Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.

Abstract: The present invention relates to an auto-engaging structure of a bulb assembly, which includes a holder connecting with a bulb and then received in a shell. The characteristic is that the holder is provided with an elastic hook and the shell is provided with a connector with an inner channel. When the holder is inserted into the shell, the elastic hook can be passed through the channel of the connector to provide the holder automatically engaged with the shell firmly.

Abstract: The present invention relates to a connecting structure of a bulb assembly, which includes a holder with a bulb and a shell to connect with the holder. The holder is provided with a T-shape hook, which is capable of being folded. The shell is provided with an engaged base, which includes two opposite slices while a gap will be formed under each slice. When the holder is received in the shell, the T-shape hook can be engaged between two slices that makes the holder (1) connect with engaged base firmly.