Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.

Abstract: Semiconductor devices and methods of manufacture are provided wherein a metallization layer is located over a substrate, and a power grid line is located within the metallization layer. A signal pad is located within the metallization layer and the signal pad is surrounded by the power grid line. A signal external connection is electrically connected to the signal pad.

Abstract: A semiconductor device including a first die and a second die bonded to one another. The first die includes a first passivation layer over a substrate, and first bond pads in the first passivation layer. The second die includes a second passivation layer, which may be bonded to the first passivation layer, and second bond pads in the second passivation layer, which may be bonded to the first bond pads. The second bond pads include inner bond pads and outer bond pads. The outer bond pads may have a greater diameter than the inner bond pads as well as the first bond pads.

Abstract: A resistance device includes a first rotating assembly having a first rotating member, and a second rotating assembly having a second rotating member and a plurality of magnets. A transmission unit is connected to one of the rotating assemblies for driving rotation of the same. A drive unit is connected to the other one of the rotating assemblies, is configured to receive a control signal, and is configured to drive rotation of the other one of the rotating assemblies according to the received control signal. Eddy currents generated by the first rotating member provide resistance to the transmission unit. A resistance training machine having the resistance device is also disclosed.

Abstract: A resistance device includes a first rotating assembly having a first rotating member, and a second rotating assembly having a second rotating member and a plurality of magnets. A transmission unit is connected to one of the rotating assemblies for driving rotation of the same. A drive unit is connected to the other one of the rotating assemblies, is configured to receive a control signal, and is configured to drive rotation of the other one of the rotating assemblies according to the received control signal. Eddy currents generated by the first rotating member provide resistance to the transmission unit. A resistance training machine having the resistance device is also disclosed.