Patents by Inventor Sena Ada

Sena Ada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11235436
    Abstract: An abrasive article may include an organic bond material, abrasive particles contained within the organic bond material and a plasticizer contained within the organic bond material. The plasticizer may include at least one of an aromatic phenyl group, a heteroaromatic furyl group, or a saturated aliphatic hydrocarbon. The plasticizer may further include a polar group.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: February 1, 2022
    Assignees: SAINT-GOBAIN ABRASIVES, INC., SAINT-GOBAIN ABRASIFS, UNIVERSITY OF MASSACHUSETTS
    Inventors: Andrew B. Schoch, Alexander Nashed, Sena Ada Carleen, Dean S. Matsumoto, Anne M. Bonner, Shaw Ling Hsu, Jigneshkumar P. Patel, Subrajeet Deshmukh, Caixia Zhao
  • Publication number: 20190168358
    Abstract: An abrasive article may include an organic bond material, abrasive particles contained within the organic bond material and a plasticizer contained within the organic bond material. The plasticizer may include at least one of an aromatic phenyl group, a heteroaromatic furyl group, or a saturated aliphatic hydrocarbon. The plasticizer may further include a polar group.
    Type: Application
    Filed: July 7, 2017
    Publication date: June 6, 2019
    Inventors: Andrew B. SCHOCH, Alexander NASHED, Sena ADA CARLEEN, Dean S. MATSUMOTO, Anne M. BONNER, Shaw Ling HSU, Jigneshkumar PATEL, Subrajeet DESHMUKH, Caixia ZHAO
  • Publication number: 20150033636
    Abstract: An abrasive article may be configured to work titanium and may comprise a body including a bond material comprising an organic material. A first type of abrasive particles may be contained within the bond material and comprise fused alumina. The body may comprise a burnout modulus of rupture (MOR) of at least about 1.6 MPa.
    Type: Application
    Filed: August 1, 2014
    Publication date: February 5, 2015
    Inventors: Lingyu Li, Muthu Jeevanantham, Sena Ada, Scott Leonard