Patents by Inventor Semira M. Azadzoi

Semira M. Azadzoi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11375609
    Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: June 28, 2022
    Assignee: RAYTHEON COMPANY
    Inventors: Thomas V. Sikina, James E. Benedict, John P. Haven, Andrew R. Southworth, Semira M. Azadzoi
  • Patent number: 11089687
    Abstract: A method of manufacturing a power divider circuit includes milling a conductive material disposed upon a first substrate to form a signal trace. The signal trace includes a division from a single trace to two arm traces, with each of the two arm traces having a proximal end electrically connected to the single trace and a distal end electrically connected to each of two secondary traces. The method further includes depositing a resistive ink between the two distal ends to form a resistive electrical connection between the two arm traces, bonding a second substrate to the first substrate to substantially encapsulate the traces between the first substrate and the second substrate, and milling through at least one of the first substrate or the second substrate to provide access to at least one of the traces. A signal divider is further disclosed.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: August 10, 2021
    Assignee: RAYTHEON COMPANY
    Inventors: Jonathan E. Nufio-Molina, Thomas V. Sikina, James E. Benedict, Andrew R. Southworth, Semira M. Azadzoi
  • Publication number: 20210059043
    Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
    Type: Application
    Filed: November 6, 2020
    Publication date: February 25, 2021
    Inventors: Thomas V. Sikina, James E. Benedict, John P. Haven, Andrew R. Southworth, Semira M. Azadzoi
  • Patent number: 10849219
    Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 24, 2020
    Assignee: RAYTHEON COMPANY
    Inventors: Thomas V. Sikina, James E. Benedict, John P. Haven, Andrew R. Southworth, Semira M. Azadzoi
  • Patent number: 10813210
    Abstract: A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: October 20, 2020
    Assignee: RAYTHEON COMPANY
    Inventors: Semira M. Azadzoi, James E. Benedict, John P. Haven, Thomas V. Sikina, Andrew R. Southworth
  • Publication number: 20190269007
    Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 29, 2019
    Inventors: Thomas V. Sikina, James E. Benedict, John P. Haven, Andrew R. Southworth, Semira M. Azadzoi
  • Publication number: 20190269021
    Abstract: A method of manufacturing a power divider circuit includes milling a conductive material disposed upon a first substrate to form a signal trace. The signal trace includes a division from a single trace to two arm traces, with each of the two arm traces having a proximal end electrically connected to the single trace and a distal end electrically connected to each of two secondary traces. The method further includes depositing a resistive ink between the two distal ends to form a resistive electrical connection between the two arm traces, bonding a second substrate to the first substrate to substantially encapsulate the traces between the first substrate and the second substrate, and milling through at least one of the first substrate or the second substrate to provide access to at least one of the traces. A signal divider is further disclosed.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 29, 2019
    Inventors: Jonathan E. Nufio-Molina, Thomas V. Sikina, James E. Benedict, Andrew R. Southworth, Semira M. Azadzoi
  • Publication number: 20190150271
    Abstract: A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 16, 2019
    Inventors: Semira M. Azadzoi, James E. Benedict, John P. Haven, Thomas V. Sikina, Andrew R. Southworth