Patents by Inventor SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGAI) CORPORATION

SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGAI) CORPORATION has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130228833
    Abstract: A device and method for integrated circuits with surrounding gate structures are disclosed. The device includes a semiconductor substrate and a fin structure on the semiconductor substrate. The fin structure is doped with a first conductivity type and includes a source region at one distal end and a drain region at the opposite distal end. The device further includes a gate structure overlying a channel region disposed between the source and drain regions of the fin structure. The fin structure has a rectangular cross-sectional bottom portion and an arched cross-sectional top portion. The arched cross-sectional top portion is semi-circular shaped and has a radius that is equal to or smaller than the height of the rectangular cross-sectional bottom portion. The source, drain, and the channel regions each are doped with dopants of the same polarity and the same concentration.
    Type: Application
    Filed: March 21, 2013
    Publication date: September 5, 2013
    Applicant: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGAI) CORPORATION
    Inventor: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGAI) CORPORATION