Abstract: A concentrated dispersion of nanometric silver particles, and a method of producing the dispersion, the dispersion including a first solvent; a plurality of nanometric silver particles, in which a majority are single-crystal silver particles, the plurality of nanometric silver particles having an average secondary particle size (d50) within a range of 30 to 300 nanometers, the particles disposed within the solvent; and at least one dispersant; wherein a concentration of the silver particles within the dispersion is within a range of 30% to 75%, by weight, and wherein a concentration of the dispersant is within a range of 0.2% to 30% of the concentration of the silver particles, by weight.

Abstract: There is provided a formulation containing nanometric single-crystal metallic copper particles, and a method of producing the formulation.

Abstract: A formulation containing particulate matter including nanometric metallic copper particles, at least 10% of the particulate matter being single-crystal metallic copper particles, the particulate matter having an average secondary particle size (d50) within a range of 20 to 200 nanometers, the nanometric metallic copper particles being at least partially covered by at least one dispersant; a concentration ratio of crystalline cuprous oxide particles to the nanometric metallic copper particles, within the particulate matter, being at most 0.4; the formulation including a solvent, the particulate matter and the solvent forming a dispersion.

Abstract: A concentrated dispersion of nanometric silver particles, and a method of producing the dispersion, the dispersion including a first solvent; a plurality of nanometric silver particles, in which a majority are single-crystal silver particles, the plurality of nanometric silver particles having an average secondary particle size (d50) within a range of 30 to 300 nanometers, the particles disposed within the solvent; and at least one dispersant; wherein a concentration of the silver particles within the dispersion is within a range of 30% to 75%, by weight, and wherein a concentration of the dispersant is within a range of 0.2% to 30% of the concentration of the silver particles, by weight.

Abstract: A concentrated dispersion of nanometric silver particles, and a method of producing the dispersion, the dispersion including a first solvent; a plurality of nanometric silver particles, in which a majority are single-crystal silver particles, the plurality of nanometric silver particles having an average secondary particle size (d50) within a range of 30 to 300 nanometers, the particles disposed within the solvent; and at least one dispersant; wherein a concentration of the silver particles within the dispersion is within a range of 30% to 75%, by weight, and wherein a concentration of the dispersant is within a range of 0.2% to 30% of the concentration of the silver particles, by weight.

Abstract: There is provided a formulation containing nanometric single-crystal metallic copper particles, and a method of producing the formulation.

Abstract: A formulation containing nanometric single-crystal metallic copper particles, and a method of producing the formulation.

Abstract: A concentrated dispersion of nanometric silver particles, and a method of producing the dispersion, the dispersion including a first solvent; a plurality of nanometric silver particles, in which a majority are single-crystal silver particles, the plurality of nanometric silver particles having an average secondary particle size (d50) within a range of 30 to 300 nanometers, the particles disposed within the solvent; and at least one dispersant; wherein a concentration of the silver particles within the dispersion is within a range of 30% to 75%, by weight, and wherein a concentration of the dispersant is within a range of 0.2% to 30% of the concentration of the silver particles, by weight.

Abstract: A concentrated dispersion of nanometric silver particles, and a method of producing the dispersion, the dispersion including a first solvent; a plurality of nanometric silver particles, in which a majority are single-crystal silver particles, the plurality of nanometric silver particles having an average secondary particle size (d50) within a range of 30 to 300 nanometers, the particles disposed within the solvent; and at least one dispersant; wherein a concentration of the silver particles within the dispersion is within a range of 30% to 75%, by weight, and wherein a concentration of the dispersant is within a range of 0.2% to 30% of the concentration of the silver particles, by weight.

Abstract: A formulation containing nanometric single-crystal metallic copper particles, and a method of producing the formulation.

Abstract: A concentrated dispersion of nanometric silver particles, and a method of producing the dispersion, the dispersion including a first solvent; a plurality of nanometric silver particles, in which a majority are single-crystal silver particles, the plurality of nanometric silver particles having an average secondary particle size (d50) within a range of 30 to 300 nanometers, the particles disposed within the solvent; and at least one dispersant; wherein a concentration of the silver particles within the dispersion is within a range of 30% to 75%, by weight, and wherein a concentration of the dispersant is within a range of 0.2% to 30% of the concentration of the silver particles, by weight.

Abstract: A conditioning process including the steps of: (a) providing a system including: (i) a workpiece having a metal working surface; (ii) a contact surface, disposed generally opposite the working surface, the contact surface including an organic, polymeric material and (iii) a plurality of particles, including abrasive particles, the plurality of particles disposed between the contact surface and the working surface, and (b) treating the workpiece so as to: (i) effect an at least partially elastic interaction between the contact surface and the abrasive particles such that at least a portion of the abrasive particles penetrate the working surface, and (ii) incorporate organic particles into the metal working surface, thereby producing a modified working surface, wherein the treating of the workpiece includes a lapping process including: (i) exerting a load on the contact surface and the metal working surface, and (ii) applying a relative motion between the metal working surface and the contact surface.

Abstract: A conditioning process including the steps of: (a) providing a system including: (i) a workpiece having a metal working surface; (ii) a contact surface, disposed generally opposite the working surface, the contact surface including an organic, polymeric material and (iii) a plurality of particles, including abrasive particles, the plurality of particles disposed between the contact surface and the working surface, and (b) treating the workpiece so as to: (i) effect an at least partially elastic interaction between the contact surface and the abrasive particles such that at least a portion of the abrasive particles penetrate the working surface, and (ii) incorporate organic particles into the metal working surface, thereby producing a modified working surface, wherein the treating of the workpiece includes a lapping process including: (i) exerting a load on the contact surface and the metal working surface, and (ii) applying a relative motion between the metal working surface and the contact surface.

Abstract: A tribological system including: a tribological workpiece having a working surface adapted for moving relative to a counter-surface in a presence of a lubricant, in a load-bearing environment, the working surface for disposing generally opposite the counter-surface, the working surface having: (i) a metal surface layer; (ii) a plurality of organic particles incorporated in the metal surface layer, and (iii) a plurality of inorganic particles incorporated in the working surface, the inorganic particles having a Mohs hardness of at least 8.

Abstract: A mechanical device for lapping, and a method therefore, the device including: (a) a metal workpiece having a metal working surface; (b) a contact surface, disposed generally opposite the working surface, for moving in a relative motion to the working surface; (c) abrasive particles disposed between the contact surface and the working surface, and (d) a mechanism, associated with the working surface and/or the contact surface, for applying the relative motion, and for exerting a load in a substantially normal direction to the contact surface and the working surface, the contact surface for providing an at least partially elastic interaction with the plurality of abrasive particles, wherein, associated with the contact surface is a particulate additive, and wherein, upon activation of the mechanism, the relative motion under the load causes a portion of the abrasive particles to penetrate the working surface, and wherein the relative motion under the load effects incorporation of a portion of the particulate a

Abstract: A mechanical device and method for lapping a metal working surface, the device including: (a) a workpiece having the metal working surface; (b) a contact surface, disposed generally opposite the working surface, for moving in a relative motion to the working surface; (c) a plurality of abrasive particles, disposed between the contact surface and the working surface, and (d) a mechanism, associated with at least one of the surfaces, for applying the relative motion, and for exerting a load on the contact surface and the working surface, the contact surface for providing an at least partially elastic interaction with the abrasive particles, wherein, associated with the contact surface is a particulate additive material, and wherein, upon activation of the mechanism, the relative motion under the load causes a portion of the abrasive particles to lap the working surface, and wherein the relative motion under the load effects incorporation of a portion of the particulate additive material into the working surface

Abstract: A tribological system including: a tribological workpiece having a working surface adapted for moving relative to a counter-surface in a presence of a lubricant, in a load-bearing environment, the working surface for disposing generally opposite the counter-surface, the working surface having: (i) a metal surface layer; (ii) a plurality of organic particles incorporated in the metal surface layer, and (iii) a plurality of inorganic particles incorporated in the working surface, the inorganic particles having a Mohs hardness of at least 8.

Abstract: A tribological system including: a tribological workpiece having a working surface adapted for moving relative to a counter-surface in a presence of a lubricant, in a load-bearing environment, the working surface for disposing generally opposite the counter-surface, the working surface having: (i) a metal surface layer; (ii) a plurality of organic particles incorporated in the metal surface layer, and (iii) a plurality of inorganic particles incorporated in the working surface, the inorganic particles having a Mohs hardness of at least 8.

Abstract: A method of operating a tribological system including the steps of: (a) providing a workpiece having a tribological working surface, the working surface including: (i) a metal surface layer; (ii) a plurality of organic particles intimately incorporated in the metal surface layer, and (iii) a plurality of inorganic particles incorporated in the working surface, the inorganic particles having a Mohs hardness of at least 8; (b) providing a counter-surface disposed opposite the working surface; (c) disposing a lubricant between the working surface and the counter-surface; (d) providing at least one mechanism, associated with at least one of the working surface and the second surface, for applying a relative motion between the surfaces, and for exerting a load on the surfaces; (e) exerting the load between the working surface and the counter-surface, and (f) applying the relative motion between the working surface and the counter-surface.

Abstract: A mechanical system for lapping a metal working surface, including: (a) a workpiece having the metal working surface; (b) a lapping tool having a contact surface, the contact surface for disposing generally opposite the working surface, the contact surface including an organic, polymeric material; (c) a plurality of particles, including abrasive particles, the abrasive particles for disposing between the contact surface and the working surface, and (d) a mechanism, associated with at least one of the working and contact surfaces, for applying a relative motion between the contact surface and the metal working surface, and for exerting a load on the contact surface and the working surface, the contact surface for providing an at least partially elastic interaction with the plurality of abrasive particles, and wherein the contact surface and the mechanism are designed and configured, and the plurality of particles is selected, such that upon activation of the mechanism, the relative motion under the load effect