Patents by Inventor Seo Hyun MOON

Seo Hyun MOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device package and packaging substrate for the same
    Patent number: 9059149
    Abstract: The present application provides an electronic device package. The package includes a packaging substrate having first and second surfaces opposing one another. First and second electrode patterns are formed on the first surface and first and second external terminals connected to the first and second electrode patterns. The second electrode pattern is electrically insulated from the first electrode pattern and surrounds the first electrode pattern An electronic device is mounted on the first surface of the packaging substrate and includes first and second electrodes disposed on a surface thereof facing the packaging substrate. The first and second electrodes are positioned on the first and second electrode patterns, respectively.
    Type: Grant
    Filed: October 25, 2013
    Date of Patent: June 16, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Min Kwon, Seo Hyun Moon, Sung Jun Im, Min Young Son
  • ELECTRONIC DEVICE PACKAGE AND PACKAGING SUBSTRATE FOR THE SAME
    Publication number: 20140203451
    Abstract: The present application provides an electronic device package. The package includes a packaging substrate having first and second surfaces opposing one another. First and second electrode patterns are formed on the first surface and first and second external terminals connected to the first and second electrode patterns. The second electrode pattern is electrically insulated from the first electrode pattern and surrounds the first electrode pattern An electronic device is mounted on the first surface of the packaging substrate and includes first and second electrodes disposed on a surface thereof facing the packaging substrate. The first and second electrodes are positioned on the first and second electrode patterns, respectively.
    Type: Application
    Filed: October 25, 2013
    Publication date: July 24, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Min KWON, Seo Hyun MOON, Sung Jun IM, Min Young SON