Abstract: A bonding method and a bonding device for a flexible panel. In the process of bonding a protective cover plate and the flexible panel, a heated-type optical adhesive is used, the optical adhesive at normal temperature has relatively low viscosity and the viscosity thereof is below a bondable threshold, so that before the flexible panel and the edge of the protective cover plate are bonded, the optical adhesive and the edge of the protective cover plate come into contact in advance and then can be effectively separated, thus poor bonding in a bending region is avoided, the risk of generating bubbles and cracks is small, and the bonding yield can be improved. Moreover, the optical adhesive is increased in viscosity after heated, thereby ensuring that the flexible panel is bonded to the protective cover plate.

Abstract: The parallel assembly of rectifier modules includes a plurality of rectifier modules connected in parallel, a switch for switching-in and switching-out of the rectifier modules, an assembly frame, being provided therein with a switch accommodating space and a rectifier module accommodating space; a DC bus bar, being arranged at the top of the assembly frame; a plurality of groups of connectors, being fixed at one end close to the back side of the assembly frame; an AC copper bar, being fixed at one end close to the front side of the assembly frame; an extended copper bar, being fixed at one end close to the back side of the assembly frame.

Abstract: The present application discloses a laminated busbar arrangement for use in a three-level power converter and a power converter. The laminated busbar arrangement comprises a first layer of busbar comprising a neutral-point sub busbar configured to make electrical connections between respective components in the three-level power converter and a neutral-point potential; a second layer of busbar comprising a plurality of sub busbars configured make electrical connections between the respective components in the three-level power converter and a positive direct current (DC) input, a negative DC input and an alternating current (AC) input/output in the three-level power converter, and between respective semiconductor switching components. The present application may effectively reduce stray inductance.

Abstract: Provided are a three-level power converter and a power unit thereof. The power unit includes a power switch module and a laminated busbar structure. The power switch module includes a first power semiconductor switch module and a clamping diode module, which have a first, second, and third terminal respectively. The laminated busbar structure includes a third, second, and first busbar layer laminated on the power switch module. The third busbar layer includes a first sub-busbar connecting to the first terminal of the first power semiconductor switch module, a second sub-busbar connecting to the third terminal of the first power semiconductor switch module and the first terminal of the clamping diode module, a third sub-busbar connecting to the second terminal of the clamping diode module and the third terminal of the second power semiconductor switch module, and a fourth sub-busbar connecting to the second terminal of the second power semiconductor switch module.

Abstract: Provided are a three-level power converter and a power unit thereof. The power unit includes a power switch module and a laminated busbar structure. The power switch module includes a first power semiconductor switch module and a clamping diode module, which have a first, second, and third terminal respectively. The laminated busbar structure includes a third, second, and first busbar layer laminated on the power switch module. The third busbar layer includes a first sub-busbar connecting to the first terminal of the first power semiconductor switch module, a second sub-busbar connecting to the third terminal of the first power semiconductor switch module and the first terminal of the clamping diode module, a third sub-busbar connecting to the second terminal of the clamping diode module and the third terminal of the second power semiconductor switch module, and a fourth sub-busbar connecting to the second terminal of the second power semiconductor switch module.

Abstract: The present application discloses a laminated busbar arrangement for use in a three-level power converter and a power converter. The laminated busbar arrangement comprises a first layer of busbar comprising a neutral-point sub busbar congfigured to make electrical connections between respective components in the three-level power converter and a neutral-point potential; a second layer of busbar comprising a plurality of sub busbars congfigured to make electrical connections between the respective components in the three-level power converter and a positive direct current (DC) input, a negative DC input and an alternating current (AC) input/output in the three-level power converter, and between respective semiconductor switching components. The present application may effectively reduce stray inductance.