Abstract: A semiconductor device including a first die and a second die bonded to one another. The first die includes a first passivation layer over a substrate, and first bond pads in the first passivation layer. The second die includes a second passivation layer, which may be bonded to the first passivation layer, and second bond pads in the second passivation layer, which may be bonded to the first bond pads. The second bond pads include inner bond pads and outer bond pads. The outer bond pads may have a greater diameter than the inner bond pads as well as the first bond pads.

Abstract: A flexible-envelope type battery and an electrically conductible sealing structure thereof and an assembling method thereof are provided. The battery includes an electrode pair, a flexible envelope and a pair of electrically conductible sealing structures. Each sealing structure includes a conductive terminal and a fixed member. The conductive terminal includes a bottom board and a protruding block, for conducting an electric current from the electrode pair to the outside. The bottom board is disposed within the flexible envelope and combined with the electrode pair. The protruding block is disposed on the bottom board for passing through and protruding from an upper surface of the flexible envelope. The fixed member is for tightly fixing the flexible envelope and the conductive terminal.