Patents by Inventor Sen Chen

Sen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11973528
    Abstract: Embodiments of the present application disclose a protective case for a portable electronic device, which includes a rear shell and a camera decorative ring, the rear shell includes a back plate and a clamping element, the back plate is provided with an avoidance hole, and the inner wall surface of the avoidance hole is provided with a first retention groove, the outer peripheral surface of the camera decorative ring is provided with a limit surface, and a limit part is formed between the limit surface and the inner end surface of the camera decorative ring; the limit part is embedded in the first retention groove, and the inner end surface of the camera decorative ring is evenly aligned with or lower than the inner surface of the back plate.
    Type: Grant
    Filed: August 10, 2023
    Date of Patent: April 30, 2024
    Assignee: SHENZHEN LINGYI INNOVATION TECHNOLOGY CO., LTD
    Inventors: Yanghui Zheng, Sen Qiu, Yanghong Zheng, Jingyan Zheng, Qiushun Liu, Shaohua Chen
  • Publication number: 20240136420
    Abstract: A thin film transistor includes a substrate, a semiconductor layer, a gate insulating layer, a gate, a source and a drain. The semiconductor layer is located above the substrate. The gate insulating layer is located above the semiconductor layer. The gate is located above the gate insulating layer and overlapping with the semiconductor layer. The gate includes a first portion, a second portion and a third portion. The first portion is extending along the surface of the gate insulating layer and directly in contact with the gate insulating layer. The second portion is separated from the gate insulating layer. Taking the surface of the gate insulating layer as a reference, the top surface of the second portion is higher than the top surface of the first portion. The third portion connects the first portion to the second portion. The source and the drain are electrically connected to the semiconductor layer.
    Type: Application
    Filed: December 1, 2022
    Publication date: April 25, 2024
    Applicant: AUO Corporation
    Inventors: Kuo-Jui Chang, Wen-Tai Chen, Chi-Sheng Chiang, Yu-Chuan Liao, Chien-Sen Weng, Ming-Wei Sun
  • Publication number: 20240108975
    Abstract: Disclosed are a multidirectional input device, a game machine handle, and a game machine. The multidirectional input device includes a housing, an operation body, a pressing board, a resetting assembly, a circuit board, and a magnetic induction assembly. A space is formed in the housing, and an opening portion is formed at an upper portion of the space. The operation body includes an operation portion protruding upwards from the opening portion. The pressing board is shaped in a disc. The resetting assembly includes a spiral spring. One end of the spiral spring is configured to press a top of the pressing board onto a lower portion of the operation body, and another end of the spiral spring is configured to press a bottom of the space. The circuit board is provided in the space. The magnetic induction assembly includes a magnetic body and a magnetic sensor.
    Type: Application
    Filed: July 19, 2023
    Publication date: April 4, 2024
    Applicant: SHENZHEN ZESUM TECHNOLOGY CO., LTD.
    Inventors: Yusho NAKASE, Sen YANG, Shiying YANG, Chaoxian CHEN
  • Publication number: 20240113080
    Abstract: A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device using blocks, e.g., discrete connection blocks, having through vias and/or integrated passive devices formed therein are provided. Embodiments such as those disclosed herein may be utilized in PoP applications. In an embodiment, the semiconductor device includes a die and a connection block encased in a molding compound. Interconnection layers may be formed on surfaces of the die, the connection block and the molding compound. One or more dies and/or packages may be attached to the interconnection layers.
    Type: Application
    Filed: November 30, 2023
    Publication date: April 4, 2024
    Inventors: Ching-Wen Hsiao, Chen-Shien Chen, Wei Sen Chang, Shou-Cheng Hu
  • Patent number: 11947977
    Abstract: Embodiments are generally directed to a system and method for adapting executable object to a processing unit. An embodiment of a method to adapt an executable object from a first processing unit to a second processing unit, comprises: adapting the executable object optimized for the first processing unit of a first architecture, to the second processing unit of a second architecture, wherein the second architecture is different from the first architecture, wherein the executable object is adapted to perform on the second processing unit based on a plurality of performance metrics collected while the executable object is performed on the first processing unit and the second processing unit.
    Type: Grant
    Filed: December 23, 2022
    Date of Patent: April 2, 2024
    Assignee: INTEL CORPORATION
    Inventors: Li Xu, Haihao Xiang, Feng Chen, Travis Schluessler, Yuheng Zhang, Sen Lin
  • Publication number: 20240091980
    Abstract: The present disclosure provides a fire retardant wood, a preparation method thereof, and a use of metal halide. The preparation method of fire retardant wood includes: impregnating a wood with a salt solution. By injecting low-cost metal halide into the interior of wood, the present disclosure obtains wood with natural color and texture and high flame retardant ability, which is very suitable for use in decorative environment and is expected to be applied in many fields such as furniture, architecture, shipbuilding and ancient wood preservation.
    Type: Application
    Filed: June 7, 2023
    Publication date: March 21, 2024
    Applicant: NORTHEAST FORESTRY UNIVERSITY
    Inventors: WENSHUAI CHEN, SHENGJIE LING, SEN GAO, QING LI, JING REN
  • Publication number: 20240085664
    Abstract: An imaging system lens assembly includes, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element and a fifth lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof. The second lens element with positive refractive power has an image-side surface being convex in a paraxial region thereof. The third lens element has an object-side surface being concave in a paraxial region thereof and an image-side surface being convex in a paraxial region thereof. The fifth lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof and having at least one inflection point.
    Type: Application
    Filed: October 5, 2022
    Publication date: March 14, 2024
    Applicant: LARGAN PRECISION CO., LTD.
    Inventors: Wei-Xiang FU, Jin Sen WANG, I-Hsuan CHEN, Hsin-Hsuan HUANG
  • Publication number: 20240083639
    Abstract: A one-handed press-open cosmetic container includes a bottle body assembly and a cap assembly, and the cap assembly is fixed to the snap-fit groove of the bottle neck by the clasps of the claws in the cap assembly; wherein the cap assembly includes an outer and inner cap and claws, wherein the clasps are equally spaced and L-shaped, disposed down inwardly, and the ends are provided with inwardly humped heads, the clasps are respectively snapped into the clasp holes at the top corners of the inner cap, and securely snap-fit to the snap-fit groove through the clasp head, the top center of the resilient disc surface of the claws includes an upwardly humped button column, which extends from or is disposed in the center hole of the outer cap, when a force is applied, the claws drive the clasp head to open outwardly until it detaches from the snap ring.
    Type: Application
    Filed: August 9, 2023
    Publication date: March 14, 2024
    Applicant: ZHEJIANG UKPACK PACKAGING CO., LTD.
    Inventors: Sen CHEN, Shunjin JI
  • Patent number: 11929767
    Abstract: A transmission interface between at least a first module and a second module is proposed. The transmission interface includes at least two physical transmission mediums. Each physical transmission medium is arranged to carry a multiplexed signal in which at least two signals are integrated. The at least two physical transmission mediums include a first physical transmission medium arranged to carry a first multiplexed signal including a first IF signal and a reference clock signal. The first IF signal and the reference clock signal are at different frequencies.
    Type: Grant
    Filed: August 16, 2022
    Date of Patent: March 12, 2024
    Assignee: MEDIATEK INC.
    Inventors: Chieh-Hsun Hsiao, Ming-Chou Wu, Wen-Chang Lee, Narayanan Baskaran, Wei-Hsin Tseng, Jenwei Ko, Po-Sen Tseng, Hsin-Hung Chen, Chih-Yuan Lin, Caiyi Wang
  • Publication number: 20240072013
    Abstract: A vertical light emitting diode die packaging method is provided, including a plurality of following steps. At first, a plurality of drill hole is formed in a substrate and a first metal material is used to fill the drill holes. Next, disposing and fixing a plurality of vertical light emitting diode die on the substrate through a second metal material, and a transparent glue is used to cover thereon. A laser process is then employed to dissolve the transparent glue for forming ditches. And, a conductive liquid is applied to fill the ditches and an insulating glue is provided to embrace and encapsulate the vertical light emitting diode dies. By employing the packaging method of the present invention, the current external wire bonding process can be effectively replaced, thereby die size miniaturization as well as packaging yield of the vertical light emitting diode dies are believed to be optimized.
    Type: Application
    Filed: February 7, 2023
    Publication date: February 29, 2024
    Applicant: Ingentec Corporation
    Inventors: HSIAO LU CHEN, AI SEN LIU, HSIANG AN FENG
  • Publication number: 20240069357
    Abstract: A display panel includes a plurality of sets of pixel strips extending in a first direction and arranged in a second direction, each set of pixel strips includes a plurality of sub-pixel strips in different colors, spacing between every two adjacent sub-pixels in each sub-pixel strip in the first direction is smaller than or equal to 2 ?m, each set of pixel strips is divided into a plurality of pixel islands arranged in an array in the first direction, each pixel island includes at least four sub-pixels extending in the first direction in each corresponding sub-pixel strip, a width of a view region formed by light emitted by each sub-pixel in each pixel island being propagated to a human eye through a corresponding lens is smaller than or equal to a pupil diameter.
    Type: Application
    Filed: April 28, 2021
    Publication date: February 29, 2024
    Inventors: Jian GAO, Sen MA, Xiaochuan CHEN, Tao HONG, Yanliu SUN
  • Publication number: 20240072033
    Abstract: A bonding and transferring method for die package structures is provided, including providing a die package structure which has a positioning adhesive disposed thereon, and providing a vibration base having at least one cavity corresponding to the positioning adhesive. By alignment of the positioning adhesive and the cavity, the die package structure can be positioned into the vibration base. A target substrate is further provided and bonded with the vibration base having the die package structure disposed thereon through a metal material. And a laser process is then performed to melt the metal material. At last, the vibration base and the positioning adhesive are removed so the die package structure is successfully bonded and transferred onto the target substrate. By employing the proposed process method of the present invention, rapid mass transfer result is accomplished, and the packaging yield of vertical light emitting diode die package structures is optimized.
    Type: Application
    Filed: February 7, 2023
    Publication date: February 29, 2024
    Applicant: Ingentec Corporation
    Inventors: Hsiao Lu Chen, AI SEN LIU, HSIANG AN FENG, YA LI CHEN
  • Publication number: 20240071872
    Abstract: A via-filling method of a TGV substrate includes steps: filling a plurality of metal balls into a plurality of vias of the TGV substrate; using a heating process to melt the plurality of metal balls to form a liquid-state metal; and cooling down the liquid-state metal to form a solid-state metal inside the plurality of vias. Because the method needn't use solvents or fluxes, the solid-state metal inside the plurality of vias have better electric conductivity.
    Type: Application
    Filed: February 7, 2023
    Publication date: February 29, 2024
    Applicant: Ingentec Corporation
    Inventors: Hsiao Lu Chen, AI SEN LIU, HSIANG AN FENG, YA LI CHEN
  • Publication number: 20240000488
    Abstract: A trumpet expandable vertebral device, includes: a center shaft including a cylinder body and an expanding ring connected to each other, wherein the cylinder body has a far end which has an outer thread; and an expandable portion including an end collar, a connection part and plural expandable plates, wherein the expandable portion is located outside and surrounds the center shaft, and the connection part connects the end collar with the plurality of expandable plates; wherein when the expanding ring moves toward the end collar, the trumpet expandable plates are expanded.
    Type: Application
    Filed: September 19, 2023
    Publication date: January 4, 2024
    Inventors: Li-Sen Chen, Che-Yang Chao, Wei-Tai Jao
  • Patent number: 11846254
    Abstract: An integrated propulsion system for hybrid rockets includes an oxidizer tank, a rocket engine, a pressurization device, a pressurization device and an oxidizer pipe and valve unit. The rocket engine is disposed within the oxidizer tank partially and located on a first side of the oxidizer tank. The pressurization device is disposed, at least in part, within the oxidizer tank, is located on a second side of the oxidizer tank opposite to the first side of the oxidizer tank, and is configured to regulate an overall pressure level within the oxidizer tank. The oxidizer pipe and valve unit is connected to the oxidizer tank and the rocket engine, and is configured to control feeding of an oxidizer from the oxidizer tank into the rocket engine.
    Type: Grant
    Filed: March 4, 2023
    Date of Patent: December 19, 2023
    Assignee: AT SPACE PTY LTD
    Inventor: Yen-Sen Chen
  • Publication number: 20230387103
    Abstract: A semiconductor structure is provided. At least one first well region is disposed in a semiconductor substrate and has a first conductivity type. At least one gate of a transistor is disposed over the first well region and extends in a first direction. At least one second well region and at least one third well region are disposed on opposite sides of the first well region and extend in the first direction. The second and third well regions have a second conductivity type. A first shielding structure is disposed on at least one end of the gate and partially overlaps the first well region in a vertical projection direction. The first shielding structure is separated from the end of the gate. A bulk ring is disposed in the semiconductor substrate and surrounds the gate, the second well region, the third well region, and the first shielding structure.
    Type: Application
    Filed: May 27, 2022
    Publication date: November 30, 2023
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Hsien-Feng LIAO, Jian-Hsing LEE, Chieh-Yao CHUANG, Ting-Yu CHANG, Yeh-Ning JOU, Shao-Chang HUANG, Kan-Sen CHEN, Nai-Lun CHENG, Ching-Yi HSU, Yu-Chen WU
  • Patent number: 11784441
    Abstract: A connector structure includes an insulated housing, at least one terminal assembly and at least one conductive assembly. The terminal assembly is disposed in the insulated housing. The conductive assembly is disposed at one side of the terminal assembly by crossing over the terminal assembly. The conductive assembly includes at least one metal piece and at least one polymer included conductive component. The polymer included conductive component is used to electrically connect the at least one metal pieces. The metal piece includes at least one spring finger contact, and the spring finger contact is electrically connected to the ground terminal in the terminal assembly. In additional, a terminal assembly structures of connector is also provided.
    Type: Grant
    Filed: November 15, 2021
    Date of Patent: October 10, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Tien-Fu Huang, Li-Sen Chen, Yi-Fu Chiu, I-Ting Hsieh
  • Patent number: 11773167
    Abstract: The present disclosure provides antibodies, including antibody fusions, which specifically bind to human PD-L1 protein (huPD-L1) and are capable of decreasing, inhibiting, and/or fully-blocking immune regulatory effects mediated by PD-L1, such as binding to the immune checkpoint molecule PD-1 in the tumor microenvironment. Additionally, the antibodies include fusions with the cytokine inhibitory factor, IL10, which can replenish and/or activate CD8+ T-cell cytotoxicity in the tumor microenvironment. The present disclosure also provides methods of using the antibodies (and compositions thereof) to treat diseases and conditions responsive to decreasing, inhibiting and/or blocking immune regulatory function or activity mediated by PD1 binding to PD-L1.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: October 3, 2023
    Assignee: ELIXIRON IMMUNOTHERAPEUTICS (HONG KONG) LIMITED
    Inventors: Hung-Kai Chen, Hong-Sen Chen, Huey-Wen Hsiao
  • Publication number: 20230204004
    Abstract: An integrated propulsion system for hybrid rockets includes an oxidizer tank, a rocket engine, a pressurization device, a pressurization device and an oxidizer pipe and valve unit. The rocket engine is disposed within the oxidizer tank partially and located on a first side of the oxidizer tank. The pressurization device is disposed, at least in part, within the oxidizer tank, is located on a second side of the oxidizer tank opposite to the first side of the oxidizer tank, and is configured to regulate an overall pressure level within the oxidizer tank. The oxidizer pipe and valve unit is connected to the oxidizer tank and the rocket engine, and is configured to control feeding of an oxidizer from the oxidizer tank into the rocket engine.
    Type: Application
    Filed: March 4, 2023
    Publication date: June 29, 2023
    Inventor: Yen-Sen CHEN
  • Patent number: D992550
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: July 18, 2023
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Teng Jiao Luo, Chang Sen Chen, Bo Yuan Sun, Ming Zhao, Wei Zhang