Abstract: Implementations of a clamp finger may include a first portion including at least one tip configured to clamp a substrate against an anvil during a bonding operation; and a second portion including a first opening therethrough configured to permit coupling of the second portion with a clamping bridge. The first portion may be slidably coupled with the second portion through a rail and the first portion may include an opening therethrough configured to receive a screw that fixedly couples the at least one tip of the first portion at a desired position relative to the second portion.

Abstract: An anvil for a wirebonding system may include a stationary substrate having a top working surface; and a first layer fixedly coupled to the top working surface of the stationary substrate for receiving a workpiece, the first layer configured to accommodate a warped surface of the workpiece during a bonding operation.

Abstract: Implementations of a semiconductor device may include a first die pad having a first metal layer thereon; and a fiducial for aligning to the semiconductor device, the fiducial including a portion including a photodefinable material formed over the first metal layer of the first die pad.

Abstract: In implementations of a leadframe for a semiconductor package, the leadframe may include a die attach pad including a swag area; and one or more leads. The swag area may include an alternating pattern therein including at least two raised features, where each of the at least two raised features may be configured to support a clamping finger during a wirebonding process.

Abstract: A package includes a semiconductor die attached to a die attach pad by a first sinter bond. The package further includes a clip having a first end and a second end. The first end of the clip is attached to a device contact pad on the semiconductor die by a second sinter bond and the second end of the clip is attached to a post of a lead by a joint. The package further includes a mold body encapsulating the semiconductor die.

Abstract: Implementations of a clamp finger may include a first portion including at least one tip configured to clamp a substrate against an anvil during a bonding operation; and a second portion including a first opening therethrough configured to permit coupling of the second portion with a clamping bridge. The first portion may be slidably coupled with the second portion through a rail and the first portion may include an opening therethrough configured to receive a screw that fixedly couples the at least one tip of the first portion at a desired position relative to the second portion.