Patents by Inventor Senthilkumar MK

Senthilkumar MK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240082468
    Abstract: Systems and methods include a heat transfer body with opposing major surfaces formed from a thermally conductive substrate in intimate thermal interaction with an alumina exterior surface that extends across the major surfaces of the body. In an illustrative example, the heat source may be a substantially planar, silicone-based heater source (P-SBHS). The heat transfer body may be configured to thermally interact, for example, heat from a heat source proximate a first of the major surfaces to a second of the major surfaces. A temperature sensor module may be located, for example, proximate to the first major surface such that a temperature sensor thermally interacts with the first major surface. The temperature sensor module may, for example, insulate the temperature sensor from the P-SBHS.
    Type: Application
    Filed: June 2, 2023
    Publication date: March 14, 2024
    Inventors: Senthilkumar MK, George WHYTE, John STOPFORTH, Claudia ACOSTA, Marco BARRON, Anton JEYSING
  • Patent number: 11701457
    Abstract: Systems and methods include a heat transfer body with opposing major surfaces formed from a thermally conductive substrate in intimate thermal interaction with an alumina exterior surface that extends across the major surfaces of the body. In an illustrative example, the heat source may be a substantially planar, silicone-based heater source (P-SBHS). The heat transfer body may be configured to thermally interact, for example, heat from a heat source proximate a first of the major surfaces to a second of the major surfaces. A temperature sensor module may be located, for example, proximate to the first major surface such that a temperature sensor thermally interacts with the first major surface. The temperature sensor module may, for example, insulate the temperature sensor from the P-SBHS.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: July 18, 2023
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Senthilkumar Mk, George Whyte, John Stopforth, Claudia Acosta, Marco Barron, Anton Jeysing
  • Publication number: 20200353143
    Abstract: Systems and methods include a heat transfer body with opposing major surfaces formed from a thermally conductive substrate in intimate thermal interaction with an alumina exterior surface that extends across the major surfaces of the body. In an illustrative example, the heat source may be a substantially planar, silicone-based heater source (P-SBHS). The heat transfer body may be configured to thermally interact, for example, heat from a heat source proximate a first of the major surfaces to a second of the major surfaces. A temperature sensor module may be located, for example, proximate to the first major surface such that a temperature sensor thermally interacts with the first major surface. The temperature sensor module may, for example, insulate the temperature sensor from the P-SBHS. The electrical insulation provided by the alumina exterior surface may reduce electrical leakage currents induced between the P-SBHS and, for example, patient and/or operator accessible parts.
    Type: Application
    Filed: December 4, 2017
    Publication date: November 12, 2020
    Inventors: Senthilkumar MK, George WHYTE, John STOPFORTH, Claudia ACOSTA, Marco BARRON, Anton JEYSING
  • Publication number: 20120293296
    Abstract: A thermostat includes a temperature sensitive element that is responsive to temperature variations to selectively move between at least a first position and a second position. The transfer pin is movable with the temperature sensitive element and is configured, upon movement of the temperature sensitive element from the first position to the second position, to supply a force to a switch that moves the switch from a first switch position to a second switch position. A spring is coupled to the switch and is configured to selectively supply at least a first retainer force to the switch that, when the switch is in the second switch position, retains the switch in the second switch position when the temperature sensitive element moves from the second position back to the first position.
    Type: Application
    Filed: May 17, 2011
    Publication date: November 22, 2012
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Senthilkumar MK, Chandrashekar Srinivas, Rajesh Narayanan, Phaneendra Govindasetty Tirumani, Balaji K. Krishnaswamy