Abstract: A plasma processing apparatus includes: an electrostatic chuck supporting a wafer, and connected to a first power supply, an edge ring disposed to surround an edge of the electrostatic chuck and formed of a material having a first resistivity value, a dielectric ring supporting a lower portion of the edge ring, formed of a material having a second resistivity value lower than that of the first resistivity value, and connected to a second power supply, and an electrode ring disposed in a region overlapping the dielectric ring, in contact with a lower surface of the edge ring, and formed of a material having a third resistivity value greater than the first resistivity value, wherein the third resistivity value is a value of 90 ?cm to 1000 ?cm.

Abstract: A digital 3D model of a component to be analyzed is obtained. The component includes regularly patterned holes. A first portion of the model is identified. The first portion includes the regularly patterned holes. A second portion of the model is identified. The second portion includes parts of the model lacking the regularly patterned holes. A flow factor of the first portion is determined. The flow factor indicates flow characteristics of fluid flowing through the first portion with the regularly patterned holes. A numerical fluid simulation is performed using a mesh representative of the component geometry. Performing the numerical fluid simulation includes modifying a flow property of the fluid simulation in the first portion based at least in part on the flow factor.

Abstract: A thermoplastic resin composition includes 100 parts by weight of a base resin including 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (a) containing conjugated diene rubber having a particle diameter of 0.05 ?m to 0.2 ?m, 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (b) containing conjugated diene rubber having a particle diameter of greater than 0.2 ?m and less than or equal to 0.5 ?m, and 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer (c); and more than 0.01 parts by weight and less than 2 parts by weight of a compound having a kinematic viscosity (25° C.) greater than 5 cSt and less than 200 cSt. The resin composition has excellent plating characteristics.

Abstract: Disclosed is a thermoplastic resin composition, a method of preparing the same, and a molded article including the same, including a thermoplastic resin composition including 100 parts by weight of a base resin (A) including a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound graft copolymer (A-1) and an aromatic vinyl compound-vinyl cyanide compound copolymer (A-2); 0.1 to 32 parts by weight of a polymer (B) having a weight average molecular weight of greater than 500,000 g/mol and containing an unshared electron pair; 0.1 to 5 parts by weight of an inorganic antibacterial agent (C) including one or more carriers selected from the group consisting of phosphate glass, silica gel, calcium phosphate, and zirconium sodium phosphate; and 0.2 to 10 parts by weight of zinc oxide (D) having a BET surface area of 28 m2/g or more, a method of preparing the thermoplastic resin composition, and a molded article including the thermoplastic resin composition.

Abstract: A thermoplastic resin composition includes 100 parts by weight of a base resin including 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (a) containing conjugated diene rubber having a particle diameter of 0.05 ?m to 0.2 ?m, 5 to 40% by weight of a vinyl cyanide compound-conjugated diene rubber-aromatic vinyl compound graft copolymer (b) containing conjugated diene rubber having a particle diameter of greater than 0.2 ?m and less than or equal to 0.5 ?m, and 50 to 80% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer (c); and more than 0.01 parts by weight and less than 2 parts by weight of a compound having a kinematic viscosity (25° C.) greater than 5 cSt and less than 200 cSt. The resin composition has excellent plating characteristics.

Abstract: A viscometer measures the rheological properties of polymers over a wide range of temperature, shear-rate and cure conditions, so that it can be used with extremely fast-changing resinous materials such as fast curing thermosets and fast crystallizing thermoplastics. The viscometer uses a mold made of three plates, clamped together during testing, with the center plate having at least one cavity (reservoir) and a slit from each reservoir to the ambient conditions outside the viscometer. Resin is injected into the reservoir in a short period of time. After filling the reservoir, the sample is heated to a test temperature through heat conduction from the reservoir wall. The heating is rapid because of the small thickness of the reservoir. The rapid filling and heating properties of the apparatus makes the rheology measurement of fast changing polymers possible. The sample is put under pressure by a piston and forced to continuously flow through the slit.

Abstract: A new method and device to encapsulate integrated circuits such as flip chips and BGA packages. A special mold to surrounds the chip to be encapsulated in a cavity, and the encapsulant is injected into the cavity at an elevated pressure, and possibly at an elevated temperature. This shortens the cavity filling time by two or three orders of magnitude, compared to the conventional dispensing process. The reliability of the package is increased by increasing the adhesion of encapsulant to the package, by controlling fillet shape through in-mold curing, and by completely filling the cavity through proper mold design and, optionally, evacuation of the cavity prior to injection. The invention also allows the use of a wider range of encapsulants, including highly viscous material, fast curing materials and reworkable materials.

Abstract: A new method and device to encapsulate integrated circuits such as flip chips and BGA packages. A special mold to surrounds the chip to be encapsulated in a cavity, and the encapsulant is injected into the cavity at an elevated pressure, and possibly at an elevated temperature. This shortens the cavity filling time by two or three orders of magnitude, compared to the conventional dispensing process. The reliability of the package is increased by increasing the adhesion of encapsulant to the package, by controlling fillet shape through in-mold curing, and by completely filling the cavity through proper mold design and, optionally, evacuation of the cavity prior to injection. The invention also allows the use of a wider range of encapsulants, including highly viscous material, fast curing materials and reworkable materials.