assignee: Sony Corporation
    Inventor: Seizo Seki
  • Patent number: 5797492
    Abstract: An information storage medium packaging body comprises a case 30 for containing an information storage medium, a packaging film 10 for packing the case 30, and the packaging film 10 includes a heat shrinkable film 11. A hologram layer 20 is formed on a front surface of the heat shrinkable film 11. An offset preventing layer 23 and a printed pattern layer 12 are formed on the back surface of the heat shrinkable layer 11.
    Type: Grant
    Filed: August 30, 1996
    Date of Patent: August 25, 1998
    Assignees: Sony Corporation, Dai Nippon Printing Co., Ltd.
    Inventors: Seizo Seki, Masayuki Kawajiri, Takashi Asakura
  • Patent number: 5749466
    Abstract: A packaging structure for packaging a packaged article having a rectangular parallelpiped shape, such as a tape cassette accommodating case and a disc cartridge accommodating case includes an adhesive portion and at least one non-adhesive portion formed on a portion wherein one end of a film-shaped packaging material overlaps the other end of the film-shaped packaging material when the packaged article having a rectangular parallelpiped shape is packaged by the film-shaped packaging material. The packaged article is packaged by bonding the adhesive portion and the non-adhesive portion is left as an unwrapping start portion.
    Type: Grant
    Filed: October 30, 1996
    Date of Patent: May 12, 1998
    Assignee: Sony Corporation
    Inventor: Seizo Seki
  • Patent number: 5715935
    Abstract: A packaging kit for simultaneously packaging a casing holding a recording medium configured for recording information signals and a main card arranged for sheathing the casing and which is used as an accessory index card having indications of, for example, titles representing the recording contents of the recording medium. The main card employed for the packaging kit has printed indications of the titles showing the recording contents on its one surface and also has a subsidiary card releasably bonded to its opposite surface. The subsidiary card is coated with an adhesive to form an adhesive layer. The opposite surface of the main card, to which is bonded the subsidiary card, has been processed for releasing to permit easy release of the subsidiary card having the adhesive layer. The main card is formed of a paper material having the basis weight of 170 to 210 g/m.sup.2, while the subsidiary card is formed of a paper material having the basis weight of 60 to 100 g/m.sup.2.
    Type: Grant
    Filed: May 22, 1996
    Date of Patent: February 10, 1998
    Assignee: Sony Corporation
    Inventor: Seizo Seki
  • Patent number: 5510165
    Abstract: A partly-overlapped portion of a sheath film is meltbonded by heat to provide a seal which a user can tear open with ease. A heat sealing area of the sheath film is halftone printed to reduce the bonding area, thereby decreasing the bonding strength. A tearing portion is provided along the heat seal which is printed so that it has a bonding strength which gradually increases along the tear part until it reaches the bonding strength of the remainder of the heat seal. A curl section having minimal bonding strength relative to the tearing portion of the heat seal is induced to curl up using heat treatment to allow the user to grasp the sheath film at the tear part.
    Type: Grant
    Filed: May 27, 1994
    Date of Patent: April 23, 1996
    Assignee: Sony Corporation
    Inventor: Seizo Seki
  • Patent number: 4799257
    Abstract: A wireless transmitter for PM (phase modulation) signal with a spectrum scrambler for relocation of input spectrum for privacy purposes is comprised of a differential circuit coupled with an input terminal, a spectrum scrambler coupled with output of said differential circuit, and FM (frequency modulation) modulator coupled with output of the spectrum scrambler. Due to the position of the differential circuit before the spectrum scrambler, modulation index of modulated PM signal and/or the frequency band of the modulated PM signal does not increase irrespective of spectrum scrambling.
    Type: Grant
    Filed: November 5, 1987
    Date of Patent: January 17, 1989
    Assignee: Nippon Telegraph & Telephone Public Corporation
    Inventors: Masahichi Kishi, Seizo Seki, Noboru Kanmuri
  • Patent number: 4726064
    Abstract: A wireless receiver for a PM (phase modulation) signal with a spectrum scrambling for relocation of speech spectrums for the privacy of purpose is comprised of an antenna for receiving PM modulated signals, an FM demodulator coupled with the antenna, a spectrum de-scrambler connected to output of the FM demodulator, an integration circuit connected to output of said spectrum de-scrambler, and an output terminal coupled with output of the integration circuit. Due to the location of the de-scrambler between the FM demodulator and the integration circuit, a noise spectrum of a reception signal is independent from a design of spectrum scrambling, and an excellent substantial S/N is obtained irrespective of spectrum scrambling.
    Type: Grant
    Filed: October 1, 1984
    Date of Patent: February 16, 1988
    Assignee: Nippon Telegraph & Telephone Public Corporation
    Inventors: Masahichi Kishi, Seizo Seki, Noboru Kanmuri
  • Patent number: 4039961
    Abstract: A digital carrier signal demodulation circuit is used in the carrier digital transmission system utilizing a 16-ary APK (Amplitude and Phase Keying) signal produced by the vector superposition of a second path signal consisting of a four-phase shift keying signal upon each phase of a first path signal consisting of a four-phase shift keying signal, the level of the second path signal being lower than that of the first path signal. The received 16-ary APK signal is detected with the reference carrier extracted from the received signal, regenerated to reproduce the base band pulses of the first path signal. The recovered base band pulses remodulate the reference carrier to produce the first path signal. The phases of the recovered first path signal and received signal are compared to phase lock a voltage controlled oscillator thereby producing the reference character.
    Type: Grant
    Filed: September 8, 1975
    Date of Patent: August 2, 1977
    Assignee: Nippon Telegraph and Telephone Public Corporation
    Inventors: Hideki Ishio, Seizo Seki, Kazuhiro Miyauchi