Patents by Inventor Seo Yeon Kwon
Seo Yeon Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11929386Abstract: A display device includes a display layer including pixels each including at least one transistor, a connection wiring electrically connected to the at least one transistor and exposed to a lower surface of the display layer through a first contact hole in the display layer, a base member disposed under the display layer and including a first hole exposing the connection wiring exposed to the lower surface of the display layer, a first lower protective layer disposed on a lower surface of the base member and including a second hole overlapping the first hole, a pad portion disposed on a lower surface of the first lower protective layer, and a lead line disposed on the lower surface of the first lower protective layer and electrically connecting the pad portion and the connection wiring. A tiled display device includes multiple display devices.Type: GrantFiled: June 16, 2021Date of Patent: March 12, 2024Assignee: SAMSUNG DISPLAY CO., LTD.Inventors: Se Hoon Jeong, Seung Wook Kwon, Seo Yeon Lee, Seung Gun Chae, Woo Yong Sung, Seung Yeon Chae
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Patent number: 9812628Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.Type: GrantFiled: December 29, 2015Date of Patent: November 7, 2017Assignee: LG INNOTEK CO., LTDInventors: Su Jung Jung, Byung Mok Kim, Young Jun Cho, Seo Yeon Kwon
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Patent number: 9634215Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.Type: GrantFiled: October 16, 2015Date of Patent: April 25, 2017Assignee: LG Innotek Co., Ltd.Inventors: Su Jung Jung, Yon Tae Moon, Young Jun Cho, Son Kyo Hwang, Byung Mok Kim, Seo Yeon Kwon
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Publication number: 20160133810Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.Type: ApplicationFiled: December 29, 2015Publication date: May 12, 2016Inventors: Su Jung JUNG, Byung Mok KIM, Young Jun CHO, Seo Yeon KWON
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Publication number: 20160043296Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.Type: ApplicationFiled: October 16, 2015Publication date: February 11, 2016Inventors: Su Jung JUNG, Yon Tae MOON, Young Jun CHO, Son Kyo HWANG, Byung Mok KIM, Seo Yeon KWON
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Patent number: 9257626Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.Type: GrantFiled: September 23, 2014Date of Patent: February 9, 2016Assignee: LG Innotek Co., Ltd.Inventors: Su Jung Jung, Byung Mok Kim, Young Jun Cho, Seo Yeon Kwon
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Patent number: 9196814Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.Type: GrantFiled: April 15, 2014Date of Patent: November 24, 2015Assignee: LG Innotek Co., Ltd.Inventors: Su Jung Jung, Yon Tae Moon, Young Jun Cho, Son Kyo Hwang, Byung Mok Kim, Seo Yeon Kwon
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Patent number: 8872414Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.Type: GrantFiled: August 27, 2012Date of Patent: October 28, 2014Assignee: LG Innotek Co., Ltd.Inventors: Su Jung Jung, Byung Mok Kim, Young Jun Cho, Seo Yeon Kwon
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Publication number: 20140225151Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.Type: ApplicationFiled: April 15, 2014Publication date: August 14, 2014Applicant: LG Innotek Co., Ltd.Inventors: Su Jung JUNG, Yon Tae MOON, Young Jun CHO, Son Kyo HWANG, Byung Mok KIM, Seo Yeon KWON
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Patent number: 8773006Abstract: Disclosed is a light emitting device package. The light emitting device includes a package body having a cavity defined by a sidewall and a bottom surface, a light emitting device disposed in the cavity, a radiator inserted into the package body and disposed below the light emitting device, and a second electrode pattern disposed around the radiator and electrically connected to the light emitting device via wire bonding. The second electrode pattern includes a first region to which a wire is bonded, and a second region connected to the first region, and a width of the first region differs from a width of the second region.Type: GrantFiled: August 21, 2012Date of Patent: July 8, 2014Assignee: LG Innotek Co., Ltd.Inventors: Byung Mok Kim, Young Jun Cho, Yon Tae Moon, Su Jung Jung, Seo Yeon Kwon, Son Kyo Hwang
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Patent number: 8704433Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.Type: GrantFiled: August 22, 2012Date of Patent: April 22, 2014Assignee: LG Innotek Co., Ltd.Inventors: Su Jung Jung, Yon Tae Moon, Young Jun Cho, Son Kyo Hwang, Byung Mok Kim, Seo Yeon Kwon
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Publication number: 20130049565Abstract: A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.Type: ApplicationFiled: August 27, 2012Publication date: February 28, 2013Inventors: Su Jung Jung, Byung Mok Kim, Young Jun Cho, Seo Yeon Kwon
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Publication number: 20130049563Abstract: Disclosed is a light emitting device package. The light emitting device includes a package body having a cavity defined by a sidewall and a bottom surface, a light emitting device disposed in the cavity, a radiator inserted into the package body and disposed below the light emitting device, and a second electrode pattern disposed around the radiator and electrically connected to the light emitting device via wire bonding. The second electrode pattern includes a first region to which a wire is bonded, and a second region connected to the first region, and a width of the first region differs from a width of the second region.Type: ApplicationFiled: August 21, 2012Publication date: February 28, 2013Inventors: Byung Mok Kim, Young Jun Cho, Yon Tae Moon, Su Jung Jung, Seo Yeon Kwon, Son Kyo Hwang
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Publication number: 20130049564Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.Type: ApplicationFiled: August 22, 2012Publication date: February 28, 2013Inventors: Su Jung JUNG, Yon Tae MOON, Young Jun CHO, Son Kyo HWANG, Byung Mok KIM, Seo Yeon KWON
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Patent number: RE48858Abstract: Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.Type: GrantFiled: April 25, 2019Date of Patent: December 21, 2021Assignee: SUZHOU LEKIN SEMICONDUCTOR CO., LTD.Inventors: Su Jung Jung, Yon Tae Moon, Young Jun Cho, Son Kyo Hwang, Byung Mok Kim, Seo Yeon Kwon