Patents by Inventor Sensho Kobayashi

Sensho Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10229847
    Abstract: A substrate transfer chamber for unloading the substrates from the containers includes a housing-shaped main body and a plurality of container connecting mechanisms to which the containers are connected. In the main body, some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: March 12, 2019
    Assignee: Tokyo Electron Limited
    Inventors: Shinji Wakabayashi, Keisuke Kondoh, Sensho Kobayashi
  • Patent number: 9810905
    Abstract: A support information display method is provided with an acquiring process for acquiring a first image by photographing, via a camera provided in a head mount display, a predetermined part of a substrate processing apparatus as a maintenance object, an estimating process for estimating the support information related to the predetermined part in the first image from information stored in a database, an image creating process for creating a second image by converting the support information estimated in the estimating process into an image, and a displaying process for displaying the second image on the head mount display in order for the operator to visually recognize the support information.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: November 7, 2017
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Toshiaki Kodama, Toru Yamauchi, Sensho Kobayashi, Hiroshi Nakamura, Gaku Ikeda, Kazuya Uoyama
  • Publication number: 20170154799
    Abstract: A substrate transfer chamber for unloading the substrates from the containers includes a housing-shaped main body and a plurality of container connecting mechanisms to which the containers are connected. In the main body, some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.
    Type: Application
    Filed: February 9, 2017
    Publication date: June 1, 2017
    Inventors: Shinji WAKABAYASHI, Keisuke KONDOH, Sensho KOBAYASHI
  • Patent number: 9443749
    Abstract: In this vacuum processing apparatus, four process modules and four load-rock modules are arranged in clusters around a two-stage conveyance vacuum chamber. In the apparatus, the entirety of the second stage of the vacuum conveyance chamber is a third vacuum conveyance area and the third vacuum conveyance area extends from the second stage to the first stage through an aperture to enter between first and second vacuum conveyance areas. A third vacuum conveyance robot has: left and right-side conveyance units, which can move straight in the depth direction in the second stage of the third vacuum conveyance area; and left and right-side conveyance units, which can move straight in the vertical direction, i.e. can move up and down, in the aperture of the vacuum conveyance area.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: September 13, 2016
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Shinji Wakabayashi, Sensho Kobayashi
  • Patent number: 9230842
    Abstract: Disclosed is a substrate processing apparatus including: a housing section configured to house a substrate; a transfer chamber that includes a plurality of airtight chambers connected to the periphery thereof, and a transfer mechanism provided therewithin, each of the plurality of airtight chambers being configured to process the substrate under an airtight state, and the transfer mechanism being configured to transfer the substrate to and from the airtight chambers; a carry-in section configured to carry the substrate into the transfer chamber via a first opening provided in the transfer chamber; and a carry-out section configured to carry out the substrate discharged from a second opening provided at a different position from that of the first opening of the transfer chamber, to the housing section, without returning the substrate to the transfer chamber.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: January 5, 2016
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Sensho Kobayashi
  • Patent number: 9228685
    Abstract: A load lock device includes a vessel of which an internal pressure is variable between a pressure corresponding to a vacuum chamber and an atmospheric pressure; a purge gas supply source configured to supply a purge gas into the vessel; an exhaust device configured to evacuate an inside of the vessel; a pressure controller configured to adjust the internal pressure of the vessel to be the pressure corresponding to the vacuum chamber and the atmospheric pressure; a cooling member within the vessel configured to cool a substrate while the substrate is placed adjacent thereto; a first purge gas discharging member configured to discharge the purge gas to flow in parallel with the substrate while controlling a turbulent flow thereof; and a second purge gas discharging member formed of a porous material and configured to discharge the purge gas toward a bottom surface of the substrate from below the substrate.
    Type: Grant
    Filed: November 30, 2011
    Date of Patent: January 5, 2016
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Sensho Kobayashi, Keita Kumagai
  • Patent number: 9147591
    Abstract: A substrate processing apparatus includes a plurality of vacuum transfer modules including transfer mechanisms for transferring a substrate between a plurality of process modules arranged near the vacuum transfer modules that are configured to process the substrate under a reduced-pressure atmosphere; one or more load lock modules provided at each of the vacuum transfer modules; a first atmosphere transfer mechanism that transfers the substrate that is fed from outside to one load lock module; and a second atmosphere transfer mechanism that receives the substrate from the first atmosphere transfer mechanism and transfers the received substrate to another load lock module. The second atmosphere transfer mechanism is arranged above or below the vacuum transfer module that is provided with the one load lock module, and the vacuum transfer modules are arranged in series along a substrate transfer direction of the second atmosphere transfer mechanism.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: September 29, 2015
    Assignee: Tokyo Electron Limited
    Inventor: Sensho Kobayashi
  • Publication number: 20150255257
    Abstract: An objective of the present invention is to simplify a configuration of a processing chamber for cooling a substrate in a substrate processing device. In a plasma processing device (10) whereby a plasma process is carried out upon a wafer (W), the wafer (W) which is plasma processed is conveyed into a load-lock chamber (13), and gas is discharged from a gas discharge member (25) upon the surface of the wafer (W), cooling the wafer (W). The gas discharge member (25) comprises a structure wherein a plurality of gas discharge nozzles (35) are formed in one flat plate face of a flat plate member (31). The gas discharge nozzles (35) comprise cylindrical eddy generating chambers (41), and nozzle holes (42) which are opened in bottom walls (52) of the eddy generating chambers (41) and discharge the gas. The flat plate face of the wafer (W) and the flat plate face wherein the gas discharge nozzles (35) are formed in the flat plate member (31) are positioned in parallel at a prescribed gap.
    Type: Application
    Filed: October 25, 2013
    Publication date: September 10, 2015
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Atsushi Kawabe, Sensho Kobayashi
  • Publication number: 20150246317
    Abstract: Provided is a method for producing a filtration filter capable of purifying with high accuracy and largely improving filtration efficiency. A flow path forming film is formed on a substrate. A plurality of grooves is formed on the flow path forming film along a surface of the substrate by etching. The grooves are filled with a sacrificial film. The flow path forming film and the sacrificial film are planarized by polishing the sacrificial film. A flow path sealing film is formed on the planarized flow path forming film and sacrificial film. An inlet hole and an outlet hole are formed through the substrate and the flow path sealing film, respectively, so that parts of the sacrificial film are exposed through the inlet hole and the outlet hole. The sacrificial film is removed using the inlet hole and the outlet hole and the filtration flow paths are formed by the grooves.
    Type: Application
    Filed: September 11, 2013
    Publication date: September 3, 2015
    Inventors: Tsuyoshi Moriya, Sensho Kobayashi, Kenichi Kagawa, Tsutomu Sakurabayashi
  • Publication number: 20150098788
    Abstract: A substrate transfer chamber for unloading the substrates from the containers includes a housing-shaped main body and a plurality of container connecting mechanisms to which the containers are connected. In the main body, some of the container connecting mechanisms are arranged on top of one another in a height direction of the main body.
    Type: Application
    Filed: October 6, 2014
    Publication date: April 9, 2015
    Inventors: Shinji WAKABAYASHI, Keisuke KONDOH, Sensho KOBAYASHI
  • Publication number: 20140240484
    Abstract: A support information display method is provided with an acquiring process for acquiring a first image by photographing, via a camera provided in a head mount display, a predetermined part of a substrate processing apparatus as a maintenance object, an estimating process for estimating the support information related to the predetermined part in the first image from information stored in a database, an image creating process for creating a second image by converting the support information estimated in the estimating process into an image, and a displaying process for displaying the second image on the head mount display in order for the operator to visually recognize the support information.
    Type: Application
    Filed: February 6, 2014
    Publication date: August 28, 2014
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Toshiaki KODAMA, Toru YAMAUCHI, Sensho KOBAYASHI, Hiroshi NAKAMURA, Gaku IKEDA, Kazuya UOYAMA
  • Publication number: 20140003891
    Abstract: A substrate processing apparatus includes a plurality of vacuum transfer modules including transfer mechanisms for transferring a substrate between a plurality of process modules arranged near the vacuum transfer modules that are configured to process the substrate under a reduced-pressure atmosphere; one or more load lock modules provided at each of the vacuum transfer modules; a first atmosphere transfer mechanism that transfers the substrate that is fed from outside to one load lock module; and a second atmosphere transfer mechanism that receives the substrate from the first atmosphere transfer mechanism and transfers the received substrate to another load lock module. The second atmosphere transfer mechanism is arranged above or below the vacuum transfer module that is provided with the one load lock module, and the vacuum transfer modules are arranged in series along a substrate transfer direction of the second atmosphere transfer mechanism.
    Type: Application
    Filed: March 23, 2012
    Publication date: January 2, 2014
    Applicant: Tokyo Electron Limited
    Inventor: Sensho Kobayashi
  • Publication number: 20130309045
    Abstract: Disclosed is a substrate processing apparatus including: a housing section configured to house a substrate; a transfer chamber that includes a plurality of airtight chambers connected to the periphery thereof, and a transfer mechanism provided therewithin, each of the plurality of airtight chambers being configured to process the substrate under an airtight state, and the transfer mechanism being configured to transfer the substrate to and from the airtight chambers; a carry-in section configured to carry the substrate into the transfer chamber via a first opening provided in the transfer chamber; and a carry-out section configured to carry out the substrate discharged from a second opening provided at a different position from that of the first opening of the transfer chamber, to the housing section, without returning the substrate to the transfer chamber.
    Type: Application
    Filed: September 21, 2011
    Publication date: November 21, 2013
    Applicant: TOKYO ELECTRON LIMITED
    Inventor: Sensho Kobayashi
  • Publication number: 20130302115
    Abstract: In this vacuum processing apparatus, four process modules and four load-rock modules are arranged in clusters around a two-stage conveyance vacuum chamber. In the apparatus, the entirety of the second stage of the vacuum conveyance chamber is a third vacuum conveyance area and the third vacuum conveyance area extends from the second stage to the first stage through an aperture to enter between first and second vacuum conveyance areas. A third vacuum conveyance robot has: left and right-side conveyance units, which can move straight in the depth direction in the second stage of the third vacuum conveyance area; and left and right-side conveyance units, which can move straight in the vertical direction, i.e. can move up and down, in the aperture of the vacuum conveyance area.
    Type: Application
    Filed: January 18, 2012
    Publication date: November 14, 2013
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Shinji Wakabayashi, Sensho Kobayashi
  • Publication number: 20130248014
    Abstract: A load lock device includes a vessel of which an internal pressure is variable between a pressure corresponding to a vacuum chamber and an atmospheric pressure; a purge gas supply source configured to supply a purge gas into the vessel; an exhaust device configured to evacuate an inside of the vessel; a pressure controller configured to adjust the internal pressure of the vessel to be the pressure corresponding to the vacuum chamber and the atmospheric pressure; a cooling member within the vessel configured to cool a substrate while the substrate is placed adjacent thereto; a first purge gas discharging member configured to discharge the purge gas to flow in parallel with the substrate while controlling a turbulent flow thereof; and a second purge gas discharging member formed of a porous material and configured to discharge the purge gas toward a bottom surface of the substrate from below the substrate.
    Type: Application
    Filed: November 30, 2011
    Publication date: September 26, 2013
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Sensho Kobayashi, Keita Kumagai
  • Patent number: 5788747
    Abstract: An exhaust system for a film forming apparatus including an exhaust pipe passage connected to an exhaust port of the film forming apparatus for forming a film on a object by using vaporized gas of an organic metal compound. The film forming apparatus includes a pressure transfer unit provided for the exhaust pipe passage and arranged to transfer, through the exhaust pipe passage, gas in the film forming apparatus as exhaust gas. A cooling mechanism is provided for the pressure transfer unit and arranged to cool the pressure transfer unit to a temperature lower than a temperature, at which the organic metal compound is decomposed, so as to prevent precipitation of the organic metal compound contained in the exhaust gas introduced into the pressure transfer unit.
    Type: Grant
    Filed: January 24, 1997
    Date of Patent: August 4, 1998
    Assignee: Tokyo Electron Limited
    Inventors: Takashi Horiuchi, Sensho Kobayashi, Masahide Itoh, Hisashi Gomi