Patents by Inventor Sen-Hou Ko

Sen-Hou Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050037698
    Abstract: A carrier head for a chemical mechanical polishing apparatus is described. The carrier head has a base, a rigid body, a membrane and a pressurizing structure. The rigid body is movable relative to the base and includes a downwardly-extending projection. The membrane has a mounting surface for a substrate. The membrane extends below the base to provide a chamber between the base and the membrane. The pressurizing structure applies a downward pressure on the rigid body to cause a lower surface of the rigid body to press on an inner surface of the membrane.
    Type: Application
    Filed: September 20, 2004
    Publication date: February 17, 2005
    Inventors: Steven Zuniga, Manoocher Birang, Hung Chen, Sen-Hou Ko
  • Patent number: 6824455
    Abstract: A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
    Type: Grant
    Filed: September 19, 2003
    Date of Patent: November 30, 2004
    Assignee: Applied Materials, Inc.
    Inventors: Thomas H. Osterheld, Sen-Hou Ko
  • Publication number: 20040224615
    Abstract: A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support structure is located beneath the second region and is operable to cause the second region to exert more force than the first region. The controller is operable to adjust the amount of force that is exerted by the second region.
    Type: Application
    Filed: May 6, 2003
    Publication date: November 11, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Hung Chih Chen, Steven M. Zuniga, Charles C. Garretson, Thomas H. Osterheld, Sen-Hou Ko, Mohsen Salek
  • Publication number: 20040072516
    Abstract: A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
    Type: Application
    Filed: September 19, 2003
    Publication date: April 15, 2004
    Inventors: Thomas H. Osterheld, Sen-Hou Ko
  • Publication number: 20040063385
    Abstract: A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the outer portion may be significantly less than the width of the middle portion. The carrier head may also include a flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.
    Type: Application
    Filed: September 17, 2003
    Publication date: April 1, 2004
    Inventors: Ilya Perlov, Eugene Gantvarg, Sen-Hou Ko
  • Patent number: 6699115
    Abstract: A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: March 2, 2004
    Assignee: Applied Materials Inc.
    Inventors: Thomas H Osterheld, Sen-Hou Ko
  • Publication number: 20040033769
    Abstract: A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.
    Type: Application
    Filed: January 28, 2003
    Publication date: February 19, 2004
    Applicant: Applied Materials, Inc., a Delaware corporation
    Inventors: Steven M. Zuniga, Manoocher Birang, Hung Chen, Sen-Hou Ko
  • Publication number: 20040023610
    Abstract: Embodiments of a polishing article for processing a substrate are provided. In one embodiment, a polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The conductive layer may be comprised of a soft metal and, in one embodiment, the exposed surface may be planar.
    Type: Application
    Filed: June 6, 2003
    Publication date: February 5, 2004
    Applicant: Applied Materials, Inc.
    Inventors: Yongqi Hu, Yan Wang, Alain Duboust, Feng Q. Liu, Antoine P. Manens, Siew S. Neo, Stan D. Tsai, Liang-Yuh Chen, Paul D. Butterfield, Yuan A. Tian, Sen-Hou Ko
  • Patent number: 6669538
    Abstract: The present invention generally provides a system and apparatus for cleaning a polishing pad, such as a fixed abrasive pad, in a substrate processing system. In one embodiment, the system includes one or more nozzles which spray a fluid at pressures of about 30 psi to about 300 psi or greater, as measured at the nozzle, onto a polishing pad at acute angles to the surface of the polishing pad. The nozzles can spray downward and outward toward the perimeter of the pad to facilitate the debris removal therefrom. The system can include a pressure source to produce a sufficient fluid pressure substantially higher than the typical fluid pressure available from a facility installation.
    Type: Grant
    Filed: February 24, 2000
    Date of Patent: December 30, 2003
    Assignee: Applied Materials Inc
    Inventors: Shijian Li, Ramin Emami, Sen-Hou Ko, Shi-Ping Wang, Fred C. Redeker, Lizhong Sun, Stan Tsai
  • Publication number: 20030224678
    Abstract: An article and method are provided for polishing a substrate surface. In one aspect, the invention provides polishing articles including a linear strip of backing material and a fibrous polishing material disposed on the backing material. The polishing material may be in the form of individual fibers, a mesh of fibers, a web of fibers, an interwoven cloth of fibers, or felt. The polishing material may be impregnated or coated with a polishing enhancing material. The polishing article may be disposed in an apparatus for processing a substrate on a platen. In operation, a substrate is contacted with the polishing article and relative motion is provided between the substrate and the polishing article to remove material from the substrate surface.
    Type: Application
    Filed: May 31, 2002
    Publication date: December 4, 2003
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Wei-Yung Hsu, Yutao Ma, Sen-Hou Ko, Daniel A. Carl
  • Patent number: 6656842
    Abstract: Deposited Cu is initially removed by CMP with fixed abrasive polishing pads stopping on the barrier layer, e.g., Ta or TaN. Buffing is then conducted selectively with respect to Cu: Ta or TaN and Cu: silicon oxide to remove the barrier layer and control dishing to no greater than 100 Å.
    Type: Grant
    Filed: September 22, 1999
    Date of Patent: December 2, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Shijian Li, Fred C. Redeker, Ramin Emami, Sen-Hou Ko, John M. White
  • Patent number: 6648740
    Abstract: A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the outer portion may be significantly less than the width of the middle portion. The carrier head may also include a flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.
    Type: Grant
    Filed: September 19, 2002
    Date of Patent: November 18, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Ilya Perlov, Eugene Gantvarg, Sen-Hou Ko
  • Publication number: 20030153189
    Abstract: Methods and compositions are provided for planarizing substrate surfaces with low dishing. Aspects of the invention provide methods of using compositions comprising an abrasive selected from the group consisting of alumina and ceria and a surfactant for chemical mechanical planarization of substrates to remove polysilicon.
    Type: Application
    Filed: February 6, 2003
    Publication date: August 14, 2003
    Applicant: Applied Materials, Inc.
    Inventors: Sen-Hou Ko, Kevin H. Song
  • Publication number: 20030092371
    Abstract: A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
    Type: Application
    Filed: December 27, 2002
    Publication date: May 15, 2003
    Applicant: Applied Materials, Inc., a Delaware corporation
    Inventors: Thomas H. Osterheld, Sen-Hou Ko
  • Patent number: 6540594
    Abstract: A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.
    Type: Grant
    Filed: February 8, 2002
    Date of Patent: April 1, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Steven M. Zuniga, Manoocher Birang, Hung Chen, Sen-Hou Ko
  • Patent number: 6520847
    Abstract: A polishing pad with a layer that provides a polishing surface. The layer has a thickness between about 0.06 and 0.12 inches, and a plurality of substantially circular grooves having a depth between about 0.02 and 0.05 inches are formed in the polishing surface.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: February 18, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Thomas H. Osterheld, Sen-Hou Ko
  • Publication number: 20030022609
    Abstract: A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the outer portion may be significantly less than the width of the middle portion. The carrier head may also include a flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.
    Type: Application
    Filed: September 19, 2002
    Publication date: January 30, 2003
    Applicant: Applied Materials, Inc., a Delaware corporation
    Inventors: Ilya Perlov, Eugene Gantvarg, Sen-Hou Ko
  • Patent number: 6511367
    Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.
    Type: Grant
    Filed: January 28, 2002
    Date of Patent: January 28, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Steven M. Zuniga, Hung Chih Chen, Manoocher Birang, Kapila Wijekoon, Sen-Hou Ko
  • Patent number: 6506104
    Abstract: A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the cuter portion may be significantly less than the width of the middle portion. The carrier head may also include a flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.
    Type: Grant
    Filed: July 18, 2001
    Date of Patent: January 14, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Ilya Perlov, Eugene Gantvarg, Sen-Hou Ko
  • Publication number: 20020137450
    Abstract: A polishing pad for a chemical mechanical polishing apparatus. The polishing pad includes a plurality of concentric circular grooves. The polishing pad may include multiple regions with grooves of different widths and spacings.
    Type: Application
    Filed: October 29, 2001
    Publication date: September 26, 2002
    Applicant: Applied Materials, Inc., a Delaware corporation
    Inventors: Thomas H. Osterheld, Sen-Hou Ko