Patents by Inventor Semyon Sherstinsky
Semyon Sherstinsky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7907384Abstract: A substrate support has an electrostatic chuck comprising an electrostatic puck with a dielectric covering an electrode capable of being charged to energize a process gas. The chuck has a frontside surface to receive a substrate and a base plate having an annular flange. A spring loaded heat transfer plate contacts the base plate, and has a fluid channel comprising first and second spiral channels. A pedestal is below the heat transfer plate.Type: GrantFiled: December 4, 2008Date of Patent: March 15, 2011Assignee: Applied Materials, Inc.Inventors: Karl Brown, Semyon Sherstinsky, Wei W. Wang, Cheng-Hsiung Tsai, Vineet Mehta, Allen Lau, Steve Sansoni
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Patent number: 7697260Abstract: An electrostatic chuck is capable of attachment to a pedestal in a process chamber. The chuck has an electrostatic puck comprises a ceramic body with an embedded electrode. The ceramic body has a substrate support surface with an annular periphery. The chuck also has a base plate below the electrostatic puck that is a composite of a ceramic material and a metal. The base plate has an annular flange extending beyond the periphery of the ceramic body. The base plate and electrostatic puck can be supported by a support pedestal having a housing and an annular ledge that extends outwardly from the housing to attach to the annular flange of the base plate. A heat transfer plate having an embedded heat transfer fluid channel can also be provided.Type: GrantFiled: March 31, 2004Date of Patent: April 13, 2010Assignee: Applied Materials, Inc.Inventors: Karl Brown, Nora Arellano, Semyon Sherstinsky, Allen Lau, Cheng-Hsiung Tsai, Vineet Mehta, Steve Sansoni, Wei W. Wang
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Publication number: 20090201622Abstract: A substrate support has an electrostatic chuck comprising an electrostatic puck with a dielectric covering an electrode capable of being charged to energize a process gas. The chuck has a frontside surface to receive a substrate and a base plate having an annular flange. A spring loaded heat transfer plate contacts the base plate, and has a fluid channel comprising first and second spiral channels. A pedestal is below the heat transfer plate.Type: ApplicationFiled: December 4, 2008Publication date: August 13, 2009Inventors: Karl Brown, Semyon Sherstinsky, Wei W. Wang, Cheng-Hsiung Tsai, Vineet Mehta, Allen Lau, Steve Sansoni
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Patent number: 7480129Abstract: A detachable electrostatic chuck can be attached to a pedestal in a process chamber. The electrostatic chuck has an electrostatic puck comprising a dielectric covering at least one electrode and a frontside surface to receive a substrate. A backside surface of the chuck has a central protrusion that can be a D-shaped mesa to facilitate alignment with a mating cavity in the pedestal. The protrusion can also have asymmetrically offset apertures, which further assist alignment, and also serve to receive electrode terminal posts and a gas tube. A heat transfer plate having an embedded heat transfer fluid channel is spring loaded on the pedestal to press against the chuck for good heat transfer.Type: GrantFiled: September 7, 2005Date of Patent: January 20, 2009Assignee: Applied Materials, Inc.Inventors: Karl Brown, Semyon Sherstinsky, Wei W. Wang, Cheng-Hsiung Tsai, Vineet Mehta, Allen Lau, Steve Sansoni
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Patent number: 7252737Abstract: Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.Type: GrantFiled: April 6, 2004Date of Patent: August 7, 2007Assignee: Applied Materials, Inc.Inventors: Karl Brown, Vineet Mehta, See-Eng Phan, Semyon Sherstinsky, Allen Lau
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Patent number: 7244344Abstract: A physical vapor deposition plasma reactor includes a vacuum chamber including a sidewall, a ceiling and a wafer support pedestal near a floor of the chamber, and a vacuum pump coupled to the chamber, a process gas inlet coupled to the chamber and a process gas source coupled to the process gas inlet, a metal sputter target at the ceiling, a high voltage D.C. source coupled to the sputter target, an RF plasma source power generator coupled to the wafer support pedestal and having a frequency in a range between about 60 MHz and 81 MHz, and an RF plasma bias power generator coupled to the wafer support pedestal and having a frequency suitable for coupling energy to plasma ions.Type: GrantFiled: May 25, 2005Date of Patent: July 17, 2007Assignee: Applied Materials, Inc.Inventors: Karl M. Brown, John Pipitone, Vineet Mehta, Ralf Hofmann, Wei W. Wang, Semyon Sherstinsky
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Publication number: 20060169576Abstract: A physical vapor deposition plasma reactor includes a vacuum chamber including a sidewall, a ceiling and a wafer support pedestal near a floor of the chamber, and a vacuum pump coupled to the chamber, a process gas inlet coupled to the chamber and a process gas source coupled to the process gas inlet, a metal sputter target at the ceiling, a high voltage D.C. source coupled to the sputter target, an RF plasma source power generator coupled to the wafer support pedestal and having a frequency in a range between about 60 MHz and 81 MHz, and an RF plasma bias power generator coupled to the wafer support pedestal and having a frequency suitable for coupling energy to plasma ions.Type: ApplicationFiled: May 25, 2005Publication date: August 3, 2006Inventors: Karl Brown, John Pipitone, Vineet Mehta, Ralf Hofmann, Wei Wang, Semyon Sherstinsky
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Publication number: 20060002053Abstract: A detachable electrostatic chuck can be attached to a pedestal in a process chamber. The electrostatic chuck has an electrostatic puck comprising a dielectric covering at least one electrode and a frontside surface to receive a substrate. A backside surface of the chuck has a central protrusion that can be a D-shaped mesa to facilitate alignment with a mating cavity in the pedestal. The protrusion can also have asymmetrically offset apertures, which further assist alignment, and also serve to receive electrode terminal posts and a gas tube. A heat transfer plate having an embedded heat transfer fluid channel is spring loaded on the pedestal to press against the chuck for good heat transfer.Type: ApplicationFiled: September 7, 2005Publication date: January 5, 2006Inventors: Karl Brown, Semyon Sherstinsky, Wei Wang, Cheng-Hsiung Tsai, Vineet Mehta, Allen Lau, Steve Sansoni
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Publication number: 20050219786Abstract: An electrostatic chuck is capable of attachment to a pedestal in a process chamber. The chuck has an electrostatic puck comprises a ceramic body with an embedded electrode. The ceramic body has a substrate support surface with an annular periphery. The chuck also has a base plate below the electrostatic puck that is a composite of a ceramic material and a metal. The base plate has an annular flange extending beyond the periphery of the ceramic body. The base plate and electrostatic puck can be supported by a support pedestal having a housing and an annular ledge that extends outwardly from the housing to attach to the annular flange of the base plate. A heat transfer plate having an embedded heat transfer fluid channel can also be provided.Type: ApplicationFiled: March 31, 2004Publication date: October 6, 2005Inventors: Karl Brown, Nora Arellano, Semyon Sherstinsky, Allen Lau, Cheng-Hsiung Tsai, Vineet Mehta, Steve Sansoni, Wei Wang
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Publication number: 20050056370Abstract: Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.Type: ApplicationFiled: April 6, 2004Publication date: March 17, 2005Inventors: Karl Brown, Vineet Mehta, See-Eng Phan, Semyon Sherstinsky, Allen Lau
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Patent number: 6837968Abstract: Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.Type: GrantFiled: September 23, 2003Date of Patent: January 4, 2005Assignee: Applied Materials, Inc.Inventors: Karl Brown, Vineet Mehta, See-Eng Phan, Semyon Sherstinsky, Allen Lau
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Publication number: 20040083977Abstract: Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.Type: ApplicationFiled: September 23, 2003Publication date: May 6, 2004Applicant: Applied Materials, Inc.Inventors: Karl Brown, Vineet Mehta, See-Eng Phan, Semyon Sherstinsky, Allen Lau
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Patent number: 6726805Abstract: Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.Type: GrantFiled: April 24, 2002Date of Patent: April 27, 2004Assignee: Applied Materials, Inc.Inventors: Karl Brown, Vineet Mehta, See-Eng Phan, Semyon Sherstinsky, Allen Lau
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Patent number: 6652713Abstract: Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.Type: GrantFiled: August 9, 2001Date of Patent: November 25, 2003Assignee: Applied Materials, Inc.Inventors: Karl Brown, Vineet Mehta, See-Eng Phan, Semyon Sherstinsky, Allen Lau
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Patent number: 6557248Abstract: A method of fabricating an electrostatic member 33 for holding a substrate 45 in a process chamber 80 containing erosive process gas. The method comprises the steps of forming an electrostatic member 33 comprising an insulator or dielectric layer 35 covering an electrically conductive layer, and shaping the electrostatic member 33 to form a dielectric covered electrode and an electrical connector 55 attached to the dielectric covered electrode 50 to conduct charge to the dielectric covered electrode 50.Type: GrantFiled: May 29, 1998Date of Patent: May 6, 2003Assignee: Applied Materials Inc.Inventors: Shamouil Shamouilian, Manoocher Birang, John F. Cameron, Chandra Deshpandey, Alfred Goldspeil, Ron Northrup, Semyon Sherstinsky, Sasson Someth
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Publication number: 20030029568Abstract: Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.Type: ApplicationFiled: August 9, 2001Publication date: February 13, 2003Applicant: Applied Materials, Inc.Inventors: Karl Brown, Vineet Mehta, See-Eng Phan, Semyon Sherstinsky, Allen Lau
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Publication number: 20030029564Abstract: Generally, a substrate support member for supporting a substrate is provided. In one embodiment, a substrate support member for supporting a substrate includes a body coupled to a lower shield. The body has an upper surface adapted to support the substrate and a lower surface. The lower shield has a center portion and a lip. The lip is disposed radially outward of the body and projects towards a plane defined by the first surface. The lip is disposed in a spaced-apart relation from the body. The lower shield is adapted to interface with an upper shield disposed in a processing chamber to define a labyrinth gap that substantially prevents plasma from migrating below the member. The lower shield, in another embodiment, provides the plasma with a short RF ground return path.Type: ApplicationFiled: April 24, 2002Publication date: February 13, 2003Inventors: Karl Brown, Vineet Mehta, See-Eng Phan, Semyon Sherstinsky, Allen Lau
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Patent number: 6464790Abstract: The present invention generally provides a support member adapted to provide vacuum chucking. In one aspect, a support member having an upper surface having an outer, raised portion defining an inner, recessed portion is provided. The inner recessed portion is in fluid communication with a vacuum supply. The support member may include a plurality of raised support portions having one or more recessed portions adjacent thereto, the raised support portions having equal heights above the recessed portions. The transition between the raised portions and the recessed portions is gradual and the orifices formed by the holes extending through the upper surface of the substrate support are rounded to eliminate sharp edges and rapid changes in height at the upper surface.Type: GrantFiled: March 17, 2000Date of Patent: October 15, 2002Assignee: Applied Materials, Inc.Inventors: Semyon Sherstinsky, Arnold Kholodenko, Calvin Augason, Samuel Wilson, Michael Phillips, Leonel Zuniga
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Patent number: 6464795Abstract: A support member for supporting a substrate in a process chamber, the support member having a substrate support surface with one or more isolated recessed areas. A vacuum channel and a gas channel are formed in the support member along a common plane and are coupled to a vacuum source and gas source respectively. The gas channel comprises two or more concentrically disposed annular gas channels encompassing the vacuum channel. The vacuum channel is coupled to the support surface, and in particular to the one or more recessed areas, by a plurality of conduits. A portion of the conduits is disposed diametrically exterior to at least one of the annular gas channels and communicates with the vacuum channel via bypass channels.Type: GrantFiled: May 3, 2000Date of Patent: October 15, 2002Assignee: Applied Materials, Inc.Inventors: Semyon Sherstinsky, Calvin Augason, Leonel A. Zuniga, Jun Zhao, Talex Sajoto, Leonid Selyutin, Joseph Yudovsky, Maitreyee Mahajani, Steve G. Ghanayem, Tai T. Ngo, Arnold Kholodenko
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Patent number: 6350320Abstract: A gas delivery apparatus and method for directing a flow of gas to the edge of a substrate at an angle to the radial direction of the substrate is provided. The apparatus directs the gas from a gas opening, over a plurality of grooves that are angled relative to a radial line originating at a center of the gas delivery apparatus. Subsequently, the gas is flowed over a portion of the substrate to prevent reactive gases from depositing on selective portions of the substrate.Type: GrantFiled: February 22, 2000Date of Patent: February 26, 2002Assignee: Applied Materials, Inc.Inventors: Semyon Sherstinsky, Alison Gilliam, Paul Smith, Leonel A. Zuniga, Ted Yoshidome, Nitin Khurana, Rod Mosely, Umesh Madhav Kelkar, Joseph Yudovsky, Alan Popiolkowski