Patents by Inventor Senthil Kumar MUNIRATHINAM

Senthil Kumar MUNIRATHINAM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device with buffer layer
    Patent number: 11990353
    Abstract: A wafer-level buffer layer is disclosed. The wafer-level buffer layer is configured to prevent cracking and chipping the back-end-of-line (BEOL) dielectric during wafer singulation process. The wafer-level buffer layer is a composite wafer-level buffer layer with a vibration damping agent. The vibration damping agent includes a polymer-based base layer with fillers. The damping agent absorbs or dampens the vibration of the saw blade during dicing to prevent cracking and chipping of the BEOL dielectric.
    Type: Grant
    Filed: July 15, 2021
    Date of Patent: May 21, 2024
    Assignee: PEP INNOVATION PTE. LTD.
    Inventors: Hwee Seng Jimmy Chew, Senthil Kumar Munirathinam
  • SEMICONDUCTOR DEVICE WITH BUFFER LAYER
    Publication number: 20210343549
    Abstract: A wafer-level buffer layer is disclosed. The wafer-level buffer layer is configured to prevent cracking and chipping the back-end-of-line (BEOL) dielectric during wafer singulation process. The wafer-level buffer layer is a composite wafer-level buffer layer with a vibration damping agent. The vibration damping agent includes a polymer-based base layer with fillers. The damping agent absorbs or dampens the vibration of the saw blade during dicing to prevent cracking and chipping of the BEOL dielectric.
    Type: Application
    Filed: July 15, 2021
    Publication date: November 4, 2021
    Inventors: Hwee Seng Jimmy CHEW, Senthil Kumar MUNIRATHINAM