Patents by Inventor Senthilkumar Veeraraghavan

Senthilkumar Veeraraghavan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260125548
    Abstract: A low temperature curable anti-flutter composition which cures to form a cured product, including: (a) a first copolymer, wherein the first copolymer comprises a rubber having at least one nitrile functional group; and (b) a second copolymer, wherein the second copolymer comprises a rubber having styrene-butadiene functional groups, wherein the composition is a room temperature pumpable sealant which is capable of expanding and curing at temperatures below 140° C. in less than 15 minutes.
    Type: Application
    Filed: November 5, 2025
    Publication date: May 7, 2026
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Karthikeyan Sengotaiyan, Senthilkumar Veeraraghavan
  • Patent number: 12540216
    Abstract: A two-part curable composition which cures to form a thermally conductive cured product, including: (a) a first part including: (1) at least one metal catalytic component for catalyzing the cure reaction; (2) a non-reactive diluent component; (3) a wetting agent component; (4) a filler component; (5) a rheology modifier component; and (6) a pigment component; and (b) a second part including: (1) at least one silane terminated polyurethane polymer; (2) a moisture scavenger; (3) a non-reactive diluent component; (4) a filler component; and (5) a wetting agent component, wherein at least one of the filler components of the first-part and the second-part comprises a thermally conductive filler.
    Type: Grant
    Filed: December 10, 2021
    Date of Patent: February 3, 2026
    Assignee: Uniseal, Inc.
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Karthikeyan Sengotaiyan, Senthilkumar Veeraraghavan
  • Patent number: 12534611
    Abstract: A low temperature curable anti-flutter composition which cures to form a cured product, including: (a) a first copolymer, wherein the first copolymer comprises a rubber having at least one nitrile functional group; and (b) a second copolymer, wherein the second copolymer comprises a rubber having styrene-butadiene functional groups, wherein the composition is a room temperature pumpable sealant which is capable of expanding and curing at temperatures below 140° C. in less than 15 minutes.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: January 27, 2026
    Assignee: Uniseal, Inc.
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Karthikeyan Sengotaiyan, Senthilkumar Veeraraghavan
  • Publication number: 20250297125
    Abstract: A non-aqueous sprayable and curable dampening composition for automotive body and closure panels which cures to form a cured product, including: (1) a PVC homopolymer resin and/or a mixture of a PVC copolymer resin; (2) a phthalate plasticizer and a benzoate plasticizer; (3) a filler component, wherein the filler component comprises one or more spherical fillers and/or one or more platy fillers; (4) a modified epoxy resin; (5) an adhesion promoter; and (6) a substrate wetting agent.
    Type: Application
    Filed: June 6, 2025
    Publication date: September 25, 2025
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Karthikeyan Sengotaiyan, Senthilkumar Veeraraghavan
  • Patent number: 12415933
    Abstract: A non-aqueous sprayable and curable dampening composition for automotive body and closure panels which cures to form a cured product, including: (1) a PVC homopolymer resin and/or a mixture of a PVC copolymer resin; (2) a phthalate plasticizer and a benzoate plasticizer; (3) a filler component, wherein the filler component comprises one or more spherical fillers and/or one or more platy fillers; (4) a modified epoxy resin; (5) an adhesion promoter; and (6) a substrate wetting agent.
    Type: Grant
    Filed: August 4, 2023
    Date of Patent: September 16, 2025
    Assignee: Uniseal, Inc.
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Karthikeyan Sengotaiyan, Senthilkumar Veeraraghavan
  • Publication number: 20250171654
    Abstract: A storage stable, one-component, solvent-free, non-halogenated, heat curable composition which cures to form a cured product for use in encapsulation of electrical components, including: (a) an epoxy resin; (b) a non-halogenated flame retardant based on phosphorus containing epoxy resin; (c) a cyclic anhydride hardening agent; (d) a catalyst; (e) a rheology modifier; (f) a heat stabilizing agent; and (g) wherein the composition is fast gelling/curing and exhibits a high glass transition temperature, and excellent mechanical, electrical, and flame-retardant properties.
    Type: Application
    Filed: November 29, 2023
    Publication date: May 29, 2025
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Karthikeyan Sengotaiyan, Senthilkumar Veeraraghavan
  • Publication number: 20250101275
    Abstract: A pumpable, one-component, curable, anti-flutter composition which cures to form a cured product, including: (a) an elastomer; (b) a homopolymer resin; (c) a novel thixotropic filler system; and (d) wherein the anti-flutter composition exhibits high wash resistance.
    Type: Application
    Filed: September 26, 2023
    Publication date: March 27, 2025
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Senthilkumar Veeraraghavan, Karthikeyan Sengotaiyan
  • Publication number: 20250043144
    Abstract: A non-aqueous sprayable and curable dampening composition for automotive body and closure panels which cures to form a cured product, including: (1) a PVC homopolymer resin and/or a mixture of a PVC copolymer resin; (2) a phthalate plasticizer and a benzoate plasticizer; (3) a filler component, wherein the filler component comprises one or more spherical fillers and/or one or more platy fillers; (4) a modified epoxy resin; (5) an adhesion promoter; and (6) a substrate wetting agent.
    Type: Application
    Filed: August 4, 2023
    Publication date: February 6, 2025
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Karthikeyan Sengotaiyan, Senthilkumar Veeraraghavan
  • Publication number: 20240209243
    Abstract: A two-part curable composition which cures to form a thermally conductive cured product, including: a first-part having: (1) a maleic anhydride adducted polybutadiene component; (2) a non-reactive diluent component; (3) a wetting agent component; and (4) a filler component; and a second-part having: (1) a hydroxyl terminated polybutadiene component; (2) a catalytic component for catalyzing the cure reaction; (3) a diluent component; (4) a filler component; and (5) a wetting agent component, wherein at least one of the filler components of the first-part and the second-part comprises a thermally conductive filler. The compositions of the present invention are useful for bonding heat generating components, such as, for example, automotive electrical battery pack components, high-capacity batteries and electric motors in electric and hybrid vehicles.
    Type: Application
    Filed: June 7, 2021
    Publication date: June 27, 2024
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Senthilkumar Veeraraghavan, Karthikeyan Sengotaiyan
  • Publication number: 20240043676
    Abstract: A low temperature curable anti-flutter composition which cures to form a cured product, including: (a) a first copolymer, wherein the first copolymer comprises a rubber having at least one nitrile functional group; and (b) a second copolymer, wherein the second copolymer comprises a rubber having styrene-butadiene functional groups, wherein the composition is a room temperature pumpable sealant which is capable of expanding and curing at temperatures below 140° C. in less than 15 minutes.
    Type: Application
    Filed: July 28, 2022
    Publication date: February 8, 2024
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Karthikeyan Sengotaiyan, Senthilkumar Veeraraghavan
  • Publication number: 20230183425
    Abstract: A two-part curable composition which cures to form a thermally conductive cured product, including: (a) a first part including: (1) at least one metal catalytic component for catalyzing the cure reaction; (2) a non-reactive diluent component; (3) a wetting agent component; (4) a filler component; (5) a rheology modifier component; and (6) a pigment component; and (b) a second part including: (1) at least one silane terminated polyurethane polymer; (2) a moisture scavenger; (3) a non-reactive diluent component; (4) a filler component; and (5) a wetting agent component, wherein at least one of the filler components of the first-part and the second-part comprises a thermally conductive filler.
    Type: Application
    Filed: December 10, 2021
    Publication date: June 15, 2023
    Inventors: Thanikaivelan Tindivanam Veeraraghavan, Karthikeyan Sengotaiyan, Senthilkumar Veeraraghavan