Patents by Inventor Senug-Hyun Ra
Senug-Hyun Ra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8216503Abstract: A method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by forming conductive polymer wiring using imprinting.Type: GrantFiled: June 28, 2007Date of Patent: July 10, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae-Choon Cho, Myeong-Ho Hong, Senug-Hyun Ra, Hyuk-Soo Lee, Jeong-Bok Kwak, Jung-Woo Lee, Choon-Keun Lee, Sang-Moon Lee
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Patent number: 8187518Abstract: While releasing property between a resin layer and an imprinting mold is given by using a metal thin film layer, a method for manufacturing a substrate advantageous for forming a conductive layer by plating and a substrate manufactured by the method are provided. According to one aspect of the present invention, a method for manufacturing a substrate by imprinting, the method comprising: laminating a metal thin film layer on top of a resin layer; pressurizing the resin layer and the metal thin film layer by an imprinting mold which comprises a side having a pattern in correspondence with a wiring pattern; curing a resin which forms the resin layer; and removing the imprinting mold from the resin layer and the metal thin film layer, may be presented.Type: GrantFiled: March 5, 2007Date of Patent: May 29, 2012Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Choon-Keun Lee, Myeong-Ho Hong, Seung-Heon Han, Senug-Hyun Ra
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Publication number: 20120099950Abstract: Disclosed herein are a system for management of a transportation device, including: a plurality of work tables disposed to be spaced from each other; charging terminals provided around the work tables; and transportation devices transporting objects between the work tables and including a supercapacitor as a power supply, and a method therefor.Type: ApplicationFiled: October 17, 2011Publication date: April 26, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Hak JEONG, Bae Kyun KIM, Senug Hyun RA, Hyun Chul JUNG, Yong Wook KIM
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Publication number: 20120087060Abstract: Disclosed herein is a supercapacitor module. The supercapacitor module includes: a plurality of supercapacitors; and a plurality of water cooling jackets having the plurality of supercapacitors inserted therebetween to be stacked and having cooling flow passages protrudedly connected to both sides thereof; wherein the supercapacitors and the cooling jackets are alternately stacked, each of fixing plates is combined with the water cooling jacket at an uppermost layer and the water cooling jacket at a bottommost layer, and the fixing plates are supported by a supporter.Type: ApplicationFiled: March 28, 2011Publication date: April 12, 2012Inventors: Senug Hyun RA, Bae Kyun Kim
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Publication number: 20120050992Abstract: Provided is a supercapacitor module including a plurality of supercapacitors, a water cooling jacket including containing parts for containing the supercapacitors, respectively, and radiating heat emitted from side surfaces of the supercapacitors, an inlet port for introducing cooling water supplied into the water cooling jacket from the exterior, and an outlet port for releasing the cooling water discharged from the water cooling jacket to the exterior. Therefore, it is possible to provide the supercapacitor module capable of increasing a radiation effect.Type: ApplicationFiled: August 26, 2011Publication date: March 1, 2012Inventors: Senug Hyun Ra, Bae Kyun Kim, Yong Wook Kim
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Publication number: 20120050944Abstract: Disclosed herein is an energy storage module. The energy storage module according to an embodiment of the present invention includes a plurality of capacitor unit cells each having a plus terminal and a minus terminal; and a connection part configured to electrically connect the plus terminal of any one of the capacitor unit cells to the minus terminal of another capacitor unit cell, wherein each of the capacitor unit cells includes an outer case housing an energy storage element, and wherein the outer case includes a protrusion part protruded from one surface of the outer case; and a depression part having a shape matched with the protrusion part and recessed from another surface of the outer case toward inside of the outer case.Type: ApplicationFiled: December 10, 2010Publication date: March 1, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Hak Jeong, Bae Kyun Kim, Senug Hyun Ra, Hyun Chul Jung, Yong Wook Kim
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Patent number: 7653990Abstract: A manufacturing method of printed circuit board print is disclosed. A method of manufacturing a PCB which includes providing an imprinting stamper with a relievo pattern formed in correspondence with a circuit pattern data using the circuit pattern data, forming an intaglio pattern corresponding to the relievo pattern by pressing the imprinting stamper on an insulation layer, and forming a circuit pattern by printing conductive ink in the intaglio pattern by an ink-jet method using the circuit pattern data, allows the forming of a circuit pattern to a required thickness by injecting conductive ink in a groove processed by the imprint method, and prevents the spreading of ink and the distortion of the pattern shape in the curing process for conductive ink containing metal Also, the circuit pattern CAD data used in the manufacturing of an imprinting stamper can be utilized again in the ink-jet printing process.Type: GrantFiled: April 13, 2007Date of Patent: February 2, 2010Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Choon-Keun Lee, Myeong-Ho Hong, Senug-Hyun Ra
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Publication number: 20090183903Abstract: A printed circuit board print (PCB) having an insulation layer; an intaglio pattern formed by depressing a part of the insulation layer corresponding to a location where a circuit pattern is to be formed; and conductive ink forming the circuit pattern by filling the intaglio pattern. A method of manufacturing the PCB includes providing an imprinting stamper with a relievo pattern formed in correspondence with a circuit pattern data using the circuit pattern data, forming an intaglio pattern corresponding to the relievo pattern by pressing the imprinting stamper on an insulation layer, and forming a circuit pattern by printing conductive ink in the intaglio pattern by an ink-jet method using the circuit pattern data, allows the forming of a circuit pattern to a required thickness by injecting conductive ink in a groove processed by the imprint method, and prevents the spreading of ink and the distortion of the pattern shape in the curing process for conductive ink containing metal.Type: ApplicationFiled: March 18, 2009Publication date: July 23, 2009Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTDInventors: Choon-Keun Lee, Myeong-Ho Hong, Senug-Hyun Ra
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Publication number: 20080016686Abstract: A manufacturing method of printed circuit board print is disclosed. A method of manufacturing a PCB which includes providing an imprinting stamper with a relievo pattern formed in correspondence with a circuit pattern data using the circuit pattern data, forming an intaglio pattern corresponding to the relievo pattern by pressing the imprinting stamper on an insulation layer, and forming a circuit pattern by printing conductive ink in the intaglio pattern by an ink-jet method using the circuit pattern data, allows the forming of a circuit pattern to a required thickness by injecting conductive ink in a groove processed by the imprint method, and prevents the spreading of ink and the distortion of the pattern shape in the curing process for conductive ink containing metal Also, the circuit pattern CAD data used in the manufacturing of an imprinting stamper can be utilized again in the ink-jet printing process.Type: ApplicationFiled: April 13, 2007Publication date: January 24, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Choon-Keun Lee, Myeong-Ho Hong, Senug-Hyun Ra
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Publication number: 20080012168Abstract: A method for manufacturing printed circuit board is disclosed.Type: ApplicationFiled: July 11, 2007Publication date: January 17, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Senug-Hyun Ra, Myeong-Ho Hong, Hyuk-Soo Lee, Choon-Keun Lee, Sang-Moon Lee, Jae-Choon Cho, Jung-Woo Lee, Jeong-Bok Kwak
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Publication number: 20080008824Abstract: The present invention relates to a method for manufacturing a printed circuit board, more particularly to a method for manufacturing a printed circuit board, in which an oxidant capable of polymerizing conductive polymers is selectively marked on a board using imprinting, and the monomer of a conductive polymer is filled in the selected pattern and polymerized, to provide a conductive polymer wiring pattern. With the method for manufacturing a printed circuit board according to certain aspects of the invention as set forth above, a printed circuit board can be given finer wiring widths to allow a highly integrated, highly efficient printed circuit board. Thus, a printed circuit board (PCB) or a flexible printed circuit boards (FPCB) can be manufactured that is applicable to industrial, clerical, and domestic electric electronic products, by a new technique of forming conductive polymer wiring using imprinting.Type: ApplicationFiled: June 28, 2007Publication date: January 10, 2008Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae-Choon Cho, Myeong-Ho Hong, Senug-Hyun Ra, Hyuk-Soo Lee, Jeong-Bok Kwak, Jung-Woo Lee, Choon-Keun Lee, Sang-Moon Lee
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Publication number: 20070207297Abstract: While releasing property between a resin layer and an imprinting mold is given by using a metal thin film layer, a method for manufacturing a substrate advantageous for forming a conductive layer by plating and a substrate manufactured by the method are provided. According to one aspect of the present invention, a method for manufacturing a substrate by imprinting, the method comprising: laminating a metal thin film layer on top of a resin layer; pressurizing the resin layer and the metal thin film layer by an imprinting mold which comprises a side having a pattern in correspondence with a wiring pattern; curing a resin which forms the resin layer; and removing the imprinting mold from the resin layer and the metal thin film layer, may be presented.Type: ApplicationFiled: March 5, 2007Publication date: September 6, 2007Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Choon-Keun Lee, Myeong-Ho Hong, Seung-Heon Han, Senug-Hyun Ra