Abstract: A sensing device includes a fixed member, a rotation member disposed at both ends of the fixed member, a camera installed on the fixed member, and respective radar units installed on the rotation members, where the respective radar units are configured to sense respective objects at edges of a viewing angle of the camera and respective objects outside of the viewing angle of the camera.

Abstract: An antenna apparatus includes a substrate, a transmission antenna disposed on the substrate, and an auxiliary substrate disposed in an upper portion of the transmission antenna and having a radio wave guide unit having a horn shape. The auxiliary substrate further includes an insulator and a second metal pattern disposed in the radio wave guide unit on the insulator.

Abstract: An antenna apparatus includes a substrate, a transmission antenna disposed on the substrate, and an auxiliary substrate disposed in an upper portion of the transmission antenna and having a radio wave guide unit having a horn shape. The auxiliary substrate further includes an insulator and a second metal pattern disposed in the radio wave guide unit on the insulator.

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.

Abstract: The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.

Abstract: An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

Abstract: Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.

Abstract: A sensor package may allow a fluid to flow smoothly to thus increase response characteristics. The sensor package may include: a terminal part; at least one electronic element electrically connected to the terminal part through a bonding wire; and a molded part encapsulating the bonding wire and the electronic element and including a sensing portion partially exposing the electronic element and at least one guide portion guiding an ambient fluid to the sensing portion.

Abstract: An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

Abstract: Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.

Abstract: Embodiments of the invention provide a method of manufacturing a printed circuit board. The method includes the steps of mounting a strip substrate on a fixing member, and separating the strip substrate into unit substrates by performing a singulation process. The method further includes the steps of attaching solder balls onto the unit substrates using a mask disposed on the unit substrates, and fixing the solder balls on the unit substrates by performing a reflow process.

Abstract: Disclosed herein is a 3D power module package, including: a power converting unit packaged to include a heat radiating substrate, a power device connected to the heat radiating substrate, and a lead frame; a controlling unit packaged to include a controlling unit substrate and IC and controlling devices mounted on an upper portion of the controlling unit substrate; and an electrical connecting unit electrically connecting the packaged power converting unit and the packaged controlling unit.

Abstract: Disclosed herein is a semiconductor package. The semiconductor package includes: semiconductor elements, a first heat dissipation substrate formed under the semiconductor elements, a first lead frame electrically connecting the lower portions of the semiconductor elements to an upper portion of the first heat dissipation substrate, a second heat dissipation substrate formed over the semiconductor elements, and a second lead frame having a protrusion formed to be protruded from a lower surface thereof and electrically connecting the upper portions of the semiconductor elements to a lower portion of the second heat dissipation substrate.

Abstract: Embodiments of the invention provide a method of manufacturing a printed circuit board, including: mounting a strip substrate on a fixing member; separating the strip substrate into unit substrates by performing a singulation process; attaching solder balls onto the unit substrates using a jig; and fixing the solder balls on the unit substrates by performing a reflow process. The method of manufacturing a printed circuit board is advantageous in that the solder balls can be accurately formed at the predetermined positions of the strip substrate because they are attached to the unit substrates after the warpage of the strip substrate was reduced by a singulation process.

Abstract: Embodiments of the invention provide a heat-dissipating substrate and a fabricating method of the heat-dissipating substrate. According to various embodiments, the heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

Abstract: Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.

Abstract: Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.

Abstract: Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate including an insulation layer formed thereon, and forming a circuit layer and electrode pads on the conductive substrate using a plating process. The method further includes selectively plating the circuit layer, in which the optical element is to be mounted, with a conductor to such a thickness that the optical element is buried, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon.

Abstract: Disclosed herein is a method of manufacturing a package substrate for optical elements. The method includes the steps of providing a conductive substrate, forming a cavity space in the conductive substrate, and forming an insulation layer on the conductive substrate. The method further includes the steps of forming a circuit layer and electrode pads on the conductive substrate using a plating process, forming a cavity space including a lower part and a side wall in the circuit layer, and mounting an optical element in the cavity space and then applying a fluorescent resin layer thereon.

Abstract: Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.