Patents by Inventor Seliyan Sivaperumal

Seliyan Sivaperumal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe, semiconductor package including a leadframe and method for producing a leadframe
    Patent number: 9013030
    Abstract: A lead frame includes a die pad and a lead finger with an inner portion which is configured to be electrically connected to contact pads of a die and with an outer portion which has an attach portion. The attach portion is configured to be soldered to an external solder pad, wherein the attach portion has a width, a length and a thickness. An opening extends through the thickness of the attach portion.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: April 21, 2015
    Assignee: Infineon Technologies AG
    Inventors: Seliyan Sivaperumal, Wai Win Edwin Liew