Patents by Inventor Senthil SIVASWAMY

Senthil SIVASWAMY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE AND A METALLIZATION PORTION
    Publication number: 20240072032
    Abstract: A package comprising a first metallization portion, a first integrated device coupled to the first metallization portion through a first plurality of pillar interconnects, and a first chiplet located between the first integrated device and the first metallization portion. The first chiplet is coupled to the first integrated device through a first plurality of inter pillar interconnects. The first chiplet may include an active chiplet. The first chiplet may include a passive chiplet.
    Type: Application
    Filed: August 23, 2022
    Publication date: February 29, 2024
    Inventors: Yanmei SONG, William STONE, Jianwen XU, Senthil SIVASWAMY, John HOLMES, Ryan LANE