Patents by Inventor Sengshiu J. Chung

Sengshiu J. Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyester molding compositions and articles exhibiting good impact, heat and solvent resistance
    Patent number: 5723520
    Abstract: Molding compositions which are formed by first pre-reacting a thermoplastic polyester polymer or copolymer with a copolymer of ethylene and a glycidyl acrylate or methacrylate and then subsequently blending with a nucleating agent which is a Group I metal salt of a carboxylic acid to increase the crystallization rate of the polyester. At least one reinforcing component such as glass fibers or reinforcing fillers is preferred. The compositions exhibit a good balance of toughness, rigidity and gasoline resistance and are particularly useful for automotive structural parts such as inner door frames, panels, reinforcements, bumper beams, window surrounds, and other metal replacement applications.
    Type: Grant
    Filed: August 9, 1996
    Date of Patent: March 3, 1998
    Assignee: AlliedSignal Inc.
    Inventors: Murali Krishna Akkapeddi, Bruce VanBuskirk, Sengshiu J. Chung
  • Polyamide compositions comprising aliphatic polyamide and an aromatic polyamide oligomer having improved moisture resistance
    Patent number: 5541267
    Abstract: A polyamide composition comprising an aliphatic polyamide such as nylon 6 and an oligomeric aromatic polyamide, such as oligomers of poly(tolylene diisophthalamide), which exhibit improved retention flexural modulus and flexural strength at ambient humidity, i.e. about 50% to about 65%.
    Type: Grant
    Filed: November 28, 1994
    Date of Patent: July 30, 1996
    Assignee: AlliedSignal Inc.
    Inventors: Murali K. Akkapeddi, Jeffrey H. Glans, Gerald J. Dege, Sengshiu J. Chung