Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.

Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.

Abstract: A seat adapted to receive a wood working tool is composed of a seat body and a receiving body. The seat body has a hollow room at interior thereof. The receiving body is connected at a bottom thereof to the seat body and has a receiving hole communicated to the hollow room of the seat body, a plurality of hollowed portions disposed at a lateral periphery of the receiving body, and a plurality of spring members disposed in the receiving hole corresponding in location to the hollowed portions respectively for clamping the handle of the wood working tool which is inserted in the receiving hole of the receiving body.