Patents by Inventor Semicoa Corporation

Semicoa Corporation has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hermetic Surface Mount Packages for Diodes and Transistors
    Publication number: 20130099369
    Abstract: A discrete semiconductor package includes a discrete semiconductor device disposed upon a non-conductive substrate, with via-connected upper and lower conductive ports. By utilizing a plurality of vias to connect the ports within the non-conductive substrate, and by depositing metals directly upon the surface of the substrate, manufacturing of such semiconductor packages is cheaper and more effective.
    Type: Application
    Filed: October 19, 2012
    Publication date: April 25, 2013
    Applicant: SEMICOA CORPORATION
    Inventor: Semicoa Corporation