Abstract: A system and method for performing multiple user authentications with a single sign-on is disclosed. This system and method begins when the user performs a first user authentication, with user name and password, within the user's Intranet. Then the user selects a remote server subsequent to the first authentication. The server in the Intranet sends a token to the remote server containing authentication information made available because of the first authentication. Finally, the remote server decodes the authentication information, which has the effect within the remote server of performing a second user authentication without the user needing to sign-on a second time.

Abstract: An integrated circuit die is provided having a body portion having a singulation side and a pedestal portion extending from the body portion and having a singulation side coplanar with the singulation side of the body portion.

Abstract: An integrated circuit package system is provided including providing a substrate having a first surface and second surface; mounting interconnects to the first surface; mounting integrated circuit dies to the first surface; embedding the interconnects and the integrated circuit die within an encapsulant on the substrate and leaving top portions of the interconnects exposed; attaching solder balls to the second surface; and singulating the substrate and the encapsulant into a plurality of integrated circuit packages.

Abstract: An integrated circuit package system is provided including providing a wafer including image sensor systems having interconnects connected thereto and encapsulating the image sensor systems and interconnects in a transparent encapsulant. The system includes removing a portion of the transparent encapsulant to expose portions of the interconnects and singulating the wafer to form image sensor devices including at least one of the image sensor systems and a number of the interconnects.

Abstract: A chip package system is provided including providing a chip having interconnects provided thereon; forming a molding compound on the chip and encapsulating the interconnects; and forming a recess in the molding compound above the interconnects to expose the interconnects.

Abstract: Stacked package assemblies include first and second stacked packages, each having at least one die affixed to, and electrically interconnected with, a die attach side of the package substrate. One package is inverted in relation to the other; that is, the die attach sides of the package substrates face one another, and the “land” sides of the substrates face away from one another. Z-interconnection of the packages is by wire bonds connecting the first and second package substrates. The assembly is encapsulated in such a way that both the second package substrate (one side of the assembly) and a portion of the first package substrate (on the opposite side of the assembly) are exposed, so that second level interconnection and interconnection with additional components may be made. In some embodiments the first package is a chip scale package, and the second package is a land grid array package.

Abstract: An encapsulant cavity integrated circuit package system including forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the encapsulant cavity.

Abstract: Semiconductor assemblies include a first package, each having at least one die affixed to, and electrically interconnected with, a die attach side of the first package substrate, and a second substrate having a first side and a second (“land”) side, mounted over the molding of the first package with the first side of the second substrate facing the die attach side of the first package substrate. Accordingly, the die attach sides of the first substrate and the first side of the second substrate face one another, and the “land” sides of the substrates face away from one another. Z-interconnection of the package and the substrate is by wire bonds connecting the first and second substrates. The assembly is encapsulated in such a way that both the land side of the second substrate (one side of the assembly) and a portion of the land side of the first package substrate (on the opposite side of the assembly) are exposed, so that second level interconnection and interconnection with additional components may be made.

Abstract: A semiconductor package includes a substrate. A crenellated spacer is attached to the substrate. At least one top die is attached to the crenellated spacer. The at least one top die is wire bonded to the substrate, and an encapsulant is formed over the crenellated spacer and the at least one top die.

Abstract: An integrated circuit die is provided having a body portion having a singulation side and a pedestal portion extending from the body portion and having a singulation side coplanar with the singulation side of the body portion.

Abstract: A system is provided for an integrated circuit package including a leadframe having a lead finger. A groove is formed in a lead finger for a conductive bonding agent and a passive device is placed in the groove to be held by the conductive bonding agent.

Abstract: A method for fabricating a semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.

Abstract: A stacked semiconductor package includes a substrate and a first semiconductor device on the substrate. An interposer is supported above the first semiconductor device opposite the substrate. The interposer is electrically connected to the substrate. A second semiconductor device is mounted on the interposer.

Abstract: A method for forming a heat spreader, and the heat spreader formed thereby, are disclosed. An array heat spreader having a plurality of connected heat spreader panels is formed. Slots are formed in opposing sides of the heat spreader panels. Legs are formed on and extending downwardly from each of the heat spreader panels in at least an opposing pair of the slots on the heat spreader panels. The legs are integral with the respective heat spreader panels from which they depend.

Abstract: An optical material comprises a host matrix (e.g. fluorozirconate glass such as ZBLANP) doped with an optical atom pair or ion pair, each pair comprising a sensitizer (e.g. Nd.sup.3+) and an activator (e.g. Pr.sup.3+). The sensitizer is capable of absorbing optical excitation energy of a single wavelength (e.g. in the 800 nm region of GaAlAs diode laser) and transferring this optical excitation energy to the activator. This causes emission of visible and/or infrared light when the activator relaxes back into any of its lower energy states. Optical devices containing the optical material, and methods for generating visible and/or infrared light involving the optical material are also disclosed.

Abstract: A system for identifying the authorized receiver of any particular copy of a document. More specifically, each particular copy of a document is fingerprinted by applying a set of variations to a document, where each variation is a change in data contents, but does not change the meaning or perusal experience of the document. A database associating a set of variants to a receiver is maintained. Thus any variant or copy of that variant can be traced to an authorized receiver.

Abstract: A method and apparatus to create, distribute, sell and control access to digital documents using secure cryptographic envelopes. An envelope is an aggregation of information parts, where each of the parts to be protected are encrypted with a corresponding part encryption key. These encrypted information parts along with the other information parts become part of the envelope. Each part encryption key is also encrypted with a public key, and these encrypted part encryption keys are also included in the envelope. The envelope also includes a list of parts where each entry in the list has a part name and a secure hash of the named part. The list is then signed with a secret key to generate a signature, which is also included in the envelope. The signature can be verified using a second public key associated with first secret key, and the integrity of any information part in the envelope can be checked by computing a second hash and comparing it with the corresponding hash in the list of parts.

Abstract: A packet communications network in which multicast transmissions are made reliable by transmitting acknowledgements to all neighbors of every receiving node, including the source node. This allows the relinquishment of message holding buffers as soon as all near neighbors acknowledge receipt of the message after only tile longest round trip time to the nearest neighbors, rather than the round trip to the furthest destination. Moreover, highly reliable ancillary point-to-point transmission facilities can be used to retransmit multicast messages indicated as being lost by failure of acknowledgment. Finally, network partitions occurring during the multicast procedure do not necessarily lose the multicast message to the remote partitions since any node receiving the message can insure delivery to all other nodes in that partition.

Abstract: In a multicast network communication system, administration of the communication path making up the multicast tree itself has been separated from control and administration of the network. Creation of a multicast distribution tree and control over the membership thereof, is separately controlled independently from the creation and use of the tree transmission path used to communicate among the members of a multicast set. Transmission distribution trees are set up when a transmission request is received and the properties of the transmission path that is required are known. Transmission paths are created and controlled by all nodes in the communications system, each node having necessary control code and processors for responding to requests from set members to transmit a message to groups of users by creating and activating the necessary tree communication path distribution linkages. A distribution tree is created by the Tree Leader by generating a tree address using a random number generator.

Abstract: A packet communications system utilizes a route determining mechanism by identifying principal paths between the source and the destination in the system. Principal paths are minimum hop count paths with a transmission delay less than a specified threshold. Principal path links are accepted as legs of the optimum path, if feasible, i.e., if the resulting load on the link is less than a specified principal threshold. Secondary links are accepted only if the resulting load on the link is less than a specified secondary threshold, where the secondary threshold is less than the principal threshold. All paths must also have a transmission delay less than a specified threshold. Each request for a route includes the source node, the destination node, the load required, the maximum transmission delay and, if desired, the quality of service parameters which all of the legs of the route must satisfy.