Abstract: An antenna device includes an antenna, a first base member, a second base member, a support, and a first fixing member. The antenna, the first base member, the second base member, and the support are arrayed in this order. The first base member and the second base member are spaced apart from each other and coupled via the first fixing member.

Abstract: An antenna device includes a first substrate and an antenna. The first substrate has a through hole penetrating in the thickness direction. The antenna includes a second substrate and an element portion including a circuit unit on the second substrate. The second substrate is located in the through hole with a gap from the first substrate.

Abstract: An antenna device includes an antenna portion, a connecting portion, and a support. The connecting portion connects the antenna portion and the support. The support is located above the antenna portion and includes a channel extending from an inflow opening located opposite to the antenna portion to an outflow opening located farther from the antenna portion than the inflow opening.

Abstract: A light emitting element mounting package includes a plate-like substrate and a base that protrudes from a front surface of the substrate and has a mounting surface on which a light emitting element is mounted. A power supply terminal is provided on the front surface of the substrate, and the power supply terminal is arranged in a direction that is opposite to a direction where an emitting surface of the light emitting element is oriented. The light emitting element mounting package further includes a wiring conductor inside the substrate, wherein the wiring conductor extends to a side of the power supply terminal where one end thereof is positioned at a side of the power supply terminal with respect to the emitting surface of the light emitting element and the other end thereof is electrically connected to the power supply terminal.

Abstract: A wiring board includes a metal substrate, an insulating resin layer positioned on the metal substrate, the insulating resin layer including: a first surface facing the metal substrate, a second surface positioned opposite to the first surface, third surfaces positioned between the first surface and the second surface, first ridge portions where the first surface meets the third surfaces, second ridge portions where the second surface meets the third surfaces; and a first closed pore group closer to the first ridge portions than to the second ridge portions. The first closed pore group includes a plurality of closed pores densely contained.

Abstract: A substrate support body includes a support plate, an enclosure member, and a bonding material. The enclosure member is arranged on the support plate. The bonding material is arranged on an entire surface of an inner region of the enclosure member and is bonded to the support plate.

Abstract: A light emitting element mounting package includes a substrate and an insulating layer, the insulating layer is provided on a first surface of the substrate and has a through hole that penetrates in a direction perpendicular to the first surface, and a wall surface facing the through hole has a stepped portion, in which a diameter of the through hole is small on the side closer to the substrate and is large on the side far from the substrate.

Abstract: A light emitting element mounting package includes a substrate, an insulating layer, and a metal layer. The insulating layer includes a through hole penetrating in a thickness direction and is provided on the substrate. The metal layer is disposed on the substrate in at least the through hole, and includes a protruding portion extending from the substrate along an inner wall of the through hole. The protruding portion has the shape of a connected body in which metal particles are connected together. The inner wall of the insulating layer includes, closer to the substrate, an inclined surface where the through hole becomes wider, and the protruding portion contacts the inclined surface.

Abstract: A joint body of the present disclosure includes a substrate including a base member having insulating properties and a metal layer positioned on a first main surface of the base member, a metal joint layer, and a metal member. The metal joint layer is positioned between the metal layer and the metal member of the substrate. The metal joint layer includes a nickel layer, a solder layer, and a composite layer containing a mix of nickel and solder. The nickel layer, the composite layer, and the solder layer are positioned in this order from the metal layer side to the metal member side. The nickel in the composite layer extends from the nickel layer in the thickness direction and forms protrusions and recesses.

Abstract: A light emitting element mounting package includes a plate-like substrate and a base that protrudes from a front surface of the substrate and has a mounting surface on which a light emitting element is mounted. A power supply terminal is provided on the front surface of the substrate, and the power supply terminal is arranged in a direction that is opposite to a direction where an emitting surface of the light emitting element is oriented. The light emitting element mounting package further includes a wiring conductor inside the substrate, wherein the wiring conductor extends to a side of the power supply terminal where one end thereof is positioned at a side of the power supply terminal with respect to the emitting surface of the light emitting element and the other end thereof is electrically connected to the power supply terminal.

Abstract: A wiring board including: a frame base material; and a metal member, wherein the frame base material is formed in plate-shaped, and includes a through hole in a central region of the frame base material, the metal member includes a stage part and at least one bridge part, a width of the bridge part is equal to or narrower than a width of the stage part, the bridge part extending toward an outer side from the stage part, the stage part is arranged to be fit to the through hole, and the bridge part is arranged to be disposed facing the frame base material.

Abstract: A substrate for mounting a light-emitting element includes a base and a dam part. The base includes a front surface and a back surface that are principal surfaces thereof where the front surface includes a mounting part that is capable of mounting a light-emitting element thereon. The dam part is arranged on a peripheral part of the front surface to surround the mounting part. The front surface is inclined relative to the back surface at a predetermined angle. The dam part is provided with an opening part at a site where the front surface is inclined to decrease a thickness of the base, in the peripheral part of the front surface. A site of the dam part where the opening part is provided is inclined relative to the back surface in a direction of the front surface.

Abstract: An electrical element mounting package includes a plate-like substrate and at least one base that protrudes from a front surface of the substrate and has a mounting surface on which an electrical element is mounted, wherein the substrate and the base are made of ceramics integrally. The electrical element mounting package includes an element terminal that is provided on the mounting surface of the base, a side conductor that is provided on a side surface of the base and extends in a thickness direction of the base, and a substrate-side via conductor that is provided inside the substrate and extends in a thickness direction of the substrate, wherein the element terminal, the side conductor, and the substrate-side via conductor are connected to one another.

Abstract: There is provided a dimensionally accurate insulating substrate in which plane direction-wise shrinkage is practically zero and shrinkage variations are small. The insulating substrate includes a laminated body composed of at least two kinds of insulating layers made of crystallizable glass ceramics. The crystallization temperature of crystallizable glass contained in the first insulating layer is lower than the softening point of crystallizable glass contained in the second insulating layer. The difference in thermal expansion coefficient between the first and second insulating layers is preferably 2×10?6/° C. or below.

Abstract: There is provided a dimensionally accurate insulating substrate in which plane direction-wise shrinkage is practically zero and shrinkage variations are small. The insulating substrate includes a laminated body composed of at least two kinds of insulating layers made of crystallizable glass ceramics. The crystallization temperature of crystallizable glass contained in the first insulating layer is lower than the softening point of crystallizable glass contained in the second insulating layer. The difference in thermal expansion coefficient between the first and second insulating layers is preferably 2×10?6/° C. or below.

Abstract: A laminate includes a first ceramic green sheet, a second ceramic green sheet, and a conductor layer. The first ceramic green sheet includes ceramic powder and an organic binder and has a firing shrinkage end temperature T3. The second ceramic green sheet includes ceramic powder and an organic binder and has a firing shrinkage start temperature T2 that is higher than the firing shrinkage end temperature T3 of the first ceramic green sheet. The conductor layer includes metal powder and an organic binder and has a firing shrinkage end temperature T4 that is lower than the firing shrinkage start temperature T2 of the second ceramic green sheet.

Abstract: There is provided a dimensionally accurate insulating substrate in which plane direction-wise shrinkage is practically zero and shrinkage variations are small. The insulating substrate includes a laminated body composed of at least two kinds of insulating layers made of crystallizable glass ceramics. The crystallization temperature of crystallizable glass contained in the first insulating layer is lower than the softening point of crystallizable glass contained in the second insulating layer. The difference in thermal expansion coefficient between the first and second insulating layers is preferably 2×10?6/° C. or below.